JPWO2002073672A1 - 基板処理装置 - Google Patents

基板処理装置 Download PDF

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Publication number
JPWO2002073672A1
JPWO2002073672A1 JP2002572623A JP2002572623A JPWO2002073672A1 JP WO2002073672 A1 JPWO2002073672 A1 JP WO2002073672A1 JP 2002572623 A JP2002572623 A JP 2002572623A JP 2002572623 A JP2002572623 A JP 2002572623A JP WO2002073672 A1 JPWO2002073672 A1 JP WO2002073672A1
Authority
JP
Japan
Prior art keywords
substrate
air knife
wet
liquid
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002572623A
Other languages
English (en)
Japanese (ja)
Inventor
水川　茂
茂 水川
中田　勝利
勝利 中田
松元　俊二
俊二 松元
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Precision Products Co Ltd
Original Assignee
Sumitomo Precision Products Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Precision Products Co Ltd filed Critical Sumitomo Precision Products Co Ltd
Publication of JPWO2002073672A1 publication Critical patent/JPWO2002073672A1/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B08B3/022—Cleaning travelling work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
    • B08B5/023—Cleaning travelling work
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B15/00—Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form
    • F26B15/10—Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form with movement in a path composed of one or more straight lines, e.g. compound, the movement being in alternate horizontal and vertical directions
    • F26B15/12—Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form with movement in a path composed of one or more straight lines, e.g. compound, the movement being in alternate horizontal and vertical directions the lines being all horizontal or slightly inclined
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B5/00—Drying solid materials or objects by processes not involving the application of heat
    • F26B5/14—Drying solid materials or objects by processes not involving the application of heat by applying pressure, e.g. wringing; by brushing; by wiping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Molecular Biology (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2002572623A 2001-03-14 2002-03-08 基板処理装置 Pending JPWO2002073672A1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001072696 2001-03-14
JP2001072696 2001-03-14
PCT/JP2002/002223 WO2002073672A1 (fr) 2001-03-14 2002-03-08 Dispositif de traitement de substrat

Publications (1)

Publication Number Publication Date
JPWO2002073672A1 true JPWO2002073672A1 (ja) 2004-07-02

Family

ID=18930242

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002572623A Pending JPWO2002073672A1 (ja) 2001-03-14 2002-03-08 基板処理装置

Country Status (5)

Country Link
JP (1) JPWO2002073672A1 (zh)
KR (1) KR20030003235A (zh)
CN (1) CN1455948A (zh)
TW (1) TWI283441B (zh)
WO (1) WO2002073672A1 (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4057993B2 (ja) * 2003-11-14 2008-03-05 住友精密工業株式会社 液切り装置
WO2005077553A1 (ja) * 2004-02-18 2005-08-25 Kawasaki Plant Systems Kabushiki Kaisha 板材の洗浄設備
CN100362625C (zh) * 2005-03-30 2008-01-16 大日本网目版制造株式会社 基板处理装置以及基板处理方法
KR101146953B1 (ko) * 2005-12-16 2012-05-23 주식회사 케이씨텍 에어나이프 간격조절장치
KR101234191B1 (ko) * 2005-12-22 2013-02-18 주식회사 케이씨텍 대면적 기판 처리모듈의 위치조정장치
JP4688741B2 (ja) * 2006-06-26 2011-05-25 大日本スクリーン製造株式会社 基板処理装置
US9919002B2 (en) * 2013-10-21 2018-03-20 North Carolina State University Methods and constructs for compound delivery
TWI575641B (zh) * 2016-06-02 2017-03-21 盟立自動化股份有限公司 溼式製程設備
CN110892518B (zh) * 2017-07-14 2023-12-05 雷纳技术有限责任公司 干燥基片的干燥装置和方法
CN109132543B (zh) * 2018-06-29 2020-07-14 深圳砺剑防卫技术有限公司 一种片材的制造装置和片材制造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2581396B2 (ja) * 1993-06-23 1997-02-12 日本電気株式会社 基板乾燥装置
JP2699911B2 (ja) * 1995-02-28 1998-01-19 日本電気株式会社 エアナイフ乾燥方法
JP2001284310A (ja) * 2000-03-31 2001-10-12 Shibaura Mechatronics Corp 基板の処理装置及び処理方法
JP4352194B2 (ja) * 2000-04-04 2009-10-28 株式会社日立ハイテクノロジーズ 基板乾燥装置及び基板乾燥方法

Also Published As

Publication number Publication date
CN1455948A (zh) 2003-11-12
KR20030003235A (ko) 2003-01-09
WO2002073672A1 (fr) 2002-09-19
TWI283441B (en) 2007-07-01

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