JPWO2012132729A1 - 光電変換装置及びその製造方法 - Google Patents
光電変換装置及びその製造方法 Download PDFInfo
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- 238000006243 chemical reaction Methods 0.000 title claims abstract description 66
- 238000004519 manufacturing process Methods 0.000 title claims description 31
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- 239000000758 substrate Substances 0.000 claims abstract description 36
- 239000004065 semiconductor Substances 0.000 claims description 67
- 238000000034 method Methods 0.000 claims description 25
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 239000010409 thin film Substances 0.000 claims description 9
- 238000009713 electroplating Methods 0.000 claims description 7
- 238000010030 laminating Methods 0.000 claims description 5
- 238000007747 plating Methods 0.000 claims description 3
- 229910021421 monocrystalline silicon Inorganic materials 0.000 abstract description 22
- 239000010410 layer Substances 0.000 description 397
- 229910021417 amorphous silicon Inorganic materials 0.000 description 61
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 27
- 238000005530 etching Methods 0.000 description 25
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- 229910052581 Si3N4 Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 6
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 5
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 5
- 238000007650 screen-printing Methods 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- 239000000969 carrier Substances 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000002161 passivation Methods 0.000 description 3
- 229910000077 silane Inorganic materials 0.000 description 3
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000002019 doping agent Substances 0.000 description 2
- 230000012447 hatching Effects 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 2
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 238000010248 power generation Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- ZOCHARZZJNPSEU-UHFFFAOYSA-N diboron Chemical compound B#B ZOCHARZZJNPSEU-UHFFFAOYSA-N 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
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Abstract
Description
図11に示すように、IP層26の重なり領域26*をエッチングして除去し、重なり領域26*に分離間隙60を形成する。具体的には、第1の導電層14及び第2の導電層15のエッチング終了後、例えば、レジスト膜を除去し、第1導電層43,53及び第2導電層44,54をマスクとして、露出しているIP層26をエッチングする。IP層26のエッチングは、上記のように、高濃度のNaOH水溶液や熱アルカリを用いて行うことができる。
Claims (10)
- 結晶系半導体基板と、
前記結晶系半導体基板の一方の面上に積層された第1非晶質半導体層と、
前記結晶系半導体基板の前記面上の前記第1非晶質半導体層が積層されていない領域に積層されると共に、前記第1非晶質半導体層が積層された領域に重なった重なり領域を有するように積層された前記第1非晶質半導体層とは逆の導電型の層を含む第2非晶質半導体層と、
前記第1非晶質半導体層と電気的に接続され、前記第2非晶質半導体層の前記重なり領域上に亘って形成された第1電極と、
前記第1電極から離間して、前記第2非晶質半導体層と電気的に接続されるように形成された第2電極と、
を備え、
前記第2非晶質半導体層は、前記第1電極が形成された領域と前記第2電極が形成された領域との間に、分離間隙又は厚みが他の領域よりも薄くなった薄膜領域を有する光電変換装置。 - 請求項1に記載の光電変換装置において、
前記第2非晶質半導体層は、絶縁層を介して前記第1非晶質半導体層上に積層されている光電変換装置。 - 請求項1又は2に記載の光電変換装置において、
前記重なり領域上に、前記第1電極と前記第2電極とを離間する分離溝が形成されている光電変換装置。 - 請求項3に記載の光電変換装置において、
前記分離間隙又は前記薄膜領域は、前記分離溝に沿って形成されている光電変換装置。 - 結晶系半導体基板の一方の面上に、第1非晶質半導体層を積層する工程と、
前記結晶系半導体基板の前記面上の前記第1非晶質半導体層が積層されていない領域、及び前記第1非晶質半導体層が積層された領域の一部に亘って、前記第1非晶質半導体層とは逆の導電型の層を含む第2非晶質半導体層を積層する工程と、
前記第1非晶質半導体層上、及び前記第1非晶質半導体層上に重なった前記第2非晶質半導体層の重なり領域上に亘って、第1電極を形成すると共に、前記第1電極から離間した前記第2非晶質半導体層上に、第2電極を形成する電極形成工程と、
前記第1電極と前記第2電極との間に存在する前記第2非晶質半導体層の少なくとも一部を除去する除去工程と、
を含む光電変換装置の製造方法。 - 請求項5に記載の光電変換装置の製造方法において、
前記第1非晶質半導体層上の一部に絶縁層を積層する工程をさらに含み、
前記第2非晶質半導体層を積層する工程では、前記絶縁層を介して前記第1非晶質半導体層上に前記第2非晶質半導体層を積層する光電変換装置の製造方法。 - 請求項5又は6に記載の光電変換装置の製造方法において、
前記電極形成工程は、
前記第1非晶質半導体層上及び前記第2非晶質半導体層上に、前記第1電極及び前記第2電極を構成する少なくとも1層の導電層を形成する工程と、
前記第2型非晶質半導体層の前記重なり領域上で前記導電層を部分的に除去して、前記第1電極を構成する第1電極導電層と、前記第2電極を構成する第2電極導電層とに分離する工程と、
を含む光電変換装置の製造方法。 - 請求項7に記載の光電変換装置の製造方法において、
前記除去工程では、前記第1電極導電層及び前記第2電極導電層をマスクとして、露出した前記第2非晶質半導体層の前記重なり領域の少なくとも一部を除去する光電変換装置の製造方法。 - 請求項8に記載の光電変換装置の製造方法において、
前記除去工程では、前記第1電極導電層と前記第2電極導電層との間に沿って、露出した前記第2非晶質半導体層の前記重なり領域を除去する光電変換装置の製造方法。 - 請求項8又は9に記載の光電変換装置の製造方法において、
前記電極形成工程は、前記除去工程後に、前記第1電極導電層及び前記第2電極導電層をそれぞれシードとする電解めっきにより、前記各シード上にそれぞれ金属めっき層を形成する工程をさらに含む光電変換装置の製造方法。
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