JPWO2009104615A1 - 銅合金材 - Google Patents
銅合金材 Download PDFInfo
- Publication number
- JPWO2009104615A1 JPWO2009104615A1 JP2009554332A JP2009554332A JPWO2009104615A1 JP WO2009104615 A1 JPWO2009104615 A1 JP WO2009104615A1 JP 2009554332 A JP2009554332 A JP 2009554332A JP 2009554332 A JP2009554332 A JP 2009554332A JP WO2009104615 A1 JPWO2009104615 A1 JP WO2009104615A1
- Authority
- JP
- Japan
- Prior art keywords
- mass
- copper alloy
- alloy material
- strength
- compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008036694 | 2008-02-18 | ||
JP2008036694 | 2008-02-18 | ||
PCT/JP2009/052718 WO2009104615A1 (ja) | 2008-02-18 | 2009-02-17 | 銅合金材 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2009104615A1 true JPWO2009104615A1 (ja) | 2011-06-23 |
Family
ID=40985494
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009554332A Pending JPWO2009104615A1 (ja) | 2008-02-18 | 2009-02-17 | 銅合金材 |
Country Status (5)
Country | Link |
---|---|
US (2) | US20100310413A1 (zh) |
EP (1) | EP2256219A4 (zh) |
JP (1) | JPWO2009104615A1 (zh) |
CN (1) | CN101946014A (zh) |
WO (1) | WO2009104615A1 (zh) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5654571B2 (ja) * | 2010-04-02 | 2015-01-14 | Jx日鉱日石金属株式会社 | 電子材料用Cu−Ni−Si系合金 |
EP2557187A1 (en) * | 2010-04-07 | 2013-02-13 | Furukawa Electric Co., Ltd. | Wrought copper alloy, copper alloy part, and process for producing wrought copper alloy |
EP2592164B1 (en) * | 2010-07-07 | 2016-07-06 | Mitsubishi Shindoh Co., Ltd. | Cu-ni-si copper alloy plate with excellent deep-draw characteristics and production method thereof |
JP5773929B2 (ja) * | 2012-03-28 | 2015-09-02 | 株式会社神戸製鋼所 | 曲げ加工性及び耐応力緩和特性に優れる電気電子部品用銅合金板 |
CN102703754B (zh) * | 2012-06-05 | 2014-03-26 | 太原理工大学 | 一种Cu-Ni-Si基合金及其制备方法 |
JP5874827B2 (ja) * | 2012-06-19 | 2016-03-02 | 株式会社村田製作所 | 接合用部材 |
CN102925746B (zh) * | 2012-11-29 | 2014-09-17 | 宁波兴业鑫泰新型电子材料有限公司 | 高性能Cu-Ni-Si系铜合金及其制备和加工方法 |
WO2014155818A1 (ja) * | 2013-03-29 | 2014-10-02 | 古河電気工業株式会社 | アルミニウム合金導体、アルミニウム合金撚線、被覆電線、ワイヤーハーネスおよびアルミニウム合金導体の製造方法 |
CN103740975A (zh) * | 2013-12-23 | 2014-04-23 | 烟台万隆真空冶金股份有限公司 | 一种铜-镍-硅合金及其制备方法 |
CN103695704A (zh) * | 2013-12-26 | 2014-04-02 | 青岛友铭辰生物技术有限公司 | 一种电气电子设备用耐疲劳铜合金材料及其制备方法 |
CN103757479B (zh) * | 2014-01-10 | 2016-01-20 | 滁州学院 | 一种无铅环保锌白铜合金材料及其制备方法 |
JP6210563B2 (ja) * | 2015-04-10 | 2017-10-11 | 古河電気工業株式会社 | ばね用銅合金線材、該ばね用銅合金線材の製造方法、並びにばね、該ばねの製造方法 |
CN105695797A (zh) * | 2016-04-20 | 2016-06-22 | 苏州市相城区明达复合材料厂 | 一种铸造加工零部件用青铜合金 |
CN106282657A (zh) * | 2016-08-31 | 2017-01-04 | 裴秀琴 | 一种铜合金新材料 |
CN107012357B (zh) * | 2017-03-22 | 2018-11-06 | 合肥达户电线电缆科技有限公司 | 一种铜合金线材及其制备方法 |
RU2691823C1 (ru) * | 2018-05-14 | 2019-06-18 | Федеральное государственное бюджетное образовательное учреждение высшего образования Балтийский государственный технический университет "ВОЕНМЕХ" им. Д.Ф. Устинова (БГТУ "ВОЕНМЕХ") | Способ термической обработки заготовки или изделия (пружин) из бронзы БрНХК 2,5-0,7-0,6 |
JP6629401B1 (ja) * | 2018-08-30 | 2020-01-15 | Jx金属株式会社 | 時効処理前のチタン銅板、プレス加工品およびプレス加工品の製造方法 |
JP2021098887A (ja) * | 2019-12-20 | 2021-07-01 | Jx金属株式会社 | 積層造形用金属粉末及び該金属粉末を用いて作製した積層造形物 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002266042A (ja) * | 2001-03-09 | 2002-09-18 | Kobe Steel Ltd | 曲げ加工性が優れた銅合金板 |
JP2006009137A (ja) * | 2004-05-27 | 2006-01-12 | Furukawa Electric Co Ltd:The | 銅合金 |
JP2006233314A (ja) * | 2005-02-28 | 2006-09-07 | Dowa Mining Co Ltd | 高強度銅合金 |
JP2008024999A (ja) * | 2006-07-24 | 2008-02-07 | Dowa Holdings Co Ltd | 耐力および曲げ加工性に優れたCu−Ni−Si系銅合金板材 |
JP2008075172A (ja) * | 2006-09-25 | 2008-04-03 | Nikko Kinzoku Kk | Cu−Ni−Si系合金 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3520034B2 (ja) * | 2000-07-25 | 2004-04-19 | 古河電気工業株式会社 | 電子電気機器部品用銅合金材 |
JP2004307905A (ja) * | 2003-04-03 | 2004-11-04 | Sumitomo Metal Ind Ltd | Cu合金およびその製造方法 |
JP4679040B2 (ja) * | 2003-05-30 | 2011-04-27 | 日鉱金属株式会社 | 電子材料用銅合金 |
JP4255330B2 (ja) | 2003-07-31 | 2009-04-15 | 日鉱金属株式会社 | 疲労特性に優れたCu−Ni−Si系合金部材 |
CN101166840B (zh) * | 2005-02-28 | 2012-07-18 | 古河电气工业株式会社 | 铜合金 |
JP2007169764A (ja) * | 2005-12-26 | 2007-07-05 | Furukawa Electric Co Ltd:The | 銅合金 |
JP2006200042A (ja) * | 2006-03-23 | 2006-08-03 | Kobe Steel Ltd | 曲げ加工性に優れた銅合金板からなる電子部品 |
-
2009
- 2009-02-17 EP EP09712614A patent/EP2256219A4/en not_active Withdrawn
- 2009-02-17 JP JP2009554332A patent/JPWO2009104615A1/ja active Pending
- 2009-02-17 WO PCT/JP2009/052718 patent/WO2009104615A1/ja active Application Filing
- 2009-02-17 CN CN200980105393XA patent/CN101946014A/zh active Pending
-
2010
- 2010-08-17 US US12/858,217 patent/US20100310413A1/en not_active Abandoned
-
2011
- 2011-07-01 US US13/175,068 patent/US20110259480A1/en not_active Abandoned
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002266042A (ja) * | 2001-03-09 | 2002-09-18 | Kobe Steel Ltd | 曲げ加工性が優れた銅合金板 |
JP2006009137A (ja) * | 2004-05-27 | 2006-01-12 | Furukawa Electric Co Ltd:The | 銅合金 |
JP2006233314A (ja) * | 2005-02-28 | 2006-09-07 | Dowa Mining Co Ltd | 高強度銅合金 |
JP2008024999A (ja) * | 2006-07-24 | 2008-02-07 | Dowa Holdings Co Ltd | 耐力および曲げ加工性に優れたCu−Ni−Si系銅合金板材 |
JP2008075172A (ja) * | 2006-09-25 | 2008-04-03 | Nikko Kinzoku Kk | Cu−Ni−Si系合金 |
Non-Patent Citations (1)
Title |
---|
JPN6009022565; 渡邊千尋他: 'Cu-4.0mass%Ni-0.95mass%Si-0.02mass%P合金の機械的特性の改善' 銅と銅合金 第45巻, 20060801, 第16頁-第22頁 * |
Also Published As
Publication number | Publication date |
---|---|
US20100310413A1 (en) | 2010-12-09 |
EP2256219A1 (en) | 2010-12-01 |
WO2009104615A1 (ja) | 2009-08-27 |
CN101946014A (zh) | 2011-01-12 |
US20110259480A1 (en) | 2011-10-27 |
EP2256219A4 (en) | 2012-06-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20110301 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130521 |
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A02 | Decision of refusal |
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