CN110896107A - 一种双面发电的背接触异质结太阳能电池及其制作方法 - Google Patents

一种双面发电的背接触异质结太阳能电池及其制作方法 Download PDF

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CN110896107A
CN110896107A CN201811065843.4A CN201811065843A CN110896107A CN 110896107 A CN110896107 A CN 110896107A CN 201811065843 A CN201811065843 A CN 201811065843A CN 110896107 A CN110896107 A CN 110896107A
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黄巍辉
张宇
张超华
谢志刚
王树林
林朝晖
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Goldstone Fujian Energy Co Ltd
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Abstract

本发明公开了一种双面发电的背接触异质结太阳能电池及其制作方法,其结构包括双面制绒的N型或P型单晶硅片,依次设在单晶硅片正面上的钝化膜层和透明减反层,交叉设置在单晶硅片背面上的第一本征非晶硅层和第二本征非晶硅层,设在第一本征非晶硅层上的P型非晶硅层和第二本征非晶硅层上的N型非晶硅层,设在P型非晶硅层和N型非晶硅层之间交叠区的第一透明绝缘层,设在P型非晶硅层和N型非晶硅层上的透明导电层,依次设在透明导电层上的金属导电层、金属电极及其保护层。本发明具有双面受光发电的优异特性,正面受光面积达100%,背面受光面积可大于50%,提高背接触太阳电池的实际发电功率,制作方法简洁易控,工艺简单,易于大规模量产的实现。

Description

一种双面发电的背接触异质结太阳能电池及其制作方法
技术领域
本发明涉及太阳能电池技术领域,尤其涉及一种双面发电的背接触异质结太阳能电池及其制作方法。
背景技术
背接触太阳能电池是一种将正负电极均设置在电池片背面的太阳能电池。因其正负电极均在电池片背面,电池片正面无任何电极遮挡光线,可以达到最大的光吸收面积,有效的提高太阳能电池效率,备受业界关注。
双面发电太阳能电池能够实现正面和背面同时受光,增加了背面环境反射光线的利用,有效提高太阳电池组件的实际发电功率约10-20%。采用双面发电太阳能电池制作的组件,被广泛应用于戈壁、雪地、水面及其他增设地面反射的环境,充分利用环境的高反射特点,增加组件背面光线的利用,对提高太阳能电站的实际发电功率具有显著效果。
然而目前传统的背接触太阳能电池由于背面结构限制,典型的如日本三洋公司公开的背接触太阳能电池结构(日本专利号P2008-40715),采用激光方式分隔电极,虽加工方式简洁,但同时因背面大面积电极覆盖,无法实现背面光线的吸收。有的背接触太阳能电池的交叠区结构涉及多层膜层交叠(中国专利号201680031268.9),无法实现良好的透光结构,不能有效的利用背面的反射光线,对于电池效率的进一步提高及背接触太阳能电池制作的组件应用范围有较大的局限。
而且传统的背接触太阳能电池涉及多次隔离、掺杂处理,工艺条件苛刻,制程工序冗长,不利于大规模量产的实现和成本的降低。
发明内容
针对上述问题,本发明提供了一种双面发电的背接触异质结太阳能电池及其制作方法,解决背接触太阳能电池不能有效利用背面反射光线的问题,实现一种可双面发电的背接触异质结太阳能电池结构;解决背接触太阳能电池多次隔离、掺杂处理,工艺条件苛刻、制程工序冗长的问题,实现一种工艺简洁易控,适于大规模量产的实现的一种双面发电的异质结太阳能电池制作方法。
为解决上述技术问题,本发明所采用的技术方案是:一种双面发电的背接触异质结太阳能电池,其结构包括双面制绒的N型或P型单晶硅片,依次设在单晶硅片正面上的钝化膜层和透明减反层,交叉设置在单晶硅片背面上的第一本征非晶硅层和第二本征非晶硅层,设在第一本征非晶硅层上的P型非晶硅层和第二本征非晶硅层上的N型非晶硅层,设在P型非晶硅层和N型非晶硅层之间交叠区的第一透明绝缘层,设在P型非晶硅层和N型非晶硅层上的透明导电层,依次设在透明导电层上的金属导电层、金属电极及其保护层,所述金属电极及其保护层占所述单晶硅片背面面积的10%-60%,则单晶硅片背面裸露的透明导电层和第一透明绝缘层的总面积占所述单晶硅片背面面积的90%-40%,对应的有效光吸收面积占硅片面积的90%-40%。
进一步的,所述第一透明绝缘层具有透光性,允许光线透射至P型非晶硅层、第一本征非晶硅层和单晶硅内。
进一步的,所述透明导电层具有透光性,允许光线透射至P型非晶硅层、N型非晶硅层、第一本征非晶硅层、第二本征非晶硅层和单晶硅内。
进一步的,所述钝化膜层和透明减反层具有透光性,允许光线透射至单晶硅内。
本发明还提供了一种所述双面发电的背接触异质结太阳能电池的制作方法,所述方法包括如下步骤:在双面制绒清洗的单晶硅片背面沉积第一本征非晶硅层、P型非晶硅层和第一透明绝缘层;对已沉积的第一透明绝缘层、P型非晶硅层和第一本征非晶硅层选择性开口,裸露底层单晶硅片,并对单晶硅片重清洗,在第一透明绝缘层和单晶硅片上沉积第二本征非晶硅层、N型非晶硅层和保护非晶硅膜层;在双面制绒清洗的单晶硅片正面沉积钝化膜层和透明减反层;对保护非晶硅膜层、N型非晶硅层、第二本征非晶硅层和第一绝缘层选择性开口,裸露底层P型非晶硅层,去除保护非晶硅膜层使得N型非晶硅层裸露;在P型非晶硅层、N型非晶硅层和第一透明绝缘层上沉积透明导电层、金属导电层;对金属导电层和透明导电层选择性开口,使P型非晶硅层和N型非晶层之间绝缘隔离;在已绝缘隔离的金属导电层上制作金属电极及其保护层,并去除金属电极区域以外的金属导电层。
进一步的,所述第一本征非晶硅层、第二本征非晶硅层、正面钝化层、P型非晶硅层、N型非晶硅层采用等离子体增强化学气相沉积制作,沉积温度为160℃-300℃,所述正面钝化层为本征非晶硅或本征非晶硅和掺杂型非晶硅/多晶硅的组合。
进一步的,所述第一透明绝缘层、透明减反层和保护非晶硅膜层采用等离子体增强化学气相沉积或磁控溅射沉积制作,沉积温度为160-400℃,所述第一透明绝缘层、透明减反层和保护非晶硅膜层为氧化硅、氮化硅、氮氧化硅、碳化硅中的至少一种,其中保护非晶硅膜层还包括一种用PVD方法制作的透明导电膜层。
进一步的,所述透明导电层和金属导电层采用磁控溅射沉积,沉积温度为100℃-220℃,所述透明导电层为氧化铟锡、掺氟氧化锡、掺铝氧化锌、掺硼氧化锌、掺钨氧化铟、石墨烯中的至少一种,所述金属导电层为Ag、Cu、Al、Ni、Ti、TiN、Sn、Zn或NiCr中的至少一种。
进一步的,所述金属电极及其保护层采用电沉积方法制作,先采用阻挡材料形成保护图形,再采用电沉积的方式形成金属电极及其保护层,最后用碱性溶液和蚀刻溶液中的至少一种,一次性或逐层去除阻挡材料和金属电极区域以外的金属导电层,所述金属电极及其保护层为Ag、Cu、Al、Zn、Sn、Cr、Ni中的至少一种。
进一步的,所述选择性开口的方法是先采用阻挡材料形成保护图形,然后采用刻蚀浆料、刻蚀溶液和碱性溶液中的至少一种,一次性或逐层去除保护图形以外区域的第一透明绝缘层、P型非晶硅层、第一本征非晶硅层、保护非晶硅膜层、N型非晶硅层、第二本征非晶硅层、金属导电层和透明导电层,最后用碱性溶液去除阻挡材料。
进一步的,所述蚀刻浆料为酸性蚀刻膏,所述蚀刻溶液包括氧化剂、氢氟酸、盐酸、硫酸、磷酸、臭氧、双氧水、银离子、锌离子、铜离子、铁离子、铝离子和过硫酸根离子中至少一种,所述碱性溶液中包括氢氧化钾、氢氧化钠、氨水、双氧水、银离子、锌离子、铜离子、铁离子、铝离子、表面活性剂中的至少一种。
进一步的,所述阻挡材料为树脂、光阻、保护油墨中至少一种,所述形成保护图形的方法为丝网印刷、移印、喷涂或滚涂。
由上述对本发明结构的描述可知,和现有技术相比,本发明具有如下优点:
1、本发明电池正面无电极阻挡,受光面积为硅片面积的100%,电池背面采用透明导电层和透明绝缘层设置可透光的膜层结构,允许光线透射至P型非晶硅层、N型非晶硅层、第一本征非晶硅层、第二本征非晶硅层和单晶硅内,其有效的受光面积为硅片面积的90%-60%,具有双面受光发电的优异特性,进一步提高背接触太阳电池的实际发电功率,对背接触电池应用于双面发电组件和电站具有重要的意义。
2、本发明制作方法采用湿法处理工艺,采用的蚀刻浆料、蚀刻溶液和碱性溶液可一次性处理多个膜层,或逐层处理多个膜层,具有工艺简洁和有良好的可控性的特点,所需设备和材料成本低廉,工艺简单,易于大规模量产的实现。
附图说明
构成本申请的一部分的附图用来提供对本发明的进一步理解,本发明的示意性实施例及其说明用于解释本发明,并不构成对本发明的不当限定。在附图中:
图1为本发明一种双面发电的背接触异质结太阳能电池的结构示意图;
图2为本发明一种双面发电的背接触异质结太阳能电池背面受光结构的局部放大图;
图3为本发明一种双面发电的背接触异质结太阳能电池制作方法的实施例步骤S101至S105的结构示意图;
图4为本发明一种双面发电的背接触异质结太阳能电池制作方法的实施例步骤S106至S110的结构示意图。
具体实施方式
为了使本发明的目的、技术方案及优点更加清楚明白,以下结合附图及实施例,对本发明进行进一步详细说明。应当理解,此处所描述的具体实施例仅仅用以解释本发明,并不用于限定本发明。
参考图1、图2,一种双面发电的背接触异质结太阳能电池,其结构包括双面制绒的N型或P型单晶硅片1,依次设在单晶硅片1正面上的钝化膜层5和透明减反层6,交叉设置在单晶硅片1背面上的第一本征非晶硅层2和第二本征非晶硅层8,设在第一本征非晶硅层2上的P型非晶硅层3和第二本征非晶硅层8上的N型非晶硅层9,设在P型非晶硅层3和N型非晶硅层9之间交叠区的第一透明绝缘层4,设在P型非晶硅层3和N型非晶硅层9上的透明导电层12,依次设在透明导电层12上的金属导电层13、金属电极16及其保护层17。
所述设在单晶硅片1正面的钝化膜层5和透明减反层6,具有良好的透光性,允许光线透射至单晶硅内,所述设在P型非晶硅层3和N型非晶硅层9之间交叠区的第一透明绝缘层4和设在P型非晶硅层3和N型非晶硅层9上的透明导电层12,具有良好的透光性,允许光线透射至P型非晶硅层3、N型非晶硅层9、第一本征非晶硅层2、第二本征非晶硅层8和单晶硅层1内,所述金属电极16及其保护层17占所述单晶硅片1背面面积的10%-60%,则单晶硅片背面裸露的透明导电层12和第一透明绝缘层4的总面积占所述单晶硅片1背面面积的90%-40%,对应的有效光吸收面积占硅片面积的90%-40%,具有背面受光发电的优异特性。
本发明电池正面无电极阻挡,受光面积为硅片面积的100%,电池背面采用透明导电层和透明绝缘层设置可透光的膜层结构,允许光线透射至P型非晶硅层、N型非晶硅层、第一本征非晶硅层、第二本征非晶硅层和单晶硅内,其有效的受光面积为硅片面积的90%-60%,具有双面受光发电的优异特性,进一步提高背接触太阳电池的实际发电功率,对背接触电池应用于双面发电组件和电站具有重要的意义。
一种所述双面发电的背接触异质结太阳能电池的制作方法,所述方法包括如下步骤:
在双面制绒清洗的单晶硅片背面沉积第一本征非晶硅层、P型非晶硅层和第一透明绝缘层;
对已沉积的第一透明绝缘层、P型非晶硅层和第一本征非晶硅层选择性开口,裸露底层单晶硅,并对硅片重清洗,在第一透明绝缘层和单晶硅片上沉积第二本征非晶硅层、N型非晶硅层和保护非晶硅膜层;
在双面制绒清洗的单晶硅片正面沉积钝化膜层和透明减反层;
对保护非晶硅膜层、N型非晶硅层、第二本征非晶硅层和第一绝缘层选择性开口,裸露底层P型非晶硅层,
去除保护非晶硅膜层使得N型非晶硅层裸露;
在P型非晶硅层、N型非晶硅层和第一透明绝缘层上沉积透明导电层、金属导电层;
对金属导电层和透明导电层选择性开口,使P型非晶硅层和N型非晶层之间绝缘隔离;
在已绝缘隔离的金属导电层上制作金属电极及其保护层,并去除金属电极区域以外的金属导电层。
所述第一本征非晶硅层、第二本征非晶硅层、正面钝化层、P型非晶硅层、N型非晶硅层采用等离子体增强化学气相沉积制作,沉积温度为160℃-300℃,所述正面钝化层为本征非晶硅或本征非晶硅和掺杂型非晶硅/多晶硅的组合。
所述第一透明绝缘层、透明减反层和保护非晶硅膜层采用等离子体增强化学气相沉积或磁控溅射沉积制作,沉积温度为160-400℃,所述第一透明绝缘层、透明减反层和保护非晶硅膜层为氧化硅、氮化硅、氮氧化硅、碳化硅中的至少一种,其中保护非晶硅膜层还包括一种用PVD方法制作的透明导电膜层。
所述透明导电层和金属导电层采用磁控溅射沉积,沉积温度为100℃-220℃,所述透明导电层为氧化铟锡、掺氟氧化锡、掺铝氧化锌、掺硼氧化锌、掺钨氧化铟、石墨烯中的至少一种,所述金属导电层为Ag、Cu、Al、Ni、Ti、TiN、Sn、Zn或NiCr中的至少一种。
进一步的,所述金属电极及其保护层采用电沉积方法制作,先采用阻挡材料形成保护图形,再采用电沉积的方式形成金属电极及其保护层,最后用碱性溶液和蚀刻溶液中的至少一种,一次性或逐层去除阻挡材料和金属电极区域以外的金属导电层,所述金属电极及其保护层为Ag、Cu、Al、Zn、Sn、Cr、Ni中的至少一种。
所述选择性开口的方法是先采用阻挡材料形成保护图形,然后采用刻蚀浆料、刻蚀溶液和碱性溶液中的至少一种,一次性或逐层去除保护图形以外区域的第一透明绝缘层、P型非晶硅层、第一本征非晶硅层、保护非晶硅膜层、N型非晶硅层、第二本征非晶硅层、金属导电层和透明导电层,最后用碱性溶液去除阻挡材料;所述蚀刻浆料为酸性蚀刻膏,所述蚀刻溶液包括氧化剂、氢氟酸、盐酸、硫酸、磷酸、臭氧、双氧水、银离子、锌离子、铜离子、铁离子、铝离子和过硫酸根离子中至少一种,所述碱性溶液中包括氢氧化钾、氢氧化钠、氨水、双氧水、银离子、锌离子、铜离子、铁离子、铝离子、表面活性剂中的至少一种;所述阻挡材料为树脂、光阻、保护油墨中至少一种,所述形成保护图形的方法为丝网印刷、移印、喷涂或滚涂。
本发明制作方法采用湿法处理工艺,采用的蚀刻浆料、蚀刻溶液和碱性溶液可一次性处理多个膜层,或逐层处理多个膜层,具有工艺简洁和有良好的可控性的特点,所需设备和材料成本低廉,工艺简单,易于大规模量产的实现。
实施例
参考图3、图4,一种所述双面发电的背接触异质结太阳能电池的制作方法,所述方法包括如下步骤:
S101、准备一单晶硅片1,对单晶硅片1进行双面制绒;
S102、在双面制绒清洗的单晶硅片1的其中一面上沉积第一本征非晶硅层2、P型非晶硅层3和第一透明绝缘层4,另一面沉积一层或多层钝化膜层组合5和透明减反膜6,在第一透明绝缘层4上用阻挡材料形成N型区图形7;
S103、用腐蚀浆料、蚀刻溶液和碱性溶液中的至少一种,一次性或逐层去除裸露的第一透明绝缘层4、P型非晶硅层3、第一本征非晶硅2和N型区图形7阻挡材料,裸露底层单晶硅片1;
S104、对单晶硅片1重清洗后,在第一透明绝缘层4和单晶硅片1上沉积第二本征非晶硅层8、N型非晶硅层9和保护非晶硅膜层10,在保护非晶硅膜层10上用阻挡材料形成P型区图形11;
S105、用腐蚀浆料和蚀刻溶液中的至少一种,一次性或逐层去除裸露的保护非晶硅膜层10、N型非晶硅层9和第二本征非晶硅层8,然后用碱性溶液去除阻挡材料,最后用蚀刻溶液去除裸露的第一绝透明缘层4和剩余的保护非晶硅膜层10;
S106、在以上P型非晶硅层3和N型非晶硅层9上沉积透明导电层12和金属导电层13,在金属导电层13上用阻挡材料形成绝缘隔离图形14;
S107、用腐蚀浆料和蚀刻溶液中的至少一种,一次性或逐层去除裸露的金属导电层13和透明导电层12;用碱性溶液去除阻挡材料和裸露的N型非晶硅层9、第二本征非晶硅层8,使第一透明绝缘层4裸露,以实现该区域的透光能力;
S108、在金属导电层13上用阻挡材料形成背面电极图形15;
S109、用电沉积方式形成金属电极16及其保护层17;
S110、用碱性溶液和蚀刻溶液中的至少一种,去除阻挡材料和电极区域以外的金属导电层13,使背面除金属电极16以外的N型区和P型区上的透明导电层12裸露,以实现该区域的透光能力。
以上所述仅为本发明的较佳实施例而已,并不用以限制本发明,凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等,均应包含在本发明的保护范围之内。

Claims (12)

1.一种双面发电的背接触异质结太阳能电池,其特征在于:其包括双面制绒的N型或P型单晶硅片,依次设在单晶硅片正面上的钝化膜层和透明减反层,交叉设置在单晶硅片背面上的第一本征非晶硅层和第二本征非晶硅层,设在第一本征非晶硅层上的P型非晶硅层和第二本征非晶硅层上的N型非晶硅层,设在P型非晶硅层和N型非晶硅层之间交叠区的第一透明绝缘层,设在P型非晶硅层和N型非晶硅层上的透明导电层,依次设在透明导电层上的金属导电层、金属电极及其保护层;所述金属电极及其保护层占所述单晶硅片背面面积的10%-60%,则单晶硅片背面裸露的透明导电层和第一透明绝缘层的总面积占所述单晶硅片背面面积的90%-40%,对应的有效光吸收面积占硅片面积的90%-40%。
2.根据权利要求1所述一种双面发电的背接触异质结太阳能电池,其特征在于:所述第一透明绝缘层具有透光性,允许光线透射至P型非晶硅层、第一本征非晶硅层和单晶硅内。
3.根据权利要求1所述一种双面发电的背接触异质结太阳能电池,其特征在于:所述透明导电层具有透光性,允许光线透射至P型非晶硅层、N型非晶硅层、第一本征非晶硅层、第二本征非晶硅层和单晶硅内。
4.根据权利要求1所述一种双面发电的背接触异质结太阳能电池,其特征在于:所述钝化膜层和透明减反层具有透光性,允许光线透射至单晶硅内。
5.一种如权利要求1所述双面发电的背接触异质结太阳能电池的制作方法,其特征在于:所述方法包括如下步骤:
在双面制绒清洗的单晶硅片背面沉积第一本征非晶硅层、P型非晶硅层和第一透明绝缘层;
对已沉积的第一透明绝缘层、P型非晶硅层和第一本征非晶硅层选择性开口,裸露底层单晶硅片,并对单晶硅片重清洗,在第一透明绝缘层和单晶硅片上沉积第二本征非晶硅层、N型非晶硅层和保护非晶硅膜层;
在双面制绒清洗的单晶硅片正面沉积钝化膜层和透明减反层;
对保护非晶硅膜层、N型非晶硅层、第二本征非晶硅层和第一绝缘层选择性开口,裸露底层P型非晶硅层,
去除保护非晶硅膜层使得N型非晶硅层裸露;
在P型非晶硅层、N型非晶硅层和第一透明绝缘层上沉积透明导电层、金属导电层;
对金属导电层和透明导电层选择性开口,使P型非晶硅层和N型非晶层之间绝缘隔离;
在已绝缘隔离的金属导电层上制作金属电极及其保护层,并去除金属电极区域以外的金属导电层。
6.根据权利要求5所述一种双面发电的背接触异质结太阳能电池的制作方法,其特征在于:所述第一本征非晶硅层、第二本征非晶硅层、正面钝化层、P型非晶硅层、N型非晶硅层采用等离子体增强化学气相沉积制作,沉积温度为160℃-300℃,所述正面钝化层为本征非晶硅或本征非晶硅和掺杂型非晶硅/多晶硅的组合。
7.根据权利要求5所述一种双面发电的背接触异质结太阳能电池的制作方法,其特征在于:所述第一透明绝缘层、透明减反层和保护非晶硅膜层采用等离子体增强化学气相沉积或磁控溅射沉积制作,沉积温度为160-400℃,所述第一透明绝缘层、透明减反层和保护非晶硅膜层为氧化硅、氮化硅、氮氧化硅、碳化硅中的至少一种,其中保护非晶硅膜层还包括一种用PVD方法制作的透明导电膜层。
8.根据权利要求5所述一种双面发电的背接触异质结太阳能电池的制作方法,其特征在于:所述透明导电层和金属导电层采用磁控溅射沉积,沉积温度为100℃-220℃,所述透明导电层为氧化铟锡、掺氟氧化锡、掺铝氧化锌、掺硼氧化锌、掺钨氧化铟、石墨烯中的至少一种,所述金属导电层为Ag、Cu、Al、Ni、Ti、TiN、Sn、Zn或NiCr中的至少一种。
9.根据权利要求5所述一种双面发电的背接触异质结太阳能电池的制作方法,其特征在于:所述金属电极及其保护层采用电沉积方法制作,先采用阻挡材料形成保护图形,再采用电沉积的方式形成金属电极及其保护层,最后用碱性溶液和蚀刻溶液中的至少一种,一次性或逐层去除阻挡材料和金属电极区域以外的金属导电层,所述金属电极及其保护层为Ag、Cu、Al、Zn、Sn、Cr、Ni中的至少一种。
10.根据权利要求5所述一种双面发电的背接触异质结太阳能电池的制作方法,其特征在于:所述选择性开口的方法是先采用阻挡材料形成保护图形,然后采用刻蚀浆料、刻蚀溶液和碱性溶液中的至少一种,一次性或逐层去除保护图形以外区域的第一透明绝缘层、P型非晶硅层、第一本征非晶硅层、保护非晶硅膜层、N型非晶硅层、第二本征非晶硅层、金属导电层和透明导电层,最后用碱性溶液去除阻挡材料。
11.根据权利要求10所述一种双面发电的背接触异质结太阳能电池的制作方法,其特征在于:所述蚀刻浆料为酸性蚀刻膏,所述蚀刻溶液包括氧化剂、氢氟酸、盐酸、硫酸、磷酸、臭氧、双氧水、银离子、锌离子、铜离子、铁离子、铝离子和过硫酸根离子中至少一种,所述碱性溶液中包括氢氧化钾、氢氧化钠、氨水、双氧水、银离子、锌离子、铜离子、铁离子、铝离子、表面活性剂中的至少一种。
12.根据权利要求9或10所述一种双面发电的背接触异质结太阳能电池的制作方法,其特征在于:所述阻挡材料为树脂、光阻、保护油墨中至少一种,所述形成保护图形的方法为丝网印刷、移印、喷涂或滚涂。
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115044906A (zh) * 2022-04-29 2022-09-13 福建金石能源有限公司 一种腐蚀溶液及其背接触异质结太阳能电池制造方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101777603A (zh) * 2009-01-08 2010-07-14 北京北方微电子基地设备工艺研究中心有限责任公司 背接触太阳能电池的制造方法
CN102623517A (zh) * 2012-04-11 2012-08-01 中国科学院苏州纳米技术与纳米仿生研究所 一种背接触型晶体硅太阳能电池及其制作方法
CN103460394A (zh) * 2011-03-28 2013-12-18 三洋电机株式会社 光电转换装置及其制造方法
CN104412394A (zh) * 2012-06-29 2015-03-11 洛桑联邦理工学院 太阳能电池
CN105185849A (zh) * 2015-07-14 2015-12-23 苏州阿特斯阳光电力科技有限公司 一种背接触太阳能电池及其制备方法
JP2017174924A (ja) * 2016-03-23 2017-09-28 シャープ株式会社 光電変換装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101777603A (zh) * 2009-01-08 2010-07-14 北京北方微电子基地设备工艺研究中心有限责任公司 背接触太阳能电池的制造方法
CN103460394A (zh) * 2011-03-28 2013-12-18 三洋电机株式会社 光电转换装置及其制造方法
CN102623517A (zh) * 2012-04-11 2012-08-01 中国科学院苏州纳米技术与纳米仿生研究所 一种背接触型晶体硅太阳能电池及其制作方法
CN104412394A (zh) * 2012-06-29 2015-03-11 洛桑联邦理工学院 太阳能电池
CN105185849A (zh) * 2015-07-14 2015-12-23 苏州阿特斯阳光电力科技有限公司 一种背接触太阳能电池及其制备方法
JP2017174924A (ja) * 2016-03-23 2017-09-28 シャープ株式会社 光電変換装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115044906A (zh) * 2022-04-29 2022-09-13 福建金石能源有限公司 一种腐蚀溶液及其背接触异质结太阳能电池制造方法

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