JPS642861A - Polishing device - Google Patents

Polishing device

Info

Publication number
JPS642861A
JPS642861A JP62130088A JP13008887A JPS642861A JP S642861 A JPS642861 A JP S642861A JP 62130088 A JP62130088 A JP 62130088A JP 13008887 A JP13008887 A JP 13008887A JP S642861 A JPS642861 A JP S642861A
Authority
JP
Japan
Prior art keywords
reverse
obverse
workpiece
carrier
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62130088A
Other languages
Japanese (ja)
Other versions
JPH012861A (en
Inventor
Kesahiro Koike
Kazufumi Asakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hoya Corp
Original Assignee
Hoya Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoya Corp filed Critical Hoya Corp
Priority to JP62-130088A priority Critical patent/JPH012861A/en
Priority claimed from JP62-130088A external-priority patent/JPH012861A/en
Publication of JPS642861A publication Critical patent/JPS642861A/en
Publication of JPH012861A publication Critical patent/JPH012861A/en
Pending legal-status Critical Current

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

PURPOSE:To improve the degree of flatness of a workpiece by supporting a carrier in its reverse peripheral part by a sun gear and an internal gear and positioning this carrier being separated respectively from polishing surfaces of, upper and bottom surface plates so that an abrasive agent can be well supplied to obverse and reverse surfaces of the workpiece. CONSTITUTION:A polishing device, supporting the reverse peripheral part of a carrier 7 to a sun gear 8 and an internal gear 9, separates obverse and reverse sides of the carrier 7 from polishing surfaces (abrasive cloth) 2, 3 of upper and bottom surface plates 4 and 5. As a result, the device, supplying an adhesive agent 10 well further sufficiently to both obverse and reverse of a workpiece 6, enables polishing amounts per unit time for these obverse and reverse to be almost equally obtained, accordingly the workpiece 6 enables its degree of flatness to be improved by enabling the generation of a rugged surface to be suppressed.
JP62-130088A 1987-03-30 1987-05-27 polishing equipment Pending JPH012861A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62-130088A JPH012861A (en) 1987-03-30 1987-05-27 polishing equipment

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP7444887 1987-03-30
JP62-74448 1987-03-30
JP62-130088A JPH012861A (en) 1987-03-30 1987-05-27 polishing equipment

Publications (2)

Publication Number Publication Date
JPS642861A true JPS642861A (en) 1989-01-06
JPH012861A JPH012861A (en) 1989-01-06

Family

ID=

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0425376A (en) * 1990-05-16 1992-01-29 Showa Alum Corp Polishing device
US7455785B2 (en) 2002-03-29 2008-11-25 Hoya Corporation Method of determining a flatness of an electronic device substrate, method of producing the substrate, method of producing a mask blank, method of producing a transfer mask, polishing method, electronic device substrate, mask blank, transfer mask, and polishing apparatus
JP2010099830A (en) * 2008-10-22 2010-05-06 Siltronic Ag Device for double-sided machining flat workpiece, and method of simultaneously cutting materials of plurality of semiconductor wafers in both faces

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0425376A (en) * 1990-05-16 1992-01-29 Showa Alum Corp Polishing device
US7455785B2 (en) 2002-03-29 2008-11-25 Hoya Corporation Method of determining a flatness of an electronic device substrate, method of producing the substrate, method of producing a mask blank, method of producing a transfer mask, polishing method, electronic device substrate, mask blank, transfer mask, and polishing apparatus
JP2010099830A (en) * 2008-10-22 2010-05-06 Siltronic Ag Device for double-sided machining flat workpiece, and method of simultaneously cutting materials of plurality of semiconductor wafers in both faces
US8512099B2 (en) 2008-10-22 2013-08-20 Siltronic Ag Method for the simultaneous double-sided material removal processing of a plurality of semiconductor wafers

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