JP4242034B2 - Polishing method and polishing apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a polishing method and a polishing apparatus effective for polishing a thin plate-like object to be polished such as an aluminum disk and a semiconductor wafer, and in particular, can easily cope with automation of loading and unloading of an object to be polished. Further, the present invention relates to a polishing method and a polishing apparatus capable of extending the durability of a carrier.
[0002]
[Prior art and its problems]
There are various types of polishing apparatuses for polishing thin plate-like objects to be polished such as aluminum disks and semiconductor wafers. For example, a lower surface plate that is connected to a driving source and is rotatable, and an upper surface of the lower surface plate. In addition to being provided at the center of the lower surface plate and connected to the drive source, the sun gear that is connected to the drive source and rotatable, and provided on the outer peripheral side of the lower surface plate An internal gear which is connected to a drive source and is rotatable, and a plurality of carriers which are meshed between the sun gear and the internal gear and which have a plurality of holes for holding an object to be polished. Are known.
[0003]
In order to polish an object to be polished using the polishing apparatus configured as described above, an unprocessed object to be polished is loaded into each hole of each carrier, and between the upper surface plate and the lower surface plate. In this state, each polishing object is sandwiched and while supplying polishing liquid between the upper and lower surface plates, each drive source is operated to rotate the upper surface plate, lower surface plate, sun gear, and internal gear. The object to be polished is revolved and rotated between the upper and lower surface plates integrally with each carrier.
[0004]
Then, after a predetermined time has elapsed, each drive source is stopped, the upper surface plate, the lower surface plate, the sun gear, and the internal gear are stopped, and the object to be polished is stopped together with each carrier. In this way, by polishing and rotating the object to be polished together with each carrier for a predetermined time, the polished surface of each object held on each carrier can be finished to a predetermined surface roughness. is there.
[0005]
However, the conventional polishing apparatus configured as described above requires a mechanism and control for revolving and rotating each carrier, so that the structure and control of the entire apparatus become complicated.
[0006]
In addition, since there are variations in the revolution direction and the rotation stop position of each carrier when the polishing is completed, variations occur in the revolution direction and the rotation stop position of each object to be polished. For this reason, when automating the loading and unloading of an object to be polished by incorporating it into a line, each carrier is revolved and rotated after polishing to correct the position of each carrier in the revolving direction and rotation direction, and each object to be polished is corrected. Must be positioned at predetermined positions in the revolution direction and the rotation direction. Alternatively, correction must be performed so that the position of the robot of the transfer device that carries in and out the object to be polished matches the stop position in the revolution direction and rotation direction of each object that is held by each carrier after the polishing is completed. I must. This complicates the structure and control of the entire line and increases the equipment cost.
[0007]
On the other hand, a polishing apparatus that solves the above problems is described in a microfilm disclosed in Japanese Utility Model Application No. 60-117509. This polishing apparatus was previously filed by the applicant of the present application, and is provided by providing a pair of driven gears on the outside of the carrier so as to be able to rotate forward and backward instead of the internal gear, and supporting the carrier by the driven gear. It is configured to prevent the revolution of the carrier and allow only the rotation.
[0008]
By adopting such a configuration, the mechanism and control for revolving the carrier become unnecessary, so that the structure and control of the entire apparatus can be simplified. In addition, when the polishing is completed, the carrier does not revolve, but only rotates. Therefore, when carrying in / out of the object to be polished is automated, the position of the carrier in the revolving direction is not considered at all. Since it is good, the structure and control of the entire line can be simplified, and the equipment cost of the entire line can be reduced.
[0009]
However, in the polishing apparatus having the above-described configuration, an excessive force acts on the carrier in the revolving direction at the time of initial movement. Therefore, when a thin carrier having a large diameter such as for 300 mm is used, The carrier is often distorted and the object to be polished pops out of the carrier. This is because, for example, for 200 mm and for 300 mm, the thickness of the carrier is substantially the same and the strength is substantially the same, so that for 300 mm, distortion is more likely.
If the carrier is simply prevented from being distorted during initial movement and the object to be polished is prevented from jumping out, the driven gear may be urged so that the driven gear is pressed against the carrier. Since it is made of plastic or the like, if the urging force is applied, it is warped and the durability is significantly lowered. For this reason, there has been a demand for extending the durability of a large-diameter carrier such as for 300 mm.
[0010]
The object of the present invention is to simplify the structure and control of the entire apparatus, to keep equipment costs low, and to automate the loading and unloading of objects to be incorporated into the line. It is an object of the present invention to provide a polishing method and a polishing apparatus that can easily cope with the entire structure and control.
Another object of the present invention is to adjust the urging force of the driving member to the carrier so that the clearance between the carrier and the carrier can be adjusted even when a thin carrier having a large diameter such as for 300 mm is used in addition to the above object. To provide a polishing method and a polishing apparatus capable of preventing the object to be polished from being squeezed out of the carrier by being distorted at the time of initial movement by being substantially in contact with each other, and extending the durability of the carrier itself. It is in.
[0011]
[Means for solving problems]
In order to solve the above-described problems, the polishing method of the present invention is characterized in that at least one carrier is positioned between a lower surface plate and an upper surface plate that are connected to a drive source and are rotatable, The carrier is engaged with a drive member of a carrier rotation drive mechanism which is connected to a drive source and is rotatable, and an object to be polished is loaded into the hole of the carrier, and a lower plate corresponding to the at least one carrier is loaded. The drive members of the carrier detachment preventing mechanism, which are located on the outer peripheral side of the panel and have at least two drive members connected to the drive source and rotatable, are engaged with the carrier, and in this state, all the drive sources To rotate the lower surface plate, the upper surface plate, the driving member of the carrier rotation driving mechanism, and the driving member of the carrier detachment prevention mechanism so that the carrier only rotates without revolving. While adopting a means for polishing the object to be polished, provided with teeth on the carrier, the teeth capable of meshing engagement pin of the carrier to the drive member of the drive member and the carrier removal prevention mechanism of the carrier rotary drive mechanism A means provided with a plurality of is adopted. Further, a means is adopted in which each drive member of the carrier detachment preventing mechanism can be moved forward and backward in the horizontal direction and can be lifted and lowered in the vertical direction. The polishing apparatus of the present invention includes a lower surface plate connected to a drive source and rotatable, an upper surface plate located above the lower surface plate and rotatable connected to the drive source, a lower surface plate, and an upper surface plate. And at least one carrier provided with a hole for holding an object to be polished, and provided at the center of the lower surface plate, connected to a drive source and rotatable, and A carrier rotation drive mechanism having a drive member that can mesh with the carrier; and provided on an outer peripheral side portion of a lower surface plate corresponding to the at least one carrier, and connected to a drive source and rotatable. A carrier detachment preventing mechanism having at least two engaging members that can be engaged with each other, and operating all the driving sources to drive the lower surface plate, the upper surface plate, the driving member and the key of the carrier rotation driving mechanism. Rotate the respective drive members of the rear detachment prevention mechanism, it said by only rotation without revolving the carrier while adopting a means for polishing a polishing object, provided with teeth on the carrier, the carrier rotation drive mechanism The drive member and each drive member of the carrier detachment prevention mechanism employ a means provided with a plurality of engagement pins that can be engaged with the teeth of the carrier. The drive member of the carrier detachment preventing mechanism employs means that can move forward and backward in the horizontal direction and can move up and down in the vertical direction.
[0012]
[Action]
According to the present invention, by adopting the above-described means, at least one carrier is positioned between the lower surface plate and the upper surface plate, and the driving member of the carrier rotation driving mechanism is located at the center of the lower surface plate. , Each drive member of the carrier detachment preventing mechanism located on the outer peripheral side portion of the lower surface plate corresponding to at least one carrier is engaged with the carrier, and an object to be polished is loaded into the hole of the carrier . In this state, when all the driving sources are operated to rotate the lower surface plate, the upper surface plate, the driving member of the carrier rotation driving mechanism and the driving member of the carrier detachment prevention mechanism, the carrier moves between the upper and lower surface plates. Only the rotation is performed without revolution, and the polished surface of the object to be polished held by the carrier is polished. Then, after a predetermined time has elapsed, all the driving sources are stopped, and the lower surface plate, the upper surface plate, the driving member of the carrier rotation driving mechanism and the driving members of the carrier detachment prevention mechanism are stopped. Without stopping, only the rotation is performed.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention shown in the drawings will be described.
1 to 5 show an embodiment of a polishing apparatus according to the present invention. This polishing apparatus 1 includes a lower surface plate 2 that is rotatably provided, a rotatable upper surface of the lower surface plate 2, and upper and lower surfaces. The upper surface plate 5 provided movably, the carrier 15 provided between the lower surface plate 2 and the upper surface plate 5 and provided with a hole 16 for holding the workpiece 18, and the center of the lower surface plate 2 The carrier rotation driving mechanism 7 provided in the section and the carrier detachment preventing mechanism 19 provided on the outer peripheral side of the lower surface plate 2 are provided.
[0014]
The lower surface plate 2 is formed in a disc shape, and a polishing pad 4 is attached to the upper surface side, and the lower surface side of the workpiece 18 held by the carrier 15 is applied to the upper surface side of the polishing pad 4. It comes to touch. A jacket (not shown) for circulating cooling water is provided inside the lower surface plate 2, and the lower surface plate 2 can be cooled by circulating the cooling water in the jacket. The lower surface plate 2 is connected to a driving source (not shown) located below the lower surface plate 2 and rotates in the horizontal direction when the driving source is operated. A hole 3 penetrating in the vertical direction is provided at the center of the lower surface plate 2, and a carrier rotation driving mechanism 7 is provided in the hole 3.
[0015]
The carrier rotation drive mechanism 7 is positioned below the lower surface plate 2, a drive shaft 8 rotatably provided at the center of the hole 3 of the lower surface plate 2, a drive member 9 attached to the upper end of the drive shaft 8, and the lower surface plate 2. And a drive source (not shown) that rotates the drive member 9 integrally with the drive shaft 8.
[0016]
The drive member 9 is attached to the upper end portion of the drive shaft 8 integrally with a disk-like substrate 10 and is rotatably attached to the same circumference of the peripheral portion of the substrate 10 at predetermined intervals. It comprises a plurality of bar-shaped engagement pins 11 that can mesh with 15 teeth 17.
[0017]
The carrier 15 has a thin disk shape made of synthetic resin or metal, and the hole 16 for holding the thin disk-shaped workpiece 18 such as an aluminum disk or a semiconductor wafer is eccentric. In one place.
[0018]
Concave portions and convex portions are alternately provided on the outer peripheral surface of the carrier 15 to form teeth 17 as a whole. The teeth 17 and the engagement pin 11 of the driving member 9 of the carrier rotation driving mechanism 7 described above. Are engaged with each other, and the teeth 17 and the engagement pins 22 of the drive member 20 of the carrier detachment preventing mechanism 19 described later are also engaged with each other.
[0019]
In this embodiment, five carriers 15 are provided between the lower surface plate 2 and the upper surface plate 5, but the number is not particularly limited, and at least one carrier may be provided.
[0020]
The carrier detachment preventing mechanism 19 is provided on the outer peripheral side portion of the lower surface plate 2 corresponding to each carrier 15.
[0021]
Each carrier detachment prevention mechanism 19 includes three drive members 20, 20, 20, a rotation drive mechanism 23 that rotationally drives the drive members 20, 20, 20, and a rotation drive mechanism that drives the drive members 20, 20, 20. 23, a horizontal movement mechanism 34 that moves forward or backward in the horizontal direction integrally with 23, and a vertical movement mechanism 39 that raises or lowers the drive members 20, 20, 20 in the vertical direction integrally with the rotation drive mechanism 23.
[0022]
The rotational drive mechanism 23 is attached to the base frame 31. A drive source 24 such as a drive motor attached to the upper part of the base frame 31 via a bolt (not shown) and the like, and a belt attached to the drive source 24. The primary shaft 27 is coupled to the primary shaft 27 via a belt 28 and the like, and is rotatably supported by the bearing case 29. Three secondary shafts 30 are provided, and the drive member 20 is integrally connected to the tip of each secondary shaft 30.
[0023]
Each drive member 20 is attached to a disc-like substrate 21 integrally connected to the tip end portion of each secondary shaft 30 and is rotatably attached to the same circumference of the peripheral portion of the substrate 21 at predetermined intervals. And a plurality of bar-shaped engagement pins 22 that can mesh with the teeth 17 of the carrier 15.
[0024]
In this case, one drive member 20 is provided on the extended line connecting the center of the carrier rotation drive mechanism 7 and the center of each carrier 15, and two drive members 20 are provided symmetrically on both sides. Note that at least two drive members 20 may be provided in each carrier detachment prevention mechanism 19, and at least two drive members 20 are lines connecting the center O of the carrier rotation drive mechanism 7 and the center Z of the carrier 15. What is necessary is just to comprise so that it may be located symmetrically on both sides of this.
[0025]
The base frame 31 is attached to an upper part of a support plate 33 located on an upper part of a base 32 of the polishing apparatus 1, and can be advanced and retracted in a horizontal direction by a horizontal movement mechanism 34, and vertically moved by a vertical movement mechanism 39. It is possible to move.
[0026]
The horizontal movement mechanism 34 is provided between the base frame 31 and the support plate 33, and includes a guide guide 35 that supports the base frame 31 and the support plate 33 so as to be relatively movable in the horizontal direction. A horizontal movement cylinder 36 is provided between the support plate 33 and the base frame 31 and the support plate 33 to relatively advance and retract in the horizontal direction.
[0027]
The horizontal movement cylinder 36 has a body 37 fixed to the support plate 33 side and a rod 38 connected to the base frame 31 side. Therefore, when the horizontal movement cylinder 36 is operated, the base frame 31 advances and retreats relative to the support plate 33 in the horizontal direction, and each drive member 20 advances and retreats in the horizontal direction following the base frame 31. When each drive member 20 is advanced, the engagement pin 22 of each drive member 20 and the teeth 17 of the carrier 15 are engaged with each other, and when each drive member 20 is retracted, each drive member 20 The meshing pin 22 is separated from the teeth 17 of the carrier 15 and the meshing state is released.
Then, each drive member 20 is advanced by the horizontal movement cylinder 36 so that the gap between the teeth 17 and the engagement pins 22 is set to be in contact with the teeth 17 of the carrier 15, thereby extending the life of the carrier 15. can do.
[0028]
The vertical movement mechanism 39 is attached to each of a plurality of support shafts 40 erected on the base 32 of the polishing apparatus 1 and a portion of the support plate 33 corresponding to the support shaft 40, and the inner peripheral side is supported by the support shaft. A slide bearing 41 through which slidable 40 is slidably inserted, a screw shaft 42 erected rotatably on the base 32 of the polishing apparatus 1, and a support plate 33 corresponding to the screw shaft 42 are attached to the screw shaft 42. A nut 43 that is screwed to the shaft 42 and a drive source (not shown) that drives the screw shaft 42 to rotate are configured.
[0029]
Then, by operating the drive source to rotate the screw shaft 42, the relative screwing position of the screw shaft 42 with respect to the nut 43 changes, and the support plate 33, that is, the vertical position of each drive member 20 follows this. The position in the direction changes. Therefore, by changing the vertical position of each drive member 20, the vertical engagement position of the engagement pin 22 of each drive member 20 with respect to the teeth 17 of the carrier 15 can be changed.
[0030]
The upper surface plate 5 is formed in a disk shape, is connected to a drive source (not shown) and can be rotated in the horizontal direction, and is a vertical movement mechanism including a vertical movement cylinder and the like. It is connected to (not shown) and can be raised or lowered in the vertical direction. A polishing pad 6 is provided on the lower surface side of the upper surface plate 5, and the upper surface side of the workpiece 18 held by each carrier 15 is in contact with the lower surface side of the polishing pad 6.
[0031]
In order to polish the workpiece 18 using the polishing apparatus 1 configured as described above, each carrier 15 is positioned at a predetermined position above the lower surface plate 2, and the teeth 17 of each carrier 15 are moved. The carrier rotation drive mechanism 7 is engaged with the engagement pin 11 of the drive member 9.
[0032]
Then, each drive member 20 of each carrier detachment prevention mechanism 19 is raised or lowered by operating a drive source of each vertical movement mechanism 39, and the engagement pin 22 of each drive member 20 is moved horizontally to the teeth 17 of each carrier 15. Position on the extension line of direction.
[0033]
Then, the horizontal movement cylinders 36 of the horizontal movement mechanisms 34 are operated to advance the drive members 20 in the horizontal direction, and the engagement pins 22 of the drive members 20 are engaged with the teeth 17 of the carriers 15.
At this time, a minute gap is formed between the engagement pin 22 of each drive member 20 of each carrier detachment prevention mechanism 19 and the teeth 17 of the carrier 15 by adjusting the protruding amount of the rod 38 of each horizontal movement cylinder 36. Like that.
As a result, even if a thin carrier having a large diameter is used as the carrier 15, a large urging force does not act on the carrier 15 at the time of initial movement, so that the durability of the carrier can be extended even if it is a plastic carrier.
[0034]
Then, the workpieces 18 are loaded into the holes 16 of the carriers 15, and the upper platen 5 is moved down by operating the vertical movement cylinder of the vertical movement mechanism (not shown). The polishing pad 6 on the side is brought into contact with the upper surface side of each workpiece 18, and each workpiece 18 is sandwiched between the upper surface plate 5 and the lower surface plate 2.
At this time, the outermost periphery of the workpiece 18 substantially coincides with the outer periphery of the lower surface plate 2 or is slightly inward.
[0035]
In this state, while supplying the polishing liquid between the upper and lower surface plates 2 and 5, all the driving sources are operated, so that the lower surface plate 2, the upper surface plate 5, the drive member 9 of the carrier rotation drive mechanism 7 and each carrier. Each drive member 20 of the separation preventing mechanism 19 is rotated, and each carrier 15 is rotated. In this case, since the carrier 15 is set to rotate only and does not revolve according to the rotation direction and the rotation speed of each carrier 15 and the drive member 9 and the drive member 20, the carrier 15 always rotates at the initial position. Then, the workpiece 18 in the hole 16 is moved and polished with respect to the upper and lower surface plates 5 and 2 while rotating at the initial position.
[0036]
Then, after a predetermined time has elapsed, all the drive sources are stopped, and the lower surface plate 2, the upper surface plate 5, the drive member 9 of the carrier rotation drive mechanism 7, and the drive members 20 of the carrier detachment prevention mechanisms 19 are stopped. Each carrier 15 is stopped. In this way, the polished surface of each workpiece 18 is finished to a predetermined surface roughness.
[0037]
In the polishing apparatus 1 according to this embodiment configured as described above, each carrier 15 is operated in cooperation with the driving member 9 of the carrier rotation driving mechanism 7 and each driving member 20 of each carrier detachment preventing mechanism 19. It will only rotate without revolving. Therefore, since the structure and control of the entire apparatus can be simplified, the price of the entire apparatus can be reduced.
[0038]
When the polishing apparatus 1 is incorporated in a line to automatically carry in and carry out the workpiece 18, a part of the workpiece 18 must be present at a position including the center Z of the carrier 15 after polishing. Therefore, if the manipulator for unloading is set at the center of the carrier, no correction such as positioning is required.
As a result, the structure and control of the transfer device for carrying in and out the object to be polished 18 can be simplified, the structure and control of the entire line can be simplified, and the price of the entire line is kept low. Will be able to.
[0039]
Further, since the drive member 9 of the carrier rotation drive mechanism 7 and the drive members 20 of the carrier detachment prevention mechanisms 19 are both driven to rotate by a drive source, the revolving direction with respect to each carrier 15 at the initial movement. No excessive force is applied to the carrier 15, and even when each carrier 15 is made thin for 300 mm or the like, each carrier 15 is distorted at the initial movement, and the object to be polished from each carrier 15. There is no such thing as 18 jumping out.
Therefore, even when the 300 mm workpiece 18 that will become the mainstream in the future is polished, the production efficiency can be greatly increased.
[0040]
In the above description, each carrier detachment prevention mechanism 19 is provided with the rotation drive mechanism 23, the horizontal movement mechanism 34, and the vertical movement mechanism 39. Although not shown, one rotation drive mechanism and one horizontal movement mechanism 39 are provided. The three carrier detachment preventing mechanisms 19 may be configured to rotate, advance and retract in the horizontal direction, and move up and down in the vertical direction by the moving mechanism and one vertical moving mechanism. A fixed-size carrier can be used as the carrier 15. Further, even if the hole 16 of the carrier 15 is rectangular and the rectangular object that matches the hole of the carrier is polished, the center of the carrier is always located inside the object to be polished. If so, it can be incorporated in the line.
[0041]
【The invention's effect】
Since the present invention is configured as described above, the object to be polished can be polished by rotating only the carrier without revolving by the cooperation of the carrier rotation driving mechanism and the carrier detachment preventing mechanism. Therefore, since the mechanism and control for revolving the carrier are not required, the structure and control of the entire apparatus can be simplified, and the price of the entire apparatus can be reduced.
Further, the polishing of the object to be polished can be completed without the carrier revolving, and a part of the object to be polished is always present at the center of the carrier, so that a manipulator for carrying out is located at the center of the carrier. If it is set so as to come, it is not necessary to correct the positioning for unloading the object to be polished. Accordingly, since the structure and control of the entire line can be simplified, the price of the entire line can be reduced.
Further, both the drive member of the carrier rotation drive mechanism and the drive member of the carrier detachment prevention mechanism are configured to be rotationally driven by a drive source, and the clearance between the carrier teeth and the drive member of the carrier detachment prevention mechanism is adjusted. As a result, it is possible to prevent an excessive force from acting on the carrier in the revolving direction at the initial movement, and to prevent the driving member from applying a large biasing force to the carrier. Therefore, even if a large-diameter thin carrier for 300 mm or the like having the same thickness and strength as the carrier in the case of 200 mm is used, there is no risk that the carrier will be distorted during the initial movement and the object to be polished will jump out. Since the durability of the carrier can be extended, the durability can be ensured even when a large-diameter workpiece for 300 mm or the like, which will be the mainstream in the future, is polished.
[Brief description of the drawings]
FIG. 1 is a schematic longitudinal sectional view showing an entire embodiment of a polishing apparatus according to the present invention.
FIG. 2 is a partially enlarged view of what is shown in FIG.
3 is a partially enlarged view of what is shown in FIG. 1. FIG.
4 is an explanatory view showing a meshing state between a driving member and a carrier of the carrier rotation driving mechanism and a meshing state between each driving member and a carrier of each carrier detachment preventing mechanism shown in FIG. 1. FIG.
5 is a schematic view showing a relationship between the carrier shown in FIG. 4 and a meshing pin of one driving member meshing with the carrier.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Polishing apparatus 2 ... Lower surface plate 3, 16 ... Hole 4, 6 ... Polishing pad 5 ... Upper surface plate 7 ... Carrier rotation drive mechanism 8 ... Drive shaft 9, 20 ... Drive member 10, 21... Substrate 11, 22... Meshing pin 15... Carrier 17... Tooth 18 .. polished object 19 .. carrier detachment preventing mechanism 23. 29 ... Bearing case 27 ... Primary shaft 30 ... Secondary shaft 31 ... Base frame 32 ... Base 33 ... Support plate 34 ... Horizontal movement mechanism 35 ... Guide guide 36 ... Horizontal movement cylinder 37 ... Body 38 ... Rod 39 ... Vertical movement mechanism 40 ... Support shaft 41 ... Slide bearing 42 ... Screw shaft 43 ... Nuts

Claims (4)

At least one carrier is positioned between a lower surface plate and an upper surface plate that are connected to a drive source and is rotatable, and the carrier rotation is located at the center of the lower surface plate and is connected to the drive source and is rotatable. The carrier is engaged with a drive member of a drive mechanism, an object to be polished is loaded into the hole of the carrier, and is positioned on the outer peripheral side of the lower surface plate corresponding to the at least one carrier, and is connected to a drive source. Each of the drive members of the carrier detachment preventing mechanism having at least two drive members that can be rotated is engaged with the carrier, and in this state, all the drive sources are operated to operate the lower surface plate, the upper surface plate, and the carrier rotation drive mechanism. A polishing method of rotating the drive member and each drive member of the carrier detachment preventing mechanism to polish the object to be polished only by rotating without rotating the carrier ,
A polishing method , wherein teeth are provided on the carrier, and a plurality of engagement pins capable of engaging with the teeth of the carrier are provided on the drive member of the carrier rotation drive mechanism and each drive member of the carrier detachment prevention mechanism .   The polishing method according to claim 1, wherein each drive member of the carrier detachment preventing mechanism can be moved forward and backward in the horizontal direction and can be lifted and lowered in the vertical direction. A lower surface plate that is connected to a drive source and is rotatable, and is located above the lower surface plate, is provided between an upper surface plate that is connected to a drive source and is rotatable, and a lower surface plate and an upper surface plate, At least one carrier provided with a hole for holding an object to be polished, and a drive provided at the center of the lower surface plate, connected to a driving source and rotatable, and capable of meshing with the carrier A carrier rotation drive mechanism having a member, and at least two drive members provided on an outer peripheral side portion of the lower surface plate corresponding to the at least one carrier, connected to a drive source, and rotatable and meshable with the carrier. Each of the lower surface plate, the upper surface plate, the drive member of the carrier rotation drive mechanism, and each drive part of the carrier release prevention mechanism. Is rotated, a polishing apparatus for polishing a by only rotation without revolving the workpiece to the carrier,
2. A polishing apparatus, comprising: a plurality of engagement pins that can be engaged with the teeth of the carrier; and a plurality of engagement pins that can be engaged with the teeth of the carrier . 4. The polishing apparatus according to claim 3, wherein each drive member of the carrier detachment preventing mechanism can be moved forward and backward in the horizontal direction and can be lifted and lowered in the vertical direction.

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