JPH0425376A - Polishing device - Google Patents

Abstract

PURPOSE:To perform a lift motion on a polishing member without burdening a worker, by providing a carrier receiver which receives a carrier from the lower part in the state of the both gears of sun and internal gears being bitten, in the state of its projecting to a space side in the state of not impeding the lift of the polishing member. CONSTITUTION:A carrier 6 in the state of its being placed on the upper face of a polishing member 18 at its descent stage is abutted on carrier receivers 12, 13 at the peripheral edge thereof and borne thereon, when the polishing member 8 positioned in the annular space between both gears 4, 5 of sun and internal gears is descended in order to migrate to the lower position of the space. The carrier is held by the receiver after the bearing and only the polishing member is migrated downward. When the polishing member descended to the lower position of the annular space is ascended in order to migrate into the space, the polishing member bears the carrier with its abutment on the carrier lower face in the ascent stage and the carrier is separated upward from the carrier receiver.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a polishing apparatus for polishing a workpiece such as an aluminum substrate for a magnetic disk.

BACKGROUND ART Conventionally, as a polishing apparatus for polishing an aluminum substrate for a magnetic disk, for example, an apparatus (5) as shown in FIG.
1) is used.

The polishing device (51) in the figure includes a lower surface plate (53) which is rotatably held and has a donut-shaped grindstone (52) attached to the upper surface, and a lower surface plate (53) located above the lower surface plate (53). an upper surface plate (55) which is disposed coaxially with the surface plate (53) and is rotatably driven and movable up and down, and has a donut-shaped grindstone (54) attached to its lower surface; A sun gear (57) is arranged between the grinding wheels (52) and (54) at the axial center position of the grinding wheels, and an internal gear (59) is arranged concentrically at a position radially outward of the sun gear (57). )and,
The internal gear (59) and the sun gear (57) were meshed with each other and placed between the two gears (57) and (59) and placed on the grindstone (52) of the lower surface plate (53). It consists of an external gear-shaped work carrier (5B). In addition, this work carrier (56) is a magnetic disk substrate (
It has an eccentric circular holding hole (60) that follows the outer circumferential shape of the magnetic disk substrate (A).
) is arranged, and the top and bottom surfaces of the board are covered with carriers (5).
The plate thickness is formed to be thinner than that of the substrate (A) so that it protrudes outward from the holding hole (60) of 6).

In this polishing device (51), the upper surface plate (55)
The magnetic disk substrate (A) is inserted into the holding hole (60) of the work carrier (56) with the
The upper surface plate (55) is lowered and both sides of the magnetic disk substrate (A) are placed inside the upper and lower grinding wheels (52).
It is caught in (54). When the sun gear (57) is rotated in the pressurized state, the work carrier (56) is rotated and revolved around the sun gear (57), and the upper and lower surface plates (53) and (55) are also rotated. The magnetic disk substrate (A) is rotated, and both sides of the magnetic disk substrate (A) are polished. After polishing, the upper surface plate (55) is raised, the substrate (A) held by the carrier (56) is taken out, a new substrate is held by the carrier (56), and polishing is restarted. .

By the way, in the above polishing device (5I), the lower surface plate (
53) may be moved up and down between a position within the annular space between the sun and internal gears (57) and (59) and a position below the space.

For example, in an automatic polishing device researched and developed by the present inventors, that is, a device for achieving automation of loading and unloading of a substrate (A) into the above-mentioned rotation-revolution type polishing device (51), Loading the board (A),
The grindstone (5) on the lower surface plate (53) when unloading
2) Adopt a constant height position of the top surface.

In other words, if the lower surface plate (53) is a fixed type that does not move up and down, as the grinding wheel (52) is repeatedly sharpened, its thickness decreases and the height of the top surface of the grinding wheel (52) decreases. The height of the carrier (5B) gradually decreases, and the height of the carrier (5B) also decreases accordingly.

If the loading and unloading of the substrate (A) is to be automated under such conditions, the loading and unloading device is connected to the grinding wheel (52) on the lower surface plate (53).
) is equipped with a sensor that detects the height position of the top surface of the grinding wheel (52), and the device has a complicated control configuration in which the operating mode changes depending on the height of the top surface of the grindstone (52). There must be. Practical implementation of such a configuration is extremely difficult due to cost and other reasons.

Therefore, in order to pattern the operation of the loading and unloading device and simplify the configuration of the device for practical automation, even if the thickness of the grinding wheel (52) on the lower surface plate (53) is reduced, the grinding wheel (52) 52) The lower surface plate (53) can be moved up and down so that the upper surface of the lower surface plate (53) is located at a constant height during loading and unloading of substrates.

In that case, in order to accurately determine the height position of the upper surface of the grinding wheel (52), the lower surface plate (53) should be moved to the lower position of the space between the sun and internal gears (57) and (59). The upper surface of the grinding wheel (53) is lowered to a reference position for the upper surface of the grinding wheel (53) set at conduct.

In such a case, the lower surface plate (53) is connected to the gears (57) (59).
), the work carrier (5B) also moves below the space together with the lower surface plate (53), and the work carrier (56)
It comes off from both internal gears (57) and (59). If it comes off, the teeth of the work carrier (56) often cannot mesh well with the sun and internal gears (57) and (59) during the process of raising the lower surface plate (53).

To deal with this, when lowering the lower surface plate (53), the operator has to remove the workpiece carrier (
After removing the carrier (56) and correcting the height position of the upper surface of the grindstone (52), the carrier (56) is attached to the gear (56) again.
57) One possible method is to mesh with (59).

However, having the operator remove and attach the carrier (56) as described above every time the height of the upper surface of the grindstone (52) is adjusted imposes a heavy burden on the operator.

This invention solves the above-mentioned problems, and the annular polishing member using a grindstone or the like is placed between the position within the annular space between the sun and internal gears and the lower position of the space. For a polishing device that is configured to move up and down, even if the polishing member is moved to a position below the space,
It is an object of the present invention to provide a polishing device that can hold a carrier in mesh with both a sun gear and an internal gear, thereby allowing a polishing member to be raised and lowered without putting a burden on the operator. shall be.

Means for Solving the Problems To achieve the above object, the present invention provides an internal gear in which an internal gear is arranged with an annular space in the concentric outer part of a sun gear, and both the sun and internal gears are arranged in the annular space. An external gear-shaped work carrier is disposed in mesh with the annular space, and the polishing member is equipped with an annular polishing member using a grindstone or the like that is raised and lowered between a position within the annular space and a position below the space. The apparatus comprises: applying the polishing member to each of the sun gear and the internal gear from below with the carrier meshing with both the sun gear and the internal gear when the polishing member is moved to a position below the annular space; The gist of the polishing apparatus is that a carrier receiver for receiving the polishing member is provided in a state of protruding toward the space in a manner that does not prevent the polishing member from moving up and down.

In the above configuration, the gear ratio between the sun gear, the internal gear, and the workpiece carrier is such that all the workpiece holding parts of the carrier start rotating by a predetermined number of rotations of the sun gear and/or the internal gear. The gear ratio is set to return to the same positional relationship as the positional relationship, and the sun gear and/or internal gear are temporarily stopped when polishing the workpiece is completed by rotating the predetermined number of times. It is preferable that intermittent drive control be performed in this embodiment.

Operation In the polishing device having the above configuration, when the polishing member located in the annular space between the sun gear and the internal gear descends to move to a position below the space, the polishing member is The carrier placed on the upper surface of the member contacts and is supported by the carrier receiver at its peripheral edge. After being supported, the carrier is held by the receiver, and only the polished member moves downward. Further, when the polishing member lowered to the lower position of the annular space rises to move into the space, the polishing member comes into contact with and supports the lower surface of the carrier during the rising process, and the carrier It is separated upward from the carrier receiver.

EXAMPLE Hereinafter, an example in which a polishing apparatus of the present invention is applied to an apparatus for polishing an aluminum substrate for a magnetic disk will be described with reference to the drawings.

In the polishing apparatus (1) shown in FIGS. 1 and 2,
(2) is the lower surface plate, (3) is the upper surface plate, (4) is the sun gear, (5) is the internal gear, (6) is the work carrier (
7) is a sharpening member.

The sun gear (4) is capable of rotating around its own axis by a rotation drive device (not shown). This rotary drive device uses a sun gear (
4) by an AC servo motor, for example.

Further, the internal gear (5) is fixedly arranged concentrically at a position radially outward of the sun gear (4) with an annular space between the internal gear (5) and the sun gear (4).

Furthermore, the work carrier (6) is based on a thin plate-shaped external gear, and both sun and internal gears (4) are provided in the annular space between the sun gear (4) and the internal gear (5). (5)
One or more pieces are arranged in mesh with each other. In addition,
The work carrier (6) is provided with one or more circular holding holes (10) that follow the outer circumferential shape of the magnetic disk substrate (A) at positions eccentric from its center position. Further, the thickness of this work carrier (6) is formed to be thinner than the thickness of the magnetic disk substrate (A), and when the magnetic disk substrate (A) is placed in the holding hole (10), The surface protrudes outward from the holding hole (10) and is shaped like an opening.

Here, the gear ratio among the sun gear (4), internal gear (5), and work carrier (6) is set to 1:3:1, and the sun gear (4) is rotated by its rotational drive device. 4
The carrier (6) is stopped at a fixed position on its revolving path when the sun gear (4) stops rotating, and its holding hole (10) is rotated an integral multiple of times. It is also assumed that the robot is stopped at the position at the start of its rotation and revolution.

The lower surface plate (2) has an annular grindstone (8) of a predetermined thickness attached thereto as a polishing member, and is rotated around its own axis by a rotation drive device (not shown). , and the upper surface of the grindstone (8) changes its position between the workpiece processing position within the annular space (position hΩa in Figure 5) and the lower position of the space (position hΩ0 in the figure). It is designed to be raised and lowered by a lifting device (not shown).

The upper surface plate (3) is disposed coaxially opposite the lower surface plate (2), and a ring-shaped grindstone (9) is placed at the bottom of the upper surface plate (3).
is attached so as to face the grindstone (8). The upper surface plate (3) is also rotated about its own axis by a rotational drive device, and is moved up and down by an elevation drive device.

As shown in FIGS. 1, 2, and 4, carrier receivers (12) and (13) are attached to each of the sun gear (4) and internal gear (5). ing.

The carrier receiver (12) on the sun gear (4) side has a hole in the center through which the rotational drive shaft of the sun gear (4) passes, and a rising bent part (12a) extending all around the circumference. The sun gear (4) is made of a disc material, and is disposed externally on the lower part of the sun gear (4), and is fixed to the sun gear (4) by a fastening member on the lower surface thereof. In this fixed state,
The upper edge of the bent portion (12a) is connected to the lower surface plate (2).
) is positioned slightly lower than the workpiece machining height hΩa of the grindstone (8), and is positioned opposite to the lower portion of the teeth of the sun gear (4) in the vertical direction.

On the other hand, the carrier receiver (13) on the internal gear (5) side
is formed by a member having a predetermined length and a cross-section shaped like a letter, which is gently curved along the circumferential direction of the internal gear (5).
The rising bent portion (13a) is connected to the internal gear (5).
) with the horizontal side facing the lower side of the teeth of the internal gear (5).
With the horizontal part facing the lower surface of the internal gear (5)
By fixing to the bottom surface of the internal gear (5
) is attached to. The height of the upper edge of this bent portion (13a) is equal to the height of the carrier receiver (12) on the sun gear (4) side.
The height is set to be the same as the upper edge height of the bent portion (12a). Note that the device (1) of this embodiment has a carrier (6
) is configured to stop at a fixed position on its revolving path, so it is assumed that this carrier receiver (13) is provided only in a predetermined length portion corresponding to the stop position of the carrier (6) as shown in the figure. There is a sun gear (4)
Similar to the side carrier receiver (12), the internal gear (5)
It may be provided over the entire circumference.

On the other hand, the sharpening member (7) is placed at a side position of both the upper and lower surface plates (2) and (3), and is moved from the side position by a cylinder device to both the upper and lower surface plates (2) ('3) and also to the upper and lower grindstones. (8
) (9) It is designed to move horizontally forward and backward in the radial direction toward the center of rotation.

This sharpening member (7) is attached to a cutting tool holding block (1B) attached to the tip of the cylinder rod (15) of the air cylinder, and to the block (16) so as to project upwardly and downwardly. This is due to the sharpening tool (14).

Next, the operation of the polishing apparatus (1) will be explained together with a method of controlling the apparatus.

First, as shown in FIG.
The lower surface plate (2) waiting at Ω1 is
) is moved upward by a distance hρW so that the upper surface of the workpiece is located at the workpiece machining position hΩa within the annular space between the sun and internal gears (4) and (5). In this state, the work carrier (6) is positioned at a predetermined position in the circumferential direction between the sun gear (4) and the internal gear (5), that is, at the arrangement position of the carrier receiver (13) on the internal gear (5) side. They are arranged in a meshed position at a position corresponding to a predetermined direction.

Then, a workload loading device (not shown) that performs a patterned operation is activated, and the magnetic disk substrate (A) is
is placed in the work holding part (lO) of the carrier (6).

After the board placement is completed, the upper surface plate (3), which was waiting at the first reference position hu1 above, is lowered by a distance huw so that the lower surface of its grindstone (9) is positioned at the workpiece processing position hua, and The substrate (A) is pressurized by the upper and lower grindstones (8) and (9) using a pressurizing device.

In this state, the sun gear (4) is rotationally driven to rotate and revolve the carrier (6), and at the same time, the upper and lower surface plates (2) and (3) are also rotationally driven to rotate the magnetic disk substrate ( A) is polished by sliding it against the upper and lower grindstones (8) and (9). Then, the sun gear (4) is stopped when it has been rotated a pre-input number of times (an integral multiple of 4). In its stopped state, the carrier (6)
has returned to the position at the start of rotation of the sun gear (4), that is, the position corresponding to the arrangement position of the carrier receiver (I3) on the internal gear (5) side, and the work holding hole (60) The position in the circumferential direction has also returned to the position at the start of rotation.

Then, the upper surface plate (3) is moved upward to the first reference position hu1, and the substrate (
A) is taken out by a work unloading device (not shown) that performs a pattern operation.

Thereafter, the work loading device is operated again, the magnetic disk substrate (A) is placed in the work holding hole (10) of the carrier (6), and the upper surface plate (3) is moved at the same distance from the first reference position hu1. The same operation as above is performed in which the sun gear (4) is lowered by huw and driven to rotate, and the polishing process of the substrate (A) is repeated.

As this polishing process is repeated, the upper and lower whetstones (8) and (9) become clogged and clogged.
When it becomes necessary to sharpen 8), the following height control is performed on the upper and lower surface plates (2) and (3).

That is, in a state where the upper surface plate (3) is raised back to the first reference position hu1 and the substrate (A) is taken out from the apparatus (1), the lower surface plate (2) is moved from the polishing position hQa to the polishing process. It is moved to a position above the position hρb by α (α width thickness). Also, the upper surface plate (3) is lowered and the lower surface of the grindstone (9) is placed at the sharpening processing position hub.
is moved to a lower position by α (α Nidress thickness).

In this state, the work carrier (6) is previously stopped in such a manner that it is not located on the advancing/retreating path of the dressing member (7). In this state, the upper and lower surface plates (2) and (3) are driven to rotate, and the dressing member (7) is radially moved from the lateral position of the surface plates (2) and (3) toward the center of rotation of the surface plates. Moves inward horizontally and bites (14)
When the wheels (8) and (9) reach the inner circumferential ends of the grinding wheels (8) and (9), they are moved horizontally outward in the radial direction toward the outer circumferential ends of the grinding wheels (8) and (9). ) (9) is finished.

After sharpening, the lower surface plate (2) is lowered and positioned at the second reference position hΩ2, and the upper surface plate (3) is raised and positioned at the second reference position hu2. These second reference positions hΩ2 and hu2 are the grindstones (8) and (9) before the sharpening process when the lower surface plate (2) and the upper surface plate (3) are located at the first reference positions hΩ1 and hu2. The height position hΩo of both opposing surfaces of the grindstone is set at a height such that both opposing surfaces of the grindstone after sharpening are located at hug. Then, the lower surface plate (2) is raised from its second reference position hΩ2 by a distance hΩW in the same manner as described above, the upper surface of the grinding wheel (8) is positioned at the workpiece processing position hfla, and after placing the substrate, the upper surface plate (3)
) is lowered from the second reference position hu2 by the distance huw in the same manner as above, and the lower surface of the grinding wheel (9) is at the workpiece processing position hua.
The polishing process of the substrate (A) is restarted.

Then, in the process of lowering the lower surface plate (2) from the sharpening processing position hρb to the second reference position hΩ2 after sharpening as described above, the carrier (6) placed on the upper surface of the grinding wheel (8) The carrier receiver (12
) (13) bent portions (12a) (13a)
Abuts against and is supported by the upper edge of. After bearing, as shown in FIGS. 3 and 4, the carrier (6) is in contact with the sun and internal toothed gears (4) and (5) in the form of a rest, and the receivers (12) (13) , and only the lower surface plate (2) moves downward.

Then, as described above, while the lower surface plate (2) reaches the second reference position hΩ2 and is raised by the distance hρW from there, the upper surface of the grinding wheel (8) is placed on the carrier receiver (12) (13 ) bending part (12a) (1
3a), the carrier (6) is supported on the upper surface of the grinding wheel (8) and is spaced apart from the carrier receiver (12) (L()). .

As described above, according to the present invention, the grinding wheel (
Even if the carrier (6) is moved up and down between the position in the space between the sun and internal tooth gears (4) and (5) and the position below the space, the carrier (6) Both gears (
4) The carrier (6) can be kept in a state of engagement with (5) at all times, eliminating the need for the operator to remove and install the carrier (6) as the lower surface plate (2) moves up and down, and polishing. can contribute to automation.

Further, as in the above embodiment, the present invention can be carried out using a carrier (6
) configuration for stopping the workpiece holding part (10) at a fixed position;
That is, the sun gear (4), the internal gear (5) and the carrier (
6) Removal of the carrier (6) by applying it to a polishing device configured to set the mutual tooth number ratio to a specific ratio and control the number of rotations of the sun gear (4) in a predetermined manner;
It is possible to avoid misalignment of the meshing positional relationship between the sun gear (4), internal gear (5), and carrier (6) due to installation, and therefore, the carrier ( 6) It is possible to prevent errors in the position of the holding part (10), and the loading of the substrate (A),
Automation of unloading can be achieved more effectively.

In addition to the carrier receiver in the above-mentioned embodiment, as shown in FIGS. The support is constructed by installing a plurality of pins (20) in a row in the circumferential direction so that the upper edge of the pins (20) can support the lower surface of the circumference of the carrier (6). may be adopted.

In addition, the raising and lowering operation of the polishing member in the polishing apparatus of the present invention is for the purpose of raising and lowering the lower surface plate (2) in the above embodiment, that is, the lifting operation of the lower surface plate (2) in conjunction with sharpening of the grindstone (8).
Even if the purpose is not to adjust the height position of the grinding wheel, it also includes cases where it is done for the purpose of replacing the grindstone, for example. That is, the present invention is widely applicable to polishing apparatuses in which the lower surface plate is moved up and down for some reason.

Effects of the Invention As described above, the polishing device of the present invention provides a carrier for each of the sun gear and the internal gear when the polished member is moved to a position below the annular space between the sun gear and the internal gear. The carrier receiver, which receives the sun and internal gears from below in a state in which it is meshed with both internal gears, is provided in a state that protrudes toward the space side in a manner that does not prevent the polishing member from moving up and down. Even when the carrier is moved up and down between a position within the space and a position below the space, the carrier can be maintained in a state in which both the sun gear and the internal gear are always meshed, so that the burden on one worker is reduced. The polishing member can be moved up and down without applying stress. In particular, it can greatly contribute to the automation of polishing processes.

[Brief explanation of the drawing]

1 to 5 show an embodiment of the polishing apparatus of the present invention. FIG. 1 is a vertical sectional view of the polishing apparatus, FIG. 2 is a view taken along the line ■-■ in FIG. Figure 3 is a vertical sectional view of the polishing device showing a state in which the carrier is supported by a carrier holder, Figure 4 is an enlarged perspective view of the same state, and Figure 5 is a device explaining the lifting and lowering operation of the upper and lower surface plates. FIG. FIG. 6 shows another embodiment of the present invention.
A) is a vertical cross-sectional view of the main part of the device.
It is a view taken along the line l-VI. FIG. 7 is a perspective view showing a conventional polishing device. (4)...Sun gear, (5)...Internal gear, (6)
... Work carrier (8) ... Grindstone (polishing processing member), (1) ... Polishing device, (12) (13)
(20)...Carrier holder, (A)...Aluminum substrate for magnetic disk (work). Above Figure 1 Figure 2 Figure 5

Claims (1)

[Claims] An internal gear is disposed at a concentric outer portion of the sun gear with an annular space therebetween, and an external gear-shaped work carrier is disposed within the annular space in mesh with both the sun and internal gears, and a polishing device equipped with an annular polishing member using a grindstone or the like that is raised and lowered between a position within the annular space and a position below the space, the polishing device comprising: , when the polishing member is moved to the lower position of the annular space, the carrier receiver receives the carrier from below with the carrier meshed with both the sun and internal gears, and does not prevent the polishing member from moving up and down. A polishing device, characterized in that the polishing device is provided in a state protruding toward the space side.