JPWO2005073621A1 - Led照明光源 - Google Patents
Led照明光源 Download PDFInfo
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- JPWO2005073621A1 JPWO2005073621A1 JP2005517420A JP2005517420A JPWO2005073621A1 JP WO2005073621 A1 JPWO2005073621 A1 JP WO2005073621A1 JP 2005517420 A JP2005517420 A JP 2005517420A JP 2005517420 A JP2005517420 A JP 2005517420A JP WO2005073621 A1 JPWO2005073621 A1 JP WO2005073621A1
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- led
- light source
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/68—Details of reflectors forming part of the light source
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
Abstract
Description
14 蛍光体樹脂部
20 基板
22 ベース基板
24 配線層
26 配線パターン
28 給電端子
30 反射板
32 反射面
35 開口部
40 骨格
42 開口部
50 レンズ
100 照明光源
200、250 照明光源
まず、図3および図4を参照しながら、第1の実施形態に係るLED照明光源100を説明する。図3は、LED照明光源100の断面構成を模式的に示しており、図4は、LED照明光源100の平面構成を模式的に示している。
次に、図9を参照しながら、本発明によるLED照明光源の第2の実施形態を説明する。
次に、図10を参照しながら、本発明によるLED照明光源の第3の実施形態を説明する。
次に、図11を参照しながら、本発明によるLED照明光源の第4の実施形態を説明する。
次に、図12を参照しながら、本発明によるLED照明光源の第5の実施形態を説明する。
次に、図13を参照しながら、本発明によるLED照明光源の第6の実施形態を説明する。
次に、図14を参照しながら、本発明によるLED照明光源の第7の実施形態を説明する。
まず、図3および図4を参照しながら、第1の実施形態に係るLED照明光源100を説明する。図3は、LED照明光源100の断面構成を模式的に示しており、図4は、LED照明光源100の平面構成を模式的に示している。
次に、図9を参照しながら、本発明によるLED照明光源の第2の実施形態を説明する。
次に、図10を参照しながら、本発明によるLED照明光源の第3の実施形態を説明する。
次に、図11を参照しながら、本発明によるLED照明光源の第4の実施形態を説明する。
次に、図12を参照しながら、本発明によるLED照明光源の第5の実施形態を説明する。
次に、図13を参照しながら、本発明によるLED照明光源の第6の実施形態を説明する。
次に、図14を参照しながら、本発明によるLED照明光源の第7の実施形態を説明する。
14 蛍光体樹脂部
20 基板
22 ベース基板
24 配線層
26 配線パターン
28 給電端子
30 反射板
32 反射面
35 開口部
40 骨格
42 開口部
50 レンズ
100 照明光源
200、250 照明光源
Claims (23)
- 上面および下面を有する基板と、
前記基板の上面上に配列された複数のLED素子と、
各LED素子から発せられた光の少なくとも一部を反射する反射面を有する反射部材と、
を備えたLED照明光源であって、
前記反射部材は、樹脂と、前記樹脂よりも曲げ剛性の大きな材料から形成された骨格とを備えているLED照明光源。 - 前記骨格は、金属、セラミックス、半導体、およびガラスのうちの少なくとも1つの材料から形成されている請求項1に記載のLED照明光源。
- 前記反射部材は、二次元的に配列された複数の開口部を有しており、
各開口部の内壁面が、個々のLED素子の側面を取り囲んでいる請求項1または2に記載のLED照明光源。 - 前記反射部材における前記複数の開口部の内壁面が前記反射面として機能する請求項3に記載のLED照明光源。
- 前記複数のLED素子を覆う透光性部材を前記基板の上面側に備えている請求項1に記載のLED照明光源。
- 前記透光性部材は樹脂から形成されており、
前記基板の下面には樹脂の層が設けられていない請求項5に記載のLED照明光源。 - 前記透光性部材は、レンズアレイとして機能する部分を有しており、
前記レンズアレイに含まれる個々のレンズは、前記複数のLED素子のうちの対応するLED素子から放射された光に対してレンズ効果を発揮する請求項6に記載のLED照明光源。 - 前記透光性部材は、前記反射部材の少なくとも前記反射面を覆っている請求項6または7に記載のLED照明光源。
- 前記複数のLED素子の各々を覆う波長変換部を更に有しており、前記波長変換部は、前記LED素子から放射された光を当該光の波長よりも長い波長を有する光に変換する請求項1に記載のLED照明光源。
- 前記反射部材の樹脂は、前記骨格の表面の70%以上を覆っている請求項1に記載のLED照明光源。
- 前記基板は、樹脂と無機フィラーとを含む材料から構成されたコンポジット基板である請求項1に記載のLED照明光源。
- 前記骨格は、前記基板の上面上に配列された複数のLED素子からなるLED素子クラスタの外側に位置している請求項1に記載のLED照明光源。
- 前記LED素子は、前記基板の上面上において行列状に配列されており、
前記骨格は、前記行列における行方向および列方向の少なくとも一方に沿って延びる少なくとも2本の棒を有している請求項1に記載のLED照明光源。 - 前記骨格は、前記行列における各行の間および各列の間に、前記行方向および前記列方向に延びる部材を有している請求項12に記載のLED照明光源。
- 前記LED素子は、前記基板上において行列状に配列されており、
前記骨格は、前記行列における行方向および列方向とは異なる斜め方向に沿って延びる少なくとも2本の棒を有している請求項1に記載のLED照明光源。 - 前記骨格は、前記基板と平行に配置された板状部材であり、
前記板状部材には、前記LED素子に対応する箇所に開口部が形成されている請求項1に記載のLED照明光源。 - 前記骨格は、複数の開口部を有する板状の金属製部材であり、
前記反射部材の樹脂は、前記金属製部材の上に層状に存在している請求項1に記載のLED照明光源。 - 前記LED照明光源はカード型の照明光源である請求項1に記載のLED照明光源。
- 樹脂と、前記樹脂よりも曲げ剛性の大きな材料から形成された骨格とを備えているLED照明光源用反射板。
- 前記骨格は、金属、セラミックス、半導体、およびガラスのうちの少なくとも1つの材料から形成されている請求項19に記載のLED照明光源用反射板。
- 二次元的に配列された複数の開口部を有しており、
各開口部の内壁面は、LED素子から放射された光を反射する反射面として機能する請求項19に記載のLED照明光源用反射板。 - 前記開口部の内壁面が前記樹脂層の表面の少なくとも一部によって形成されている請求項19に記載のLED照明光源用反射板。
- 下面が前記樹脂層の表面の少なくとも一部によって形成されている請求項19に記載のLED照明光源用反射板。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004021062 | 2004-01-29 | ||
JP2004021062 | 2004-01-29 | ||
PCT/JP2005/000654 WO2005073621A1 (ja) | 2004-01-29 | 2005-01-20 | Led照明光源 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP3895362B2 JP3895362B2 (ja) | 2007-03-22 |
JPWO2005073621A1 true JPWO2005073621A1 (ja) | 2007-09-13 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2005517420A Expired - Fee Related JP3895362B2 (ja) | 2004-01-29 | 2005-01-20 | Led照明光源 |
Country Status (4)
Country | Link |
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US (1) | US20060186425A1 (ja) |
JP (1) | JP3895362B2 (ja) |
CN (1) | CN1860329A (ja) |
WO (1) | WO2005073621A1 (ja) |
Cited By (1)
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- 2005-01-20 WO PCT/JP2005/000654 patent/WO2005073621A1/ja active Application Filing
- 2005-01-20 JP JP2005517420A patent/JP3895362B2/ja not_active Expired - Fee Related
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2006
- 2006-04-13 US US11/402,928 patent/US20060186425A1/en not_active Abandoned
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JP2014521227A (ja) * | 2011-07-18 | 2014-08-25 | ヘレーウス ノーブルライト ゲゼルシャフト ミット ベシュレンクテル ハフツング | 改善された光学系を備えているオプトエレクトロニクスモジュール |
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WO2005073621A1 (ja) | 2005-08-11 |
US20060186425A1 (en) | 2006-08-24 |
JP3895362B2 (ja) | 2007-03-22 |
CN1860329A (zh) | 2006-11-08 |
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