JPS5458294A - Waxless polishing device - Google Patents

Waxless polishing device

Info

Publication number
JPS5458294A
JPS5458294A JP12450377A JP12450377A JPS5458294A JP S5458294 A JPS5458294 A JP S5458294A JP 12450377 A JP12450377 A JP 12450377A JP 12450377 A JP12450377 A JP 12450377A JP S5458294 A JPS5458294 A JP S5458294A
Authority
JP
Japan
Prior art keywords
polishing
wafer
supporting plate
supporting
driving shaft
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12450377A
Other languages
Japanese (ja)
Other versions
JPS6117627B2 (en
Inventor
Takashi Shimura
Shinichiro Miyoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP12450377A priority Critical patent/JPS5458294A/en
Publication of JPS5458294A publication Critical patent/JPS5458294A/en
Publication of JPS6117627B2 publication Critical patent/JPS6117627B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE:Without using the adhesive wax to the semi conductor wafer, super polishing is effected by holding the supporting plate with the form of convex feature in the neighborhood of the wafer holding surface. By doing so, polishing characteristics can be improved. CONSTITUTION:A polishing table 1 is rotated by a driving shaft 2 and in the polishing surface the polishing cloth 3 is sticked. In the counter side of the polishing table 1, a wafer supporting plate 5 attached in a driving shaft 4 for the wafer supporting plate having the eccentric position, is installed. In the supporting surface of the plate 5, a retainer 6 for the wafer supporting is provided and the projected retainer changes its vertical movement automatically by a spring 7. A neighboring portion 5a of the wafer supporting surface is formed in the convex feature and a wafer to be polished 9 is supported through a pad 8 for obtaining the polishing surface with improved and flatness accuracy.
JP12450377A 1977-10-19 1977-10-19 Waxless polishing device Granted JPS5458294A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12450377A JPS5458294A (en) 1977-10-19 1977-10-19 Waxless polishing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12450377A JPS5458294A (en) 1977-10-19 1977-10-19 Waxless polishing device

Publications (2)

Publication Number Publication Date
JPS5458294A true JPS5458294A (en) 1979-05-10
JPS6117627B2 JPS6117627B2 (en) 1986-05-08

Family

ID=14887093

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12450377A Granted JPS5458294A (en) 1977-10-19 1977-10-19 Waxless polishing device

Country Status (1)

Country Link
JP (1) JPS5458294A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56146667A (en) * 1980-04-18 1981-11-14 Hitachi Ltd Mirror surface grinder
JPS56157036A (en) * 1980-05-09 1981-12-04 Nec Corp Simultaneous working of both faces of wafer
US5573448A (en) * 1993-08-18 1996-11-12 Shin-Etsu Handotai Co., Ltd. Method of polishing wafers, a backing pad used therein, and method of making the backing pad
US5584751A (en) * 1995-02-28 1996-12-17 Mitsubishi Materials Corporation Wafer polishing apparatus

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56146667A (en) * 1980-04-18 1981-11-14 Hitachi Ltd Mirror surface grinder
JPS6365473B2 (en) * 1980-04-18 1988-12-15
JPS56157036A (en) * 1980-05-09 1981-12-04 Nec Corp Simultaneous working of both faces of wafer
US5573448A (en) * 1993-08-18 1996-11-12 Shin-Etsu Handotai Co., Ltd. Method of polishing wafers, a backing pad used therein, and method of making the backing pad
US5584751A (en) * 1995-02-28 1996-12-17 Mitsubishi Materials Corporation Wafer polishing apparatus

Also Published As

Publication number Publication date
JPS6117627B2 (en) 1986-05-08

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