JPS56152236A - Method of forming contacting hole - Google Patents
Method of forming contacting holeInfo
- Publication number
- JPS56152236A JPS56152236A JP5646380A JP5646380A JPS56152236A JP S56152236 A JPS56152236 A JP S56152236A JP 5646380 A JP5646380 A JP 5646380A JP 5646380 A JP5646380 A JP 5646380A JP S56152236 A JPS56152236 A JP S56152236A
- Authority
- JP
- Japan
- Prior art keywords
- film
- contacting hole
- mask
- si3n4
- sio2
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title abstract 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 6
- 229910052581 Si3N4 Inorganic materials 0.000 abstract 3
- 229910052681 coesite Inorganic materials 0.000 abstract 3
- 229910052906 cristobalite Inorganic materials 0.000 abstract 3
- 230000003647 oxidation Effects 0.000 abstract 3
- 238000007254 oxidation reaction Methods 0.000 abstract 3
- 239000004065 semiconductor Substances 0.000 abstract 3
- 239000000377 silicon dioxide Substances 0.000 abstract 3
- 235000012239 silicon dioxide Nutrition 0.000 abstract 3
- 229910052682 stishovite Inorganic materials 0.000 abstract 3
- 229910052905 tridymite Inorganic materials 0.000 abstract 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 2
- 229910052710 silicon Inorganic materials 0.000 abstract 2
- 239000010703 silicon Substances 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- 238000005530 etching Methods 0.000 abstract 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
PURPOSE:To enhance the integrating density of a semiconductor device by etching two-layer film of an insulating film and a nitrided silicon film formed on a semiconductor substrate with a mask formed by the selective oxidation of a silicon film, thereby forming a microminiature contacting hole. CONSTITUTION:An SiO2 film 2, an Si3N4 film 6, a polycrystalline Si film 7, an SiO2 film 8 and an Si3N4 film 9 are laminated on a semiconductor substrate 1, with an Si3N4 film 9a as a mask the film 7 is oxidized to be converted into an SiO2 film 11, and this thermally oxidized film 11 is used as a mask to sequentially etch the films 6 and 2, and a contacting hole is thus formed. Thus, a microminiature contacting hole employing a photomechanical process less than the critical size can be formed by utilizing the lateral oxidation with the selective oxidation.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5646380A JPS56152236A (en) | 1980-04-28 | 1980-04-28 | Method of forming contacting hole |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5646380A JPS56152236A (en) | 1980-04-28 | 1980-04-28 | Method of forming contacting hole |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS56152236A true JPS56152236A (en) | 1981-11-25 |
Family
ID=13027789
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5646380A Pending JPS56152236A (en) | 1980-04-28 | 1980-04-28 | Method of forming contacting hole |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56152236A (en) |
-
1980
- 1980-04-28 JP JP5646380A patent/JPS56152236A/en active Pending
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