JPWO2007108055A1 - 化合物半導体装置及びその製造方法 - Google Patents
化合物半導体装置及びその製造方法 Download PDFInfo
- Publication number
- JPWO2007108055A1 JPWO2007108055A1 JP2008506071A JP2008506071A JPWO2007108055A1 JP WO2007108055 A1 JPWO2007108055 A1 JP WO2007108055A1 JP 2008506071 A JP2008506071 A JP 2008506071A JP 2008506071 A JP2008506071 A JP 2008506071A JP WO2007108055 A1 JPWO2007108055 A1 JP WO2007108055A1
- Authority
- JP
- Japan
- Prior art keywords
- layer
- compound semiconductor
- semiconductor device
- gate electrode
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims description 141
- 150000001875 compounds Chemical class 0.000 title claims description 134
- 238000004519 manufacturing process Methods 0.000 title claims description 34
- 239000000758 substrate Substances 0.000 claims abstract description 9
- 239000010410 layer Substances 0.000 claims description 254
- 238000000034 method Methods 0.000 claims description 28
- 239000012212 insulator Substances 0.000 claims description 19
- 239000011241 protective layer Substances 0.000 claims description 19
- 238000001039 wet etching Methods 0.000 claims description 9
- 229910002704 AlGaN Inorganic materials 0.000 abstract description 23
- 238000005530 etching Methods 0.000 description 9
- 238000012360 testing method Methods 0.000 description 6
- 230000015556 catabolic process Effects 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000001312 dry etching Methods 0.000 description 4
- 238000005468 ion implantation Methods 0.000 description 4
- 238000002955 isolation Methods 0.000 description 4
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000005533 two-dimensional electron gas Effects 0.000 description 3
- 238000000231 atomic layer deposition Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 206010039203 Road traffic accident Diseases 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000002109 crystal growth method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/20—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
- H01L29/201—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds including two or more compounds, e.g. alloys
- H01L29/205—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds including two or more compounds, e.g. alloys in different semiconductor regions, e.g. heterojunctions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/26—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, elements provided for in two or more of the groups H01L29/16, H01L29/18, H01L29/20, H01L29/22, H01L29/24, e.g. alloys
- H01L29/267—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, elements provided for in two or more of the groups H01L29/16, H01L29/18, H01L29/20, H01L29/22, H01L29/24, e.g. alloys in different semiconductor regions, e.g. heterojunctions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66446—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET]
- H01L29/66462—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET] with a heterojunction interface channel or gate, e.g. HFET, HIGFET, SISFET, HJFET, HEMT
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
- H01L29/7786—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT
- H01L29/7787—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT with wide bandgap charge-carrier supplying layer, e.g. direct single heterostructure MODFET
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/20—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
- H01L29/2003—Nitride compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/51—Insulating materials associated therewith
- H01L29/518—Insulating materials associated therewith the insulating material containing nitrogen, e.g. nitride, oxynitride, nitrogen-doped material
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Junction Field-Effect Transistors (AREA)
Abstract
Description
先ず、本発明の第1の実施形態について説明する。図1は、本発明の第1の実施形態に係る化合物半導体装置の構造を示す断面図である。
次に、本発明の第2の実施形態について説明する。図4は、本発明の第2の実施形態に係る化合物半導体装置の構造を示す断面図である。
次に、本発明の第3の実施形態について説明する。第3の実施形態では、MIS(Metal-Insulator-Semiconductor)構造が採用されている。図7は、本発明の第3の実施形態に係る化合物半導体装置の構造を示す断面図である。
次に、本発明の第4の実施形態について説明する。図10は、本発明の第4の実施形態に係る化合物半導体装置の構造を示す断面図である。
次に、本発明の第5の実施形態について説明する。図12は、本発明の第5の実施形態に係る化合物半導体装置の構造を示す断面図である。
次に、本発明の第6の実施形態について説明する。図13は、本発明の第6の実施形態に係る化合物半導体装置の構造を示す断面図である。
次に、本発明の第7の実施形態について説明する。図14は、本発明の第7の実施形態に係る化合物半導体装置の構造を示す断面図である。
Claims (20)
- 半導体基板上に形成されたGaN系のキャリア走行層と、
前記キャリア走行層上に形成されたGaN系のキャリア供給層と、
前記キャリア供給層上に形成されたGaN系の保護層と、
前記保護層上に形成されたソース電極、ドレイン電極及びゲート電極と、
前記保護層上に形成され、前記ゲート電極と前記ソース電極との間及び前記ゲート電極と前記ドレイン電極との間に位置し、Nを含む化合物半導体層と、
前記化合物半導体層上に形成された絶縁体層と、
を有することを特徴とする化合物半導体装置。 - 前記ゲート電極と前記保護層とが接触していることを特徴とする請求項1に記載の化合物半導体装置。
- 前記ゲート電極と前記化合物半導体層とが接触していることを特徴とする請求項1に記載の化合物半導体装置。
- 前記化合物半導体層と前記絶縁体層とが接触していることを特徴とする請求項1に記載の化合物半導体装置。
- 前記絶縁体層は、SiN層であることを特徴とする請求項1に記載の化合物半導体装置。
- 前記化合物半導体層は、AlN層であることを特徴とする請求項1に記載の化合物半導体装置。
- 前記絶縁体層は、前記ゲート電極と前記化合物半導体層との間及び前記ゲート電極と前記保護層との間にも形成されていることを特徴とする請求項1に記載の化合物半導体装置。
- 前記ゲート電極は、オーバーハング部を有することを特徴とする請求項1に記載の化合物半導体装置。
- 前記保護層にSiがドーピングされていることを特徴とする請求項1に記載の化合物半導体装置。
- 前記化合物半導体層と前記絶縁体層との間に形成されたGaN系の第2の化合物半導体層を有することを特徴とする請求項1に記載の化合物半導体装置。
- 前記第2の化合物半導体層は、Inを含むことを特徴とする請求項10に記載の化合物半導体装置。
- 前記化合物半導体層と前記第2の化合物半導体層との間に形成されたSi層を有することを特徴とする請求項10に記載の化合物半導体装置。
- 前記第2の化合物半導体層にSiがドーピングされていることを特徴とする請求項10に記載の化合物半導体装置。
- 半導体基板上にGaN系のキャリア走行層を形成する工程と、
前記キャリア走行層上にGaN系のキャリア供給層を形成する工程と、
前記キャリア供給層上にGaN系の保護層を形成する工程と、
前記保護層上にNを含む化合物半導体層を形成する工程と、
前記化合物半導体層上に絶縁体層を形成する工程と、
前記絶縁体層及び前記化合物半導体層に、ソース電極用の開口部、ドレイン電極用の開口部及びゲート電極用の開口部を形成する工程と、
前記3個の開口部内に電極を形成する工程と、
を有し、
前記ゲート電極用の開口部を形成する工程は、前記化合物半導体層を前記保護層が露出するまでウェットエッチングする工程を有することを特徴とする化合物半導体装置の製造方法。 - 前記絶縁体層として、SiN層を形成することを特徴とする請求項14に記載の化合物半導体装置の製造方法。
- 前記化合物半導体層として、AlN層を形成することを特徴とする請求項14に記載の化合物半導体装置の製造方法。
- 前記ゲート電極用の開口部を形成する工程の後に、前記ゲート電極用の開口部の底部及び側部に第2の絶縁体層を形成する工程を有することを特徴とする請求項14に記載の化合物半導体装置の製造方法。
- 前記化合物半導体層を形成する工程と前記絶縁体層を形成する工程との間に、前記化合物半導体層上にGaN系の第2の化合物半導体層を形成する工程を有することを特徴とする請求項14に記載の化合物半導体装置の製造方法。
- 前記第2の化合物半導体層として、Inを含むものを形成することを特徴とする請求項18に記載の化合物半導体装置の製造方法。
- 前記化合物半導体層を形成する工程と前記第2の化合物半導体層を形成する工程との間に、前記化合物半導体層上に原子層ドーピングによりSi層を形成する工程を有することを特徴とする請求項18に記載の化合物半導体装置の製造方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2006/305265 WO2007108055A1 (ja) | 2006-03-16 | 2006-03-16 | 化合物半導体装置及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2007108055A1 true JPWO2007108055A1 (ja) | 2009-07-30 |
JP5071377B2 JP5071377B2 (ja) | 2012-11-14 |
Family
ID=38522096
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008506071A Active JP5071377B2 (ja) | 2006-03-16 | 2006-03-16 | 化合物半導体装置及びその製造方法 |
Country Status (4)
Country | Link |
---|---|
US (4) | US8344419B2 (ja) |
EP (5) | EP2677544B1 (ja) |
JP (1) | JP5071377B2 (ja) |
WO (1) | WO2007108055A1 (ja) |
Families Citing this family (61)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008306130A (ja) * | 2007-06-11 | 2008-12-18 | Sanken Electric Co Ltd | 電界効果型半導体装置及びその製造方法 |
US7915643B2 (en) | 2007-09-17 | 2011-03-29 | Transphorm Inc. | Enhancement mode gallium nitride power devices |
WO2009066434A1 (ja) * | 2007-11-19 | 2009-05-28 | Nec Corporation | 電界効果トランジスタおよびその製造方法 |
JP5386829B2 (ja) | 2008-01-30 | 2014-01-15 | 富士通株式会社 | 半導体装置 |
JP5320774B2 (ja) * | 2008-03-03 | 2013-10-23 | 三菱電機株式会社 | 半導体装置 |
US8519438B2 (en) | 2008-04-23 | 2013-08-27 | Transphorm Inc. | Enhancement mode III-N HEMTs |
US8289065B2 (en) | 2008-09-23 | 2012-10-16 | Transphorm Inc. | Inductive load power switching circuits |
JP5468768B2 (ja) * | 2008-12-05 | 2014-04-09 | パナソニック株式会社 | 電界効果トランジスタ及びその製造方法 |
US7898004B2 (en) | 2008-12-10 | 2011-03-01 | Transphorm Inc. | Semiconductor heterostructure diodes |
JP5487613B2 (ja) | 2008-12-19 | 2014-05-07 | 富士通株式会社 | 化合物半導体装置及びその製造方法 |
US8742459B2 (en) | 2009-05-14 | 2014-06-03 | Transphorm Inc. | High voltage III-nitride semiconductor devices |
JP4794655B2 (ja) * | 2009-06-09 | 2011-10-19 | シャープ株式会社 | 電界効果トランジスタ |
US8390000B2 (en) * | 2009-08-28 | 2013-03-05 | Transphorm Inc. | Semiconductor devices with field plates |
WO2011033932A1 (ja) * | 2009-09-18 | 2011-03-24 | 株式会社パイオラックス | ホースクランプ |
JP2011082216A (ja) | 2009-10-02 | 2011-04-21 | Fujitsu Ltd | 化合物半導体装置及びその製造方法 |
US8389977B2 (en) | 2009-12-10 | 2013-03-05 | Transphorm Inc. | Reverse side engineered III-nitride devices |
US9378965B2 (en) * | 2009-12-10 | 2016-06-28 | Infineon Technologies Americas Corp. | Highly conductive source/drain contacts in III-nitride transistors |
CN101916773B (zh) * | 2010-07-23 | 2012-05-23 | 中国科学院上海技术物理研究所 | 一种双沟道mos-hemt器件的制作方法 |
JP5712583B2 (ja) | 2010-12-02 | 2015-05-07 | 富士通株式会社 | 化合物半導体装置及びその製造方法 |
JP5724339B2 (ja) * | 2010-12-03 | 2015-05-27 | 富士通株式会社 | 化合物半導体装置及びその製造方法 |
US8742460B2 (en) | 2010-12-15 | 2014-06-03 | Transphorm Inc. | Transistors with isolation regions |
JP5654884B2 (ja) * | 2011-01-26 | 2015-01-14 | 株式会社東芝 | 窒化物半導体装置の製造方法 |
US8643062B2 (en) | 2011-02-02 | 2014-02-04 | Transphorm Inc. | III-N device structures and methods |
JP5762049B2 (ja) * | 2011-02-28 | 2015-08-12 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
US8772842B2 (en) | 2011-03-04 | 2014-07-08 | Transphorm, Inc. | Semiconductor diodes with low reverse bias currents |
US8716141B2 (en) | 2011-03-04 | 2014-05-06 | Transphorm Inc. | Electrode configurations for semiconductor devices |
GB201112327D0 (en) * | 2011-07-18 | 2011-08-31 | Epigan Nv | Method for growing III-V epitaxial layers |
US8901604B2 (en) | 2011-09-06 | 2014-12-02 | Transphorm Inc. | Semiconductor devices with guard rings |
US9257547B2 (en) | 2011-09-13 | 2016-02-09 | Transphorm Inc. | III-N device structures having a non-insulating substrate |
US8598937B2 (en) | 2011-10-07 | 2013-12-03 | Transphorm Inc. | High power semiconductor electronic components with increased reliability |
US9165766B2 (en) | 2012-02-03 | 2015-10-20 | Transphorm Inc. | Buffer layer structures suited for III-nitride devices with foreign substrates |
JP2013206976A (ja) * | 2012-03-27 | 2013-10-07 | Fujitsu Ltd | 化合物半導体装置及びその製造方法 |
WO2013155108A1 (en) | 2012-04-09 | 2013-10-17 | Transphorm Inc. | N-polar iii-nitride transistors |
US10700201B2 (en) | 2012-05-23 | 2020-06-30 | Hrl Laboratories, Llc | HEMT GaN device with a non-uniform lateral two dimensional electron gas profile and method of manufacturing the same |
US9379195B2 (en) | 2012-05-23 | 2016-06-28 | Hrl Laboratories, Llc | HEMT GaN device with a non-uniform lateral two dimensional electron gas profile and method of manufacturing the same |
US9000484B2 (en) | 2012-05-23 | 2015-04-07 | Hrl Laboratories, Llc | Non-uniform lateral profile of two-dimensional electron gas charge density in type III nitride HEMT devices using ion implantation through gray scale mask |
US8680536B2 (en) * | 2012-05-23 | 2014-03-25 | Hrl Laboratories, Llc | Non-uniform two dimensional electron gas profile in III-Nitride HEMT devices |
US9184275B2 (en) | 2012-06-27 | 2015-11-10 | Transphorm Inc. | Semiconductor devices with integrated hole collectors |
US8803246B2 (en) | 2012-07-16 | 2014-08-12 | Transphorm Inc. | Semiconductor electronic components with integrated current limiters |
JP6087552B2 (ja) | 2012-09-21 | 2017-03-01 | トランスフォーム・ジャパン株式会社 | 化合物半導体装置及びその製造方法 |
US9583574B2 (en) | 2012-09-28 | 2017-02-28 | Intel Corporation | Epitaxial buffer layers for group III-N transistors on silicon substrates |
US8884334B2 (en) * | 2012-11-09 | 2014-11-11 | Taiwan Semiconductor Manufacturing Co., Ltd. | Composite layer stacking for enhancement mode transistor |
JP2014130951A (ja) * | 2012-12-28 | 2014-07-10 | Sumitomo Electric Ind Ltd | 半導体装置 |
JP6253886B2 (ja) * | 2013-01-09 | 2017-12-27 | トランスフォーム・ジャパン株式会社 | 半導体装置及び半導体装置の製造方法 |
WO2014127150A1 (en) | 2013-02-15 | 2014-08-21 | Transphorm Inc. | Electrodes for semiconductor devices and methods of forming the same |
US9087718B2 (en) | 2013-03-13 | 2015-07-21 | Transphorm Inc. | Enhancement-mode III-nitride devices |
US9245992B2 (en) | 2013-03-15 | 2016-01-26 | Transphorm Inc. | Carbon doping semiconductor devices |
JP5721782B2 (ja) * | 2013-06-26 | 2015-05-20 | パナソニック株式会社 | 半導体装置 |
WO2015009514A1 (en) | 2013-07-19 | 2015-01-22 | Transphorm Inc. | Iii-nitride transistor including a p-type depleting layer |
KR20150011238A (ko) * | 2013-07-22 | 2015-01-30 | 삼성전자주식회사 | 질화물계 반도체 장치 |
JP6214978B2 (ja) * | 2013-09-17 | 2017-10-18 | 株式会社東芝 | 半導体装置 |
US10276712B2 (en) | 2014-05-29 | 2019-04-30 | Hrl Laboratories, Llc | III-nitride field-effect transistor with dual gates |
US9318593B2 (en) | 2014-07-21 | 2016-04-19 | Transphorm Inc. | Forming enhancement mode III-nitride devices |
US9536967B2 (en) | 2014-12-16 | 2017-01-03 | Transphorm Inc. | Recessed ohmic contacts in a III-N device |
US9536966B2 (en) | 2014-12-16 | 2017-01-03 | Transphorm Inc. | Gate structures for III-N devices |
US9812532B1 (en) | 2015-08-28 | 2017-11-07 | Hrl Laboratories, Llc | III-nitride P-channel transistor |
ITUB20155503A1 (it) | 2015-11-12 | 2017-05-12 | St Microelectronics Srl | Metodo di fabbricazione di un transistore hemt e transistore hemt con migliorata mobilita' elettronica |
CN108292678B (zh) | 2015-11-19 | 2021-07-06 | Hrl实验室有限责任公司 | 具有双栅极的iii族氮化物场效应晶体管 |
US11322599B2 (en) | 2016-01-15 | 2022-05-03 | Transphorm Technology, Inc. | Enhancement mode III-nitride devices having an Al1-xSixO gate insulator |
US10224401B2 (en) | 2016-05-31 | 2019-03-05 | Transphorm Inc. | III-nitride devices including a graded depleting layer |
CN112242441A (zh) * | 2019-07-16 | 2021-01-19 | 联华电子股份有限公司 | 高电子迁移率晶体管 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5888872A (en) | 1997-06-20 | 1999-03-30 | Advanced Micro Devices, Inc. | Method for forming source drain junction areas self-aligned between a sidewall spacer and an etched lateral sidewall |
US5986209A (en) * | 1997-07-09 | 1999-11-16 | Micron Technology, Inc. | Package stack via bottom leaded plastic (BLP) packaging |
JP4224737B2 (ja) * | 1999-03-04 | 2009-02-18 | ソニー株式会社 | 半導体素子 |
JP2002141499A (ja) * | 2000-10-31 | 2002-05-17 | Toshiba Corp | 電界効果トランジスタ及びその製造方法 |
JP4663156B2 (ja) | 2001-05-31 | 2011-03-30 | 富士通株式会社 | 化合物半導体装置 |
JP2005527102A (ja) * | 2001-07-24 | 2005-09-08 | クリー インコーポレイテッド | 高電子移動度トランジスタ及びその製造方法 |
JP3940699B2 (ja) * | 2003-05-16 | 2007-07-04 | 株式会社東芝 | 電力用半導体素子 |
WO2006001369A1 (ja) * | 2004-06-24 | 2006-01-05 | Nec Corporation | 半導体装置 |
JP2006032552A (ja) * | 2004-07-14 | 2006-02-02 | Toshiba Corp | 窒化物含有半導体装置 |
US7238560B2 (en) * | 2004-07-23 | 2007-07-03 | Cree, Inc. | Methods of fabricating nitride-based transistors with a cap layer and a recessed gate |
-
2006
- 2006-03-16 EP EP20130164120 patent/EP2677544B1/en active Active
- 2006-03-16 EP EP13164123.5A patent/EP2657976B1/en active Active
- 2006-03-16 JP JP2008506071A patent/JP5071377B2/ja active Active
- 2006-03-16 EP EP06729258A patent/EP1998376B1/en active Active
- 2006-03-16 EP EP09178269.8A patent/EP2175494B1/en active Active
- 2006-03-16 WO PCT/JP2006/305265 patent/WO2007108055A1/ja active Application Filing
- 2006-03-16 EP EP09178271A patent/EP2166575B1/en active Active
-
2008
- 2008-09-15 US US12/210,442 patent/US8344419B2/en active Active
-
2011
- 2011-07-19 US US13/185,946 patent/US8466029B2/en active Active
- 2011-07-19 US US13/185,888 patent/US8637903B2/en active Active
-
2013
- 2013-05-09 US US13/890,688 patent/US8841706B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
WO2007108055A1 (ja) | 2007-09-27 |
EP1998376A1 (en) | 2008-12-03 |
EP2677544B1 (en) | 2015-04-22 |
EP1998376B1 (en) | 2011-08-03 |
EP2175494B1 (en) | 2015-03-25 |
EP2166575B1 (en) | 2011-08-17 |
EP2175494A3 (en) | 2012-10-17 |
EP2657976A2 (en) | 2013-10-30 |
EP2166575A1 (en) | 2010-03-24 |
US8637903B2 (en) | 2014-01-28 |
US20110275199A1 (en) | 2011-11-10 |
EP1998376A4 (en) | 2009-07-22 |
EP2657976A3 (en) | 2013-12-25 |
US8841706B2 (en) | 2014-09-23 |
US8466029B2 (en) | 2013-06-18 |
US8344419B2 (en) | 2013-01-01 |
EP2657976B1 (en) | 2018-12-26 |
JP5071377B2 (ja) | 2012-11-14 |
US20090008677A1 (en) | 2009-01-08 |
US20110272704A1 (en) | 2011-11-10 |
EP2175494A2 (en) | 2010-04-14 |
US20130248934A1 (en) | 2013-09-26 |
EP2677544A1 (en) | 2013-12-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5071377B2 (ja) | 化合物半導体装置及びその製造方法 | |
JP6486828B2 (ja) | 半導体構造およびリセス形成のエッチング技術 | |
JP5785153B2 (ja) | 補償型ゲートmisfet及びその製造方法 | |
EP2735031B1 (en) | Method for growing iii-v epitaxial layers | |
TWI496284B (zh) | 化合物半導體裝置及其製造方法 | |
JP5866766B2 (ja) | 化合物半導体装置及びその製造方法 | |
US10679860B2 (en) | Self-aligning source, drain and gate process for III-V nitride MISHEMTs | |
US10243049B2 (en) | Nitride semiconductor device | |
TW201419530A (zh) | 化合物半導體裝置及其製造方法 | |
TWI509797B (zh) | 化合物半導體裝置及其製造方法 | |
JP5183975B2 (ja) | エンハンスモード電界効果デバイスおよびその製造方法 | |
US10373833B2 (en) | Semiconductor device and method for manufacturing the same | |
US20130146888A1 (en) | Monolithic semiconductor device and method for manufacturing the same | |
JP7308593B2 (ja) | 窒化物半導体装置 | |
JP2013125918A (ja) | 半導体装置 | |
JP6047998B2 (ja) | 半導体装置 | |
JP5725749B2 (ja) | 半導体装置の製造方法 | |
US20140217416A1 (en) | Nitrides based semiconductor device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20091027 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120207 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120405 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120501 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120628 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20120724 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20120806 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5071377 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150831 Year of fee payment: 3 |