JPS5612744A - Wafer prober - Google Patents

Wafer prober

Info

Publication number
JPS5612744A
JPS5612744A JP8856979A JP8856979A JPS5612744A JP S5612744 A JPS5612744 A JP S5612744A JP 8856979 A JP8856979 A JP 8856979A JP 8856979 A JP8856979 A JP 8856979A JP S5612744 A JPS5612744 A JP S5612744A
Authority
JP
Japan
Prior art keywords
wafer
stylus
prober
polishing
probe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8856979A
Other languages
Japanese (ja)
Other versions
JPS5759668B2 (en
Inventor
Yoshie Hasegawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP8856979A priority Critical patent/JPS5612744A/en
Publication of JPS5612744A publication Critical patent/JPS5612744A/en
Publication of JPS5759668B2 publication Critical patent/JPS5759668B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Abstract

PURPOSE:To rationalize the process eliminating poor contact or the like in the probing process by arranging a polishing (washing) means within the maximum movement range of a wafer chuck top and at a part excluding the wafer placing surface. CONSTITUTION:A polishing base 3 (or washing section) made of a ceramic plate or the like having a rough surface at a part excluding the surface for placing the wafer 2 on a wafer chuck top 1. A probe stylus 6 mounted on a probe card 4 is moved pressing against the polishing base whereby an aluminum oxide, dirt or marking ink attached to the tip of the probe stylus tip is removed. Thus, it is possible to fully deliver the function of automatic wafer prober without stopping of the probing action due to poor contact of the prober stylus.
JP8856979A 1979-07-12 1979-07-12 Wafer prober Granted JPS5612744A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8856979A JPS5612744A (en) 1979-07-12 1979-07-12 Wafer prober

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8856979A JPS5612744A (en) 1979-07-12 1979-07-12 Wafer prober

Publications (2)

Publication Number Publication Date
JPS5612744A true JPS5612744A (en) 1981-02-07
JPS5759668B2 JPS5759668B2 (en) 1982-12-15

Family

ID=13946488

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8856979A Granted JPS5612744A (en) 1979-07-12 1979-07-12 Wafer prober

Country Status (1)

Country Link
JP (1) JPS5612744A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4751458A (en) * 1984-04-02 1988-06-14 American Telephone And Telegraph Company, At&T Bell Laboratories Test pads for integrated circuit chips
JPS64742A (en) * 1987-03-24 1989-01-05 Tokyo Electron Ltd Probing device
US6024629A (en) * 1997-01-22 2000-02-15 Tokyo Electron Limited Probe apparatus and a method for polishing a probe

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6183969U (en) * 1984-11-06 1986-06-03

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4751458A (en) * 1984-04-02 1988-06-14 American Telephone And Telegraph Company, At&T Bell Laboratories Test pads for integrated circuit chips
JPS64742A (en) * 1987-03-24 1989-01-05 Tokyo Electron Ltd Probing device
US6024629A (en) * 1997-01-22 2000-02-15 Tokyo Electron Limited Probe apparatus and a method for polishing a probe

Also Published As

Publication number Publication date
JPS5759668B2 (en) 1982-12-15

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