JPS5795645A - Probing device - Google Patents

Probing device

Info

Publication number
JPS5795645A
JPS5795645A JP17161280A JP17161280A JPS5795645A JP S5795645 A JPS5795645 A JP S5795645A JP 17161280 A JP17161280 A JP 17161280A JP 17161280 A JP17161280 A JP 17161280A JP S5795645 A JPS5795645 A JP S5795645A
Authority
JP
Japan
Prior art keywords
wafer
guide plate
stage
needle
probing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17161280A
Other languages
Japanese (ja)
Inventor
Minoru Takagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP17161280A priority Critical patent/JPS5795645A/en
Publication of JPS5795645A publication Critical patent/JPS5795645A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Abstract

PURPOSE:To facilitate positioning while preventing the increase of contact resistance by guiding an orientation flat of a wafer onto a mounting stage and mounting a grinding plate griding a tip of a probing needle. CONSTITUTION:A guide plate 2 is set up previously onto the stage 1 of the probing device while being beforehand conformed in the direction that the wafer 4 is attached, and the wafer 4 is fitted so that the orientation flat contacts with a side 3 of the guide plate 2. The guide plate 2 has the quality of material of metal or china or the like with the same thickness as the wafer 4, and the tip of the probing needle can be ground mechanically when the needle is contacted. Accordingly, work which parallels the direction of movement of the stage and the direction of arrangement of an element on the wafer is facilitated while the probing needle is ground during measuring work and the increase of the contact resistance can be prevented.
JP17161280A 1980-12-05 1980-12-05 Probing device Pending JPS5795645A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17161280A JPS5795645A (en) 1980-12-05 1980-12-05 Probing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17161280A JPS5795645A (en) 1980-12-05 1980-12-05 Probing device

Publications (1)

Publication Number Publication Date
JPS5795645A true JPS5795645A (en) 1982-06-14

Family

ID=15926393

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17161280A Pending JPS5795645A (en) 1980-12-05 1980-12-05 Probing device

Country Status (1)

Country Link
JP (1) JPS5795645A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01276191A (en) * 1988-04-28 1989-11-06 Tokyo Electron Ltd Liquid crystal display body inspecting instrument
JPH0726772U (en) * 1993-08-27 1995-05-19 日本電子材料株式会社 Polishing plate for probe tip cleaning

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01276191A (en) * 1988-04-28 1989-11-06 Tokyo Electron Ltd Liquid crystal display body inspecting instrument
JPH0726772U (en) * 1993-08-27 1995-05-19 日本電子材料株式会社 Polishing plate for probe tip cleaning

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