JPS6393561A - Method of grinding one side by both-side grinding device - Google Patents
Method of grinding one side by both-side grinding deviceInfo
- Publication number
- JPS6393561A JPS6393561A JP61239623A JP23962386A JPS6393561A JP S6393561 A JPS6393561 A JP S6393561A JP 61239623 A JP61239623 A JP 61239623A JP 23962386 A JP23962386 A JP 23962386A JP S6393561 A JPS6393561 A JP S6393561A
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- carrier
- surface plate
- workpieces
- elastic member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 10
- 238000005498 polishing Methods 0.000 claims description 32
- 239000004744 fabric Substances 0.000 claims description 4
- 239000003082 abrasive agent Substances 0.000 abstract description 3
- 238000003754 machining Methods 0.000 abstract 1
- 230000035939 shock Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 description 5
- 238000007517 polishing process Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 101100258233 Caenorhabditis elegans sun-1 gene Proteins 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は脆性材の片面研磨加工に係わり、両面研磨装置
を用いて片面を研磨加工をする力旧二方法に閃するもの
である。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to single-sided polishing of brittle materials, and is inspired by two old methods of polishing one side using a double-sided polishing device.
従来の両面研磨装置を用いて片面を研磨する方法として
、研磨布を貼った上定盤および下定盤の間にキャリアを
配置し、キャリアに穿孔した液加］−物装置孔の中間に
中間片を挿入した２枚の被加工物をに行し、上定盤、下
定盤およびキャリアを相対的に回転、移動させて被加工
物の片面を研磨加工を行なっていた。As a method of polishing one side using a conventional double-sided polishing device, a carrier is placed between an upper surface plate and a lower surface plate covered with polishing cloth, and an intermediate piece is placed between the holes in the carrier. The two workpieces inserted into the workpiece are placed in a row, and the upper surface plate, lower surface plate, and carrier are rotated and moved relative to each other to polish one side of the workpiece.
しかしながら、この従来方法では、特に薄い脆性拐料の
被加工物を研磨加工するき、被加工物２枚分の慣性でキ
ャリアに穿孔した彼方旧二物装着孔゛の端面と被加工物
が当接し、被加工物にクラックが入ったり、われたりす
るという欠点があった。However, in this conventional method, when polishing a particularly thin and brittle workpiece, the inertia of the two workpieces causes the end face of the old two-piece attachment hole drilled in the carrier to contact the workpiece. This has the disadvantage that the workpiece may crack or break if the material comes into contact with the material.
また、この欠点のために定盤の研磨圧力や回転数を上げ
ることができず、効率的な研磨加工ができ工いという問
題を有していた。Furthermore, due to this drawback, it is not possible to increase the polishing pressure or rotation speed of the surface plate, resulting in the problem that efficient polishing cannot be performed.
本発明は上記従来の問題点を解決するためになされたも
のであり、その目的は、両面研磨装置を用いた片面研磨
方法において液加二Ｅ物かわれることがなく効率的に加
にをすることができる研磨方法を提供すると吉にある。The present invention has been made in order to solve the above-mentioned conventional problems, and its purpose is to efficiently add liquid in a single-sided polishing method using a double-sided polishing device without changing the liquid adding material. We hope to provide a polishing method that can do this.
本発明は研磨布を設けた」二定盤および下定盤の間にキ
ャリアを配置し前記キャリアの被加工物装着孔に被加工
物を装着し前記上定盤および下定盤とキャリアを相対的
に回転・移動させて被加工物の両面を同時に研磨加工す
る両面研磨装置を用いｉｉｉ＋ｆｉ己キャリアの波力１
月二物装着孔に装着する２枚の被加工物の間に中間片を
挿入し２枚の被加工物の定盤に対向する側のそれぞれの
片面を研磨加工するようにした両面研磨装置による片面
研磨方法に・おいて、被加工物と当接するキャリアの液
加二り物装着孔端面に弾性部拐を設けたことを特徴とず
〔実施例〕
以下に本発明の一実施例を第１図および第２図にて説明
する。In the present invention, a carrier is disposed between a second surface plate and a lower surface plate provided with an abrasive cloth, a workpiece is mounted in a workpiece mounting hole of the carrier, and the carrier is relative to the upper surface plate and the lower surface plate. Using a double-sided polishing device that rotates and moves both sides of the workpiece at the same time, the wave force of the iii + fi self-carrier 1
A double-sided polishing device in which an intermediate piece is inserted between two workpieces that are attached to the two-piece mounting hole, and one side of each of the two workpieces facing the surface plate is polished. In the single-sided polishing method, an elastic part is provided on the end surface of the liquid-filling object mounting hole of the carrier that comes into contact with the workpiece [Example] An example of the present invention will be described below. This will be explained with reference to FIGS. 1 and 2.
本発明の研磨方法は第１図に示すような研磨装置におい
て実施される。すなわち、円盤状の上定盤１および下定
盤２には研磨布３が接着剤により貼付けられ、図示はし
ていないがそれぞれ共通回転軸のまわりに独立して回転
できるように設けられている。上定盤１および下定盤２
の中心位置には太陽１ツ、１車４が、また外側にはイン
ターリール歯車５が配設され、これらの両歯車は共通の
回転軸のまわりを回転できるようにされている。また、
下定盤２は装置ノ；（台に回転可能に支持され、上定盤
１は装置基台の上方から回転可能にかつ上下動可能に盾
小保持されている。The polishing method of the present invention is carried out in a polishing apparatus as shown in FIG. That is, polishing cloths 3 are attached to the disk-shaped upper surface plate 1 and lower surface plate 2 with adhesive, and are provided so that they can rotate independently around a common rotation axis, although not shown. Upper surface plate 1 and lower surface plate 2
A sun 1 and a wheel 4 are disposed at the center of the rotor, and an interreel gear 5 is disposed on the outside thereof, and these two gears can rotate around a common rotation axis. Also,
The lower surface plate 2 is rotatably supported by the device base, and the upper surface plate 1 is supported from above the device base so as to be rotatable and vertically movable.
土足（１１目および下定盤２の間には被加工物を保持す
る−１−ヤリアロが配設されている。キャリア６の外周
部にはθ、■か刻設され、太陽歯車４およびインターナ
ルギア５きかみ合って、上下定９１１間で遊星運動され
るようになっている。-1-Yariaro for holding the workpiece is arranged between the 11th stitch and the lower surface plate 2. θ and ■ are carved on the outer periphery of the carrier 6, and the sun gear 4 and internal gear 5 mesh with each other to cause planetary movement between the upper and lower positions 911.
キャリア６は第２図に示すように被加工物装着孔７が穿
設され、この被加工物装着孔７の端面、つまり、液加］
二物との当接面に弾性部材８が設りられている。この弾
性部材８の外周は被加工物に対シて０．３〜１．０ｍｍ
のクリアランスを持つように設定されている。弾性部Ｈ
の祠質としてはゴム、ビニール等が用いられ、コノ１硬
度で５０〜９０度で、厚さが０．５〜２ｍｍ程度のもの
が好Δである。また、弾性部材８はキャリア６に接着剤
または焼き付けにより十分の強度で接着保持されている
。The carrier 6 is provided with a workpiece mounting hole 7 as shown in FIG.
An elastic member 8 is provided on the contact surface with the two objects. The outer circumference of this elastic member 8 is 0.3 to 1.0 mm relative to the workpiece.
clearance. Elastic part H
Rubber, vinyl, etc. are used as the abrasive material, and a preferable Δ is one with a Kono 1 hardness of 50 to 90 degrees and a thickness of about 0.5 to 2 mm. Further, the elastic member 8 is adhered and held to the carrier 6 with sufficient strength by adhesive or baking.
このような構成により、キャリア６の被加工物装着孔７
に、中間に被加工物９と同形の中間片１０を挿入した２
枚の液加ユニ物９が’ＡＭされ、土足９１０、下定盤２
、キャリア６が回転移動し、」二下定盤間に研磨材が供
給され研磨加工が行なわれる。この研磨加工によるキャ
リア６の回転移動に′ともない、中間片１０と一体吉な
−、た２（りの〜ξ加工物９がキャリア６の弾性部材８
に大きな慣性力をもって当接する。ところが、この慣性
力は弾性部材８に吸収されるため被加工物にクラックが
入ったり、割れまで進行することがない。With such a configuration, the workpiece mounting hole 7 of the carrier 6
2, in which an intermediate piece 10 having the same shape as the workpiece 9 is inserted in the middle.
The liquid adding unit 9 is 'AM'ed, the foot 910, and the lower surface plate 2.
, the carrier 6 rotates and moves, and abrasive material is supplied between the two lower surface plates to perform the polishing process. With the rotational movement of the carrier 6 due to this polishing process, the intermediate piece 10 and the workpiece 9 are integrally connected to the elastic member 8 of the carrier 6.
It comes into contact with a large inertial force. However, since this inertial force is absorbed by the elastic member 8, the workpiece does not crack or progress to cracking.
なお、本発明にかかわる被加工物としては、ガラス板、
セラミック、Ｓｉ単結晶板等の脆（，０，５〜１．５ｍ
ｍ程度の薄板において有効である。Note that the workpieces related to the present invention include glass plates,
Brittle ceramics, Si single crystal plates, etc. (0.5 to 1.5 m
It is effective for thin plates of about 300 yen.
以」二連へたように、本発明では両面研磨装置を用いて
片面を研磨加工する加工方法において、キャリアの被加
工物と当接する端面に弾性部月を設けたことにより、研
磨加工中における被加工物への衝撃力を吸収することが
でき、クラックやわれを生ずることがなく良好な研磨加
工をすることができる。このため、特に衝撃力に弱い博
物の研磨加工には効果が絶大である。As described above, in the present invention, in the processing method of polishing one side using a double-sided polishing device, an elastic portion is provided on the end surface of the carrier that comes into contact with the workpiece, thereby improving the polishing process. It can absorb the impact force on the workpiece, and can perform good polishing without causing cracks or breaks. Therefore, it is particularly effective for polishing natural materials that are susceptible to impact forces.
さらに、被加工物への衝撃力を吸収することができるた
め、定盤の研磨圧力や回転数を一ヒげて、研磨効率を向
」ニさせることができ、生産能力の向上につながる。Furthermore, since it can absorb the impact force on the workpiece, the polishing pressure and rotation speed of the surface plate can be increased, improving polishing efficiency and leading to improved production capacity.
第１図は本発明の研磨方法の加工時におりる状態図、第
２図は本発明に係わるキャリアの平面図。
１・・・上定盤 ２・・・下定盤
３・・・研磨布 ４・・・太陽歯車５・・・インタ
ーナルギア
６・・・キャリア ７・・・被加工物装置孔８・・・
弾性部材 ９・・・被加工物１０・・・中間片
以上FIG. 1 is a state diagram during processing in the polishing method of the present invention, and FIG. 2 is a plan view of a carrier according to the present invention. 1... Upper surface plate 2... Lower surface plate 3... Polishing cloth 4... Sun gear 5... Internal gear 6... Carrier 7... Workpiece device hole 8...
Elastic member 9... Workpiece 10... Intermediate piece or more
Claims (1)
アを配置し、前記キャリアの被加工物装着孔に被加工物
を装着し前記上定盤および前記下定盤と前記キャリアを
相対的に回転・移動させて前記被加工物の両面を同時に
研磨加工する。両面研磨装置を用い前記キャリアの前記
被加工物装着孔に装着する２枚の前記被加工物の間に中
間片を挿入し、２枚の前記被加工物の前記上、下定盤に
対向する側のそれぞれの片面を研磨加工するようにした
両面研磨装置による片面研磨方法において、前記被加工
物と当接する前記キャリアの前記被加工物装着孔端面に
弾性部材を設けたキャリアを使用し片面研磨を行なうこ
とを特徴とする両面研磨装置の片面研磨方法。(1) A carrier is placed between an upper surface plate and a lower surface plate provided with a polishing cloth, a workpiece is mounted in the workpiece mounting hole of the carrier, and the upper surface plate and the lower surface plate are relative to each other. The workpiece is rotated and moved to polish both sides of the workpiece at the same time. An intermediate piece is inserted between the two workpieces to be mounted in the workpiece mounting hole of the carrier using a double-sided polishing device, and the side of the two workpieces facing the upper and lower surface plates is In the single-sided polishing method using a double-sided polishing apparatus, the single-sided polishing method uses a carrier in which an elastic member is provided on the end surface of the workpiece attachment hole of the carrier that comes into contact with the workpiece. A method for single-sided polishing using a double-sided polishing device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61239623A JPS6393561A (en) | 1986-10-08 | 1986-10-08 | Method of grinding one side by both-side grinding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61239623A JPS6393561A (en) | 1986-10-08 | 1986-10-08 | Method of grinding one side by both-side grinding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6393561A true JPS6393561A (en) | 1988-04-23 |
Family
ID=17047478
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61239623A Pending JPS6393561A (en) | 1986-10-08 | 1986-10-08 | Method of grinding one side by both-side grinding device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6393561A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006289517A (en) * | 2005-04-06 | 2006-10-26 | Nitta Haas Inc | Holding member for object to be polished |
| JP2008149417A (en) * | 2006-12-19 | 2008-07-03 | Agc Techno Glass Co Ltd | Method of grinding platelike glass optical element |
| JP2012051039A (en) * | 2010-08-31 | 2012-03-15 | Nippon Electric Glass Co Ltd | Method of manufacturing glass thin sheet |
-
1986
- 1986-10-08 JP JP61239623A patent/JPS6393561A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006289517A (en) * | 2005-04-06 | 2006-10-26 | Nitta Haas Inc | Holding member for object to be polished |
| JP4708831B2 (en) * | 2005-04-06 | 2011-06-22 | ニッタ・ハース株式会社 | Workpiece holding member |
| JP2008149417A (en) * | 2006-12-19 | 2008-07-03 | Agc Techno Glass Co Ltd | Method of grinding platelike glass optical element |
| JP2012051039A (en) * | 2010-08-31 | 2012-03-15 | Nippon Electric Glass Co Ltd | Method of manufacturing glass thin sheet |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2006198701A (en) | Double-disc plane polishing device | |
| JPS6393561A (en) | Method of grinding one side by both-side grinding device | |
| JP2000218482A (en) | Paper sheet type end face polsher | |
| JP2552305B2 (en) | Double side polishing machine | |
| JPS61192460A (en) | Grinding method for end face of optical connector core into convex spherical surface | |
| JP2552306B2 (en) | Single side polishing machine | |
| CN213439026U (en) | Novel turnover backlight glass sweeping machine | |
| JPH0479790B2 (en) | ||
| JP2001179600A (en) | Dresser | |
| JPH10315121A (en) | Surface grinding device | |
| JP2000198068A (en) | Sheet type polishing machine | |
| RU2095222C1 (en) | Method and abrasive disk for machining sides of plates | |
| JPH012861A (en) | polishing equipment | |
| JPH0425372A (en) | Double face polishing device | |
| JPH04261768A (en) | Double-side lapping device | |
| JP2003326455A (en) | Holder for object to be polished | |
| JPH02145257A (en) | Dressing device for grindstone in parallel plane honing machine | |
| JPS63300857A (en) | Polisher | |
| JPH03148124A (en) | Holding mechanism for wafer | |
| JPH081489A (en) | Both corner edge chamfering method for plate material and its device | |
| JP2000198064A (en) | Polishing machine carrier | |
| JPS6133851A (en) | Multi-face symultaneous machining device | |
| JPH10308369A (en) | Notch part polishing device and polishing materials which are used for that device | |
| JPS591162A (en) | Duplex grinding polishing device | |
| JPH0623659A (en) | Method and device for polishing sheet material |