JPS51136484A - Solder wetting ability test device - Google Patents

Solder wetting ability test device

Info

Publication number
JPS51136484A
JPS51136484A JP5974175A JP5974175A JPS51136484A JP S51136484 A JPS51136484 A JP S51136484A JP 5974175 A JP5974175 A JP 5974175A JP 5974175 A JP5974175 A JP 5974175A JP S51136484 A JPS51136484 A JP S51136484A
Authority
JP
Japan
Prior art keywords
wetting ability
test device
ability test
solder wetting
gauge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5974175A
Other languages
Japanese (ja)
Other versions
JPS582375B2 (en
Inventor
Ichiro Ishi
Masaru Sakaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP5974175A priority Critical patent/JPS582375B2/en
Publication of JPS51136484A publication Critical patent/JPS51136484A/en
Publication of JPS582375B2 publication Critical patent/JPS582375B2/en
Expired legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N13/00Investigating surface or boundary effects, e.g. wetting power; Investigating diffusion effects; Analysing materials by determining surface, boundary, or diffusion effects
    • G01N13/02Investigating surface tension of liquids
    • G01N2013/0225Investigating surface tension of liquids of liquid metals or solder

Landscapes

  • Testing Resistance To Weather, Investigating Materials By Mechanical Methods (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)

Abstract

PURPOSE: To improve precision in measuring wetting ability and to aim at high efficiency of measuring work by making initial strain value on a strain gauge to be a constant by an automatic control. The initial strain value on the gauge is defferent due to different weight of material.
COPYRIGHT: (C)1976,JPO&Japio
JP5974175A 1975-05-21 1975-05-21 Handanure Seishiken Sochi Expired JPS582375B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5974175A JPS582375B2 (en) 1975-05-21 1975-05-21 Handanure Seishiken Sochi

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5974175A JPS582375B2 (en) 1975-05-21 1975-05-21 Handanure Seishiken Sochi

Publications (2)

Publication Number Publication Date
JPS51136484A true JPS51136484A (en) 1976-11-25
JPS582375B2 JPS582375B2 (en) 1983-01-17

Family

ID=13121939

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5974175A Expired JPS582375B2 (en) 1975-05-21 1975-05-21 Handanure Seishiken Sochi

Country Status (1)

Country Link
JP (1) JPS582375B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996020398A1 (en) * 1994-12-28 1996-07-04 Nihon Almit Co., Ltd. Solder wettability measuring instrument
KR100438354B1 (en) * 2002-03-27 2004-07-02 서울대학교 공과대학 교육연구재단 Method to estimate wettability of UBM coated on one side of sample to molten solder using Wetting Balance Test

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996020398A1 (en) * 1994-12-28 1996-07-04 Nihon Almit Co., Ltd. Solder wettability measuring instrument
KR100438354B1 (en) * 2002-03-27 2004-07-02 서울대학교 공과대학 교육연구재단 Method to estimate wettability of UBM coated on one side of sample to molten solder using Wetting Balance Test

Also Published As

Publication number Publication date
JPS582375B2 (en) 1983-01-17

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