JPS5458294A - Waxless polishing device - Google Patents
Waxless polishing deviceInfo
- Publication number
- JPS5458294A JPS5458294A JP12450377A JP12450377A JPS5458294A JP S5458294 A JPS5458294 A JP S5458294A JP 12450377 A JP12450377 A JP 12450377A JP 12450377 A JP12450377 A JP 12450377A JP S5458294 A JPS5458294 A JP S5458294A
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- wafer
- supporting plate
- supporting
- driving shaft
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE:Without using the adhesive wax to the semi conductor wafer, super polishing is effected by holding the supporting plate with the form of convex feature in the neighborhood of the wafer holding surface. By doing so, polishing characteristics can be improved. CONSTITUTION:A polishing table 1 is rotated by a driving shaft 2 and in the polishing surface the polishing cloth 3 is sticked. In the counter side of the polishing table 1, a wafer supporting plate 5 attached in a driving shaft 4 for the wafer supporting plate having the eccentric position, is installed. In the supporting surface of the plate 5, a retainer 6 for the wafer supporting is provided and the projected retainer changes its vertical movement automatically by a spring 7. A neighboring portion 5a of the wafer supporting surface is formed in the convex feature and a wafer to be polished 9 is supported through a pad 8 for obtaining the polishing surface with improved and flatness accuracy.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12450377A JPS5458294A (en) | 1977-10-19 | 1977-10-19 | Waxless polishing device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12450377A JPS5458294A (en) | 1977-10-19 | 1977-10-19 | Waxless polishing device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5458294A true JPS5458294A (en) | 1979-05-10 |
JPS6117627B2 JPS6117627B2 (en) | 1986-05-08 |
Family
ID=14887093
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12450377A Granted JPS5458294A (en) | 1977-10-19 | 1977-10-19 | Waxless polishing device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5458294A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56146667A (en) * | 1980-04-18 | 1981-11-14 | Hitachi Ltd | Mirror surface grinder |
JPS56157036A (en) * | 1980-05-09 | 1981-12-04 | Nec Corp | Simultaneous working of both faces of wafer |
US5573448A (en) * | 1993-08-18 | 1996-11-12 | Shin-Etsu Handotai Co., Ltd. | Method of polishing wafers, a backing pad used therein, and method of making the backing pad |
US5584751A (en) * | 1995-02-28 | 1996-12-17 | Mitsubishi Materials Corporation | Wafer polishing apparatus |
-
1977
- 1977-10-19 JP JP12450377A patent/JPS5458294A/en active Granted
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56146667A (en) * | 1980-04-18 | 1981-11-14 | Hitachi Ltd | Mirror surface grinder |
JPS6365473B2 (en) * | 1980-04-18 | 1988-12-15 | ||
JPS56157036A (en) * | 1980-05-09 | 1981-12-04 | Nec Corp | Simultaneous working of both faces of wafer |
US5573448A (en) * | 1993-08-18 | 1996-11-12 | Shin-Etsu Handotai Co., Ltd. | Method of polishing wafers, a backing pad used therein, and method of making the backing pad |
US5584751A (en) * | 1995-02-28 | 1996-12-17 | Mitsubishi Materials Corporation | Wafer polishing apparatus |
Also Published As
Publication number | Publication date |
---|---|
JPS6117627B2 (en) | 1986-05-08 |
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