JPS56157036A - Simultaneous working of both faces of wafer - Google Patents

Simultaneous working of both faces of wafer

Info

Publication number
JPS56157036A
JPS56157036A JP6143280A JP6143280A JPS56157036A JP S56157036 A JPS56157036 A JP S56157036A JP 6143280 A JP6143280 A JP 6143280A JP 6143280 A JP6143280 A JP 6143280A JP S56157036 A JPS56157036 A JP S56157036A
Authority
JP
Japan
Prior art keywords
wafer
faces
surface plate
abrasive
convex
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6143280A
Other languages
Japanese (ja)
Inventor
Michio Ishikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP6143280A priority Critical patent/JPS56157036A/en
Publication of JPS56157036A publication Critical patent/JPS56157036A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

PURPOSE:To work the both faces of the wafer having favorable precision to form mirror faces in parallel without distortion by a method wherein the wafer is inserted between abrasive cloths having convex shape at the center part, and the wafer and the abrasive cloths are made to move sliding with each other. CONSTITUTION:The wafer 1' and a carrier 2 are inserted between a lower abrasive cloth 9 adhered being curved to a convex-shaped lower surface plate 7 having a circular arc type section at the radial directonal upper face and an upper abrasive cloth 10 adhered to an upper surface plate 8 the same with the lower surface plate and confronting convex faces with each other. The upper and the lower surface plates are made to rotate concentrically around the rotational center in the opposite rotational directions A', B', and simultaneously the carrier 2' is made to revolve making a rotation performing relative sliding motion between the wafer 1' and the upper and the lower abrasive cloths to polish the both faces of the wafer simultaneously. Accordingly the both faces of the wafer can be worked to form the parallel faces without distortion.
JP6143280A 1980-05-09 1980-05-09 Simultaneous working of both faces of wafer Pending JPS56157036A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6143280A JPS56157036A (en) 1980-05-09 1980-05-09 Simultaneous working of both faces of wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6143280A JPS56157036A (en) 1980-05-09 1980-05-09 Simultaneous working of both faces of wafer

Publications (1)

Publication Number Publication Date
JPS56157036A true JPS56157036A (en) 1981-12-04

Family

ID=13170894

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6143280A Pending JPS56157036A (en) 1980-05-09 1980-05-09 Simultaneous working of both faces of wafer

Country Status (1)

Country Link
JP (1) JPS56157036A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4805348A (en) * 1985-07-31 1989-02-21 Speedfam Co., Ltd. Flat lapping machine

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5458294A (en) * 1977-10-19 1979-05-10 Hitachi Ltd Waxless polishing device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5458294A (en) * 1977-10-19 1979-05-10 Hitachi Ltd Waxless polishing device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4805348A (en) * 1985-07-31 1989-02-21 Speedfam Co., Ltd. Flat lapping machine

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