JPS6465848A - Alignment - Google Patents

Alignment

Info

Publication number
JPS6465848A
JPS6465848A JP62222704A JP22270487A JPS6465848A JP S6465848 A JPS6465848 A JP S6465848A JP 62222704 A JP62222704 A JP 62222704A JP 22270487 A JP22270487 A JP 22270487A JP S6465848 A JPS6465848 A JP S6465848A
Authority
JP
Japan
Prior art keywords
wafer
moved
bonding pad
sensor
camera
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62222704A
Other languages
English (en)
Inventor
Atsuto Yamaguchi
Teruya Sato
Takao Ukaji
Taro Omori
Eiichi Murakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP62222704A priority Critical patent/JPS6465848A/ja
Priority to US07/240,003 priority patent/US4934064A/en
Publication of JPS6465848A publication Critical patent/JPS6465848A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
JP62222704A 1987-04-09 1987-09-04 Alignment Pending JPS6465848A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP62222704A JPS6465848A (en) 1987-09-04 1987-09-04 Alignment
US07/240,003 US4934064A (en) 1987-04-09 1988-09-02 Alignment method in a wafer prober

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62222704A JPS6465848A (en) 1987-09-04 1987-09-04 Alignment

Publications (1)

Publication Number Publication Date
JPS6465848A true JPS6465848A (en) 1989-03-13

Family

ID=16786599

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62222704A Pending JPS6465848A (en) 1987-04-09 1987-09-04 Alignment

Country Status (2)

Country Link
US (1) US4934064A (ja)
JP (1) JPS6465848A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100703378B1 (ko) * 2005-07-08 2007-04-03 엘지전자 주식회사 디스크 매체의 라벨면에 인쇄하는 방법 및 장치
KR100704079B1 (ko) * 2005-07-08 2007-04-06 엘지전자 주식회사 빔의 크기를 변화시켜 디스크 매체의 라벨면에 인쇄하는방법 및 장치
KR100704078B1 (ko) * 2005-07-08 2007-04-06 엘지전자 주식회사 디스크 매체의 라벨면에 인쇄하는 방법 및 장치

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2757036B2 (ja) * 1989-08-26 1998-05-25 株式会社新川 マーキング方法及び装置
JPH03209737A (ja) * 1990-01-11 1991-09-12 Tokyo Electron Ltd プローブ装置
GB9104705D0 (en) * 1991-03-06 1991-04-17 Lowe John M Vision system
JPH06151532A (ja) * 1992-11-13 1994-05-31 Tokyo Electron Yamanashi Kk プローブ装置
US5539676A (en) * 1993-04-15 1996-07-23 Tokyo Electron Limited Method of identifying probe position and probing method in prober
US5621313A (en) * 1993-09-09 1997-04-15 Tokyo Seimitsu Co., Ltd. Wafer probing system and method that stores reference pattern and movement value data for different kinds of wafers
US5600258A (en) * 1993-09-15 1997-02-04 Intest Corporation Method and apparatus for automated docking of a test head to a device handler
US5644245A (en) * 1993-11-24 1997-07-01 Tokyo Electron Limited Probe apparatus for inspecting electrical characteristics of a microelectronic element
US5642056A (en) * 1993-12-22 1997-06-24 Tokyo Electron Limited Probe apparatus for correcting the probe card posture before testing
US5543726A (en) * 1994-01-03 1996-08-06 International Business Machines Corporation Open frame gantry probing system
US5510723A (en) * 1994-03-01 1996-04-23 Micron Custom Manufacturing, Inc. Usa Diced semiconductor device handler
CN1088854C (zh) * 1994-03-22 2002-08-07 现代电子产业株式会社 掩模版
US5467020A (en) * 1994-03-29 1995-11-14 International Business Machines Corporation Testing fixture and method for circuit traces on a flexible substrate
JPH10112493A (ja) * 1996-08-13 1998-04-28 Sony Corp 表面矯正薄板保持装置、面調整手段及び向き調整手段
US5861759A (en) * 1997-01-29 1999-01-19 Tokyo Electron Limited Automatic probe card planarization system
JP3423979B2 (ja) * 1997-07-11 2003-07-07 東京エレクトロン株式会社 プローブ方法及びプローブ装置
US6047480A (en) * 1998-04-13 2000-04-11 Motorola, Inc. Method of processing a semiconductor device
US6111419A (en) * 1998-05-19 2000-08-29 Motorola Inc. Method of processing a substrate including measuring for planarity and probing the substrate
US6356093B2 (en) * 1998-06-02 2002-03-12 Nidec-Read Corporation Printed circuit board testing apparatus
US6710798B1 (en) 1999-03-09 2004-03-23 Applied Precision Llc Methods and apparatus for determining the relative positions of probe tips on a printed circuit board probe card
JP2000260852A (ja) 1999-03-11 2000-09-22 Tokyo Electron Ltd 検査ステージ及び検査装置
US6373268B1 (en) * 1999-05-10 2002-04-16 Intel Corporation Test handling method and equipment for conjoined integrated circuit dice
US7009415B2 (en) * 1999-10-06 2006-03-07 Tokyo Electron Limited Probing method and probing apparatus
JP2001110857A (ja) 1999-10-06 2001-04-20 Tokyo Electron Ltd プローブ方法及びプローブ装置
US6357131B1 (en) * 1999-12-20 2002-03-19 Taiwan Semiconductor Manufacturing Company Overlay reliability monitor
JP4218816B2 (ja) 2000-02-15 2009-02-04 東京エレクトロン株式会社 針荷重測定方法、検査方法及び検査装置
TW528881B (en) * 2001-02-05 2003-04-21 Hitachi Int Electric Inc Position measuring apparatus
US20080010845A1 (en) * 2002-04-26 2008-01-17 Accretech Usa, Inc. Apparatus for cleaning a wafer substrate
US6760976B1 (en) * 2003-01-15 2004-07-13 Novellus Systems, Inc. Method for active wafer centering using a single sensor
KR100562503B1 (ko) * 2003-07-07 2006-03-21 삼성전자주식회사 반도체 척의 수평을 측정하기 위한 장치
US6914337B2 (en) * 2003-11-04 2005-07-05 Taiwan Semiconductor Manufacturing Co., Ltd Calibration wafer and kit
JP2005150224A (ja) * 2003-11-12 2005-06-09 Nec Electronics Corp プローブ情報を用いた半導体検査装置及び検査方法
DE102007025304B4 (de) * 2007-05-30 2009-02-26 Vistec Semiconductor Systems Gmbh Verfahren zur Verbesserung der Reproduzierbarkeit einer Koordinaten-Messmaschine und deren Genauigkeit
CN101629808B (zh) * 2008-07-14 2011-05-18 京元电子股份有限公司 探针卡校正设备
JP5529605B2 (ja) * 2010-03-26 2014-06-25 東京エレクトロン株式会社 ウエハチャックの傾き補正方法及びプローブ装置
JP5737536B2 (ja) * 2013-11-21 2015-06-17 株式会社東京精密 プローバ
KR102396428B1 (ko) * 2014-11-11 2022-05-11 삼성전자주식회사 반도체 테스트 장치 및 방법

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4052793A (en) * 1976-10-04 1977-10-11 International Business Machines Corporation Method of obtaining proper probe alignment in a multiple contact environment
JPS6362245A (ja) * 1986-09-02 1988-03-18 Canon Inc ウエハプロ−バ

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100703378B1 (ko) * 2005-07-08 2007-04-03 엘지전자 주식회사 디스크 매체의 라벨면에 인쇄하는 방법 및 장치
KR100704079B1 (ko) * 2005-07-08 2007-04-06 엘지전자 주식회사 빔의 크기를 변화시켜 디스크 매체의 라벨면에 인쇄하는방법 및 장치
KR100704078B1 (ko) * 2005-07-08 2007-04-06 엘지전자 주식회사 디스크 매체의 라벨면에 인쇄하는 방법 및 장치

Also Published As

Publication number Publication date
US4934064A (en) 1990-06-19

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