JPS6472544A - Selective oxidation and isolation - Google Patents

Selective oxidation and isolation

Info

Publication number
JPS6472544A
JPS6472544A JP22817587A JP22817587A JPS6472544A JP S6472544 A JPS6472544 A JP S6472544A JP 22817587 A JP22817587 A JP 22817587A JP 22817587 A JP22817587 A JP 22817587A JP S6472544 A JPS6472544 A JP S6472544A
Authority
JP
Japan
Prior art keywords
nitride film
thickness
oxide film
film
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22817587A
Other languages
Japanese (ja)
Inventor
Noboru Kudo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Instruments Inc
Original Assignee
Seiko Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Instruments Inc filed Critical Seiko Instruments Inc
Priority to JP22817587A priority Critical patent/JPS6472544A/en
Publication of JPS6472544A publication Critical patent/JPS6472544A/en
Pending legal-status Critical Current

Links

Landscapes

  • Local Oxidation Of Silicon (AREA)
  • Element Separation (AREA)
  • Formation Of Insulating Films (AREA)

Abstract

PURPOSE:To suppress the redistribution of a well region and to improve the integration of an integrated circuit by selectively forming an oxide film with an optical nitride film formed on a semiconductor substrate used as a mask, thereby forming the nitride film having a sufficient thickness at a low temperature or in a short time. CONSTITUTION:With an optical nitride film 3 formed on a semiconductor substrate as a mask an oxide film 6 is selectively formed. For example, the substrate 1 is heated by an infrared ray lamp in an ammonia gas atmosphere, thereby forming the optical nitride film 3 having 50-200Angstrom of thickness on the substrate 1, a well 2. Then, an oxide film 4 having 200-1000Angstrom of thickness is formed by a CVD method, and a nitride film 5 is further formed by a CVD method to have 200-2000Angstrom of thickness. Then, with a resist pattern so formed as to remain on an element region as a mask, the films 5, 4, 3 are etched by dry etching or the like, and the resist is removed. Thereafter, a region not masked by the film 3 on the substrate 1 is oxidized by thermally oxidizing at 1000-1100 deg.C, and a field oxide film 6 is formed.
JP22817587A 1987-09-11 1987-09-11 Selective oxidation and isolation Pending JPS6472544A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22817587A JPS6472544A (en) 1987-09-11 1987-09-11 Selective oxidation and isolation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22817587A JPS6472544A (en) 1987-09-11 1987-09-11 Selective oxidation and isolation

Publications (1)

Publication Number Publication Date
JPS6472544A true JPS6472544A (en) 1989-03-17

Family

ID=16872395

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22817587A Pending JPS6472544A (en) 1987-09-11 1987-09-11 Selective oxidation and isolation

Country Status (1)

Country Link
JP (1) JPS6472544A (en)

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