JPH0445808Y2 - - Google Patents

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Publication number
JPH0445808Y2
JPH0445808Y2 JP1986175831U JP17583186U JPH0445808Y2 JP H0445808 Y2 JPH0445808 Y2 JP H0445808Y2 JP 1986175831 U JP1986175831 U JP 1986175831U JP 17583186 U JP17583186 U JP 17583186U JP H0445808 Y2 JPH0445808 Y2 JP H0445808Y2
Authority
JP
Japan
Prior art keywords
carriage
plate
polishing
magnetic disk
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1986175831U
Other languages
Japanese (ja)
Other versions
JPS6383252U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986175831U priority Critical patent/JPH0445808Y2/ja
Publication of JPS6383252U publication Critical patent/JPS6383252U/ja
Application granted granted Critical
Publication of JPH0445808Y2 publication Critical patent/JPH0445808Y2/ja
Expired legal-status Critical Current

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  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)

Description

【考案の詳細な説明】 産業上の利用分野 本考案は、たとえば磁気デイスクの両面を研磨
したり、あるいは研磨後の両面に僅かなすじを形
成(微粗面処理)したりする両面処理装置で、磁
気デイスクを所定位置で保持するときなどに採用
される被処理板体の保持装置に関するものであ
る。
[Detailed description of the invention] Industrial application field The invention is a double-sided processing device that polishes both sides of a magnetic disk, or forms slight streaks on both sides after polishing (micro-rough surface treatment). The present invention relates to a holding device for a plate to be processed, which is used when holding a magnetic disk in a predetermined position.

従来の技術 従来、たとえば磁気デイスクの研磨は、特開昭
56年130834号公報や特開昭58年120460号公報に見
られるように、磁気デイスクを縦軸心の周りで回
転させながら、その上面に対してラツピングテー
プを接触させることにより行なつていた。このよ
うな従来形式によると、一面の研磨を終えたのち
磁気デイスクの表裏をかえて(裏返して)他面の
研磨を行なうのであり、この裏返し作業を人手に
より行なうことから能率が悪く、かつ高価格の原
因ともなつていた。そこで最近では、たとえば第
4図、第5図に示すように、環状の下位研磨体7
0と、昇降により下位研磨体70に対して接近離
間自在な上位研磨体71とを、それぞれ縦軸心7
2,73の周りに相反する方向に回転自在とし、
そして両研磨体70,71間に磁気デイスク74
の保持装置75を設けた両面研磨形式が提供され
ている。ここで保持装置75は、縦軸心72上に
位置する駆動軸76に取付けた駆動ローラ77
と、この駆動ローラ77に対向し、周方向2個を
1組として複数組配設された遊転ローラ78と、
対となるローラ77,78間で回転自在に支持さ
れるリング状のキヤリツジ79とから構成され
る。そしてチヤツク式などの移載装置で運んでき
た磁気デイスク74をキヤリツジ79の中央に形
成した保持孔80に嵌装させるとともに、この磁
気デイスク74の下面を下位研磨体70で受止め
させる。そして両研磨体70,71を回転させた
状態で、上位研磨体71を下降して磁気デイスク
74の上面に接当させることで両面の同時研磨を
行なつている。その際に駆動ローラ77の回転力
がキヤリツジ79に伝えられ、そして保持孔80
の内周面をしての摩擦力などによつて磁気デイス
ク74も回転することから、この磁気デイスク7
4は内面の全域に亘つて研磨される。
Conventional technology Conventionally, for example, magnetic disk polishing was
As seen in 130834 of 1956 and Japanese Patent Application Laid-open No. 120460 of 1982, wrapping tape was carried out by contacting the top surface of a magnetic disk while rotating it around its vertical axis. . According to this conventional method, after polishing one side, the magnetic disk is turned over (turned over) and polished on the other side, which is inefficient and expensive because this turning operation is done manually. This was also a factor in the price. Therefore, recently, as shown in FIGS. 4 and 5, an annular lower polishing body 7 has been developed.
0 and an upper polishing body 71 that can move toward and away from the lower polishing body 70 by raising and lowering, respectively, with the vertical axis 7
It is freely rotatable in opposite directions around 2 and 73,
A magnetic disk 74 is placed between both polishing bodies 70 and 71.
A double-sided polishing type with a holding device 75 is provided. Here, the holding device 75 includes a drive roller 77 attached to a drive shaft 76 located on the vertical axis 72.
and idling rollers 78, which face the drive roller 77 and are arranged in a plurality of sets of two in the circumferential direction.
A ring-shaped carriage 79 is rotatably supported between a pair of rollers 77 and 78. Then, the magnetic disk 74 carried by a chuck-type transfer device or the like is fitted into a holding hole 80 formed in the center of the carriage 79, and the lower surface of the magnetic disk 74 is received by the lower polishing body 70. While both polishing bodies 70 and 71 are being rotated, the upper polishing body 71 is lowered and brought into contact with the upper surface of the magnetic disk 74, thereby simultaneously polishing both surfaces. At this time, the rotational force of the drive roller 77 is transmitted to the carriage 79, and the holding hole 80
The magnetic disk 74 also rotates due to the frictional force on the inner peripheral surface of the magnetic disk 7.
No. 4 is polished over the entire inner surface.

考案が解決しようとする問題点 上記の従来形式においてキヤリツジ79は、薄
肉の磁気デイスク74よりもさらに薄いリング板
であり、したがつて研磨作業時にかかる荷重は各
ローラ77,78への3点の偏荷重となることか
らキヤリツジ79が撓むことになり、両面の全域
に亘つての均一な研磨は期待できない。
Problems to be Solved by the Invention In the conventional type described above, the carriage 79 is a ring plate that is even thinner than the thin magnetic disk 74. Therefore, the load applied during polishing work is applied to each roller 77, 78 at three points. The uneven load causes the carriage 79 to bend, making it impossible to expect uniform polishing over the entire area on both sides.

本考案の目的とするところは、キヤリツジを、
撓むことなく強制回転し得る被処理板体の保持装
置を提供する点にある。
The purpose of this invention is to make the carriage
The object of the present invention is to provide a holding device for a plate to be processed that can be forcibly rotated without being bent.

問題点を解決するための手段 上記問題点を解決すべく本考案における被処理
板体の保持装置は、処理装置に対向する板体を固
定部側に設け、この板体に貫通孔を形成し、この
貫通孔に嵌入し、かつ貫通孔の内周面に摺接自在
な歯車部を外周に形成したキヤリツジを設けると
ともに、このキヤリツジに被処理板体の保持孔を
形成し、前記キヤリツジの歯車部に噛合する駆動
歯車を固定部側に設けている。
Means for Solving the Problems In order to solve the above problems, the device for holding a plate to be processed according to the present invention includes a plate facing the processing device provided on the fixed part side, and a through hole formed in this plate. , a carriage is provided which is fitted into the through hole and has a gear portion formed on the outer periphery that can freely slide on the inner circumferential surface of the through hole, a holding hole for the plate to be processed is formed in this carriage, and the gear of the carriage is formed. A drive gear that meshes with the fixed part is provided on the fixed part side.

作 用 かかる本考案構成によると、キヤリツジの保持
孔に被処理板体を嵌装した状態で処理装置を作動
させることで、この被処理板体に対する面処理を
行なえる。そして駆動歯車の回転力が歯車部を介
してキヤリツジに伝えられ、このキヤリツジを強
制回転させるのであるが、その際にキヤリツジに
かかる荷重は、歯車部の全周多数の歯頂部群を介
して貫通孔の内周面のほぼ全周で受止められるこ
とになり、したがつてキヤリツジの強制回転は撓
むことなく行なわれる。
According to the configuration of the present invention, by operating the processing device with the plate to be processed fitted into the holding hole of the carriage, the surface of the plate to be processed can be processed. The rotational force of the drive gear is transmitted to the carriage via the gear section, forcing the carriage to rotate. At this time, the load applied to the carriage passes through the gear section through a large number of tooth crests all around the circumference of the gear section. The carriage is received by almost the entire circumference of the inner circumferential surface of the hole, so that forced rotation of the carriage is performed without bending.

実施例 以下に本考案の一実施例を第1図〜第3図に基
づいて説明する。1は処理装置の一例である両面
研磨装置で、その本体2は、ベース枠2Aと架枠
2Bとによつて側断面視がC字状に形成され、そ
して本体2の中間部には、両側面ならびに前面を
開放させた処理空間3が形成される。前記ベース
枠2Aには上向きの固定側処理部4が配設され、
そして架枠2Bには下向きの可動側処理部5が配
設され、両処理部4,5は上下方向で相対向して
いる。
Embodiment An embodiment of the present invention will be described below with reference to FIGS. 1 to 3. Reference numeral 1 denotes a double-sided polishing device which is an example of a processing device, and its main body 2 is formed into a C-shape in side cross section by a base frame 2A and a frame 2B. A processing space 3 with an open surface and front side is formed. An upwardly facing fixed side processing section 4 is disposed on the base frame 2A,
A downward movable processing section 5 is disposed on the frame 2B, and both processing sections 4 and 5 face each other in the vertical direction.

前記固定側処理部4では、ベース枠2Aと一体
の筒体6に回転軸7が挿通され、この回転軸7は
軸受8を介して縦軸心9の周りに回転自在であ
り、その回転は、ベース枠2A内に設けたモータ
10の出力軸11と回転軸7の下端との間に無端
伝動装置12を介在させることで可能となる。前
記回転軸7の上部はフランジ部7aに形成され、
このフランジ部7aには取付け板13を介して、
処理体の一例である下位研磨体(砥石など)14
が取付けられる。他方の可動側処理部5では、架
枠2Bと一体で上下方向の外筒体15に内筒体1
6が挿通され、この内筒体16は軸受17を介し
て縦軸心18の周りに回転のみ自在に支持され
る。この内筒体16の回転は、架枠2Bに設けた
モータ19の出力軸20と内筒体16の上端との
間に無端伝動装置21を介在させることで可能と
なり、その際に縦軸心18は下部の縦軸心9と同
一線上にある。前記内筒体16内にはスプライン
筒22が固定され、このスプライン筒22にスプ
ライン嵌合して挿通するスプライン軸23が設け
られる。このスプライン軸23の下部に形成した
軸部23aの中間にはキー24を介してボス部材
25が固着され、そして下端には球軸受26を介
してフランジ材27が遊動自在に取付けてある。
このフランジ材27からのピン28はボス部材2
5側に挿通されている。そしてフランジ材27の
下面には、取付け板29を介して上位研磨体30
が取付けられる。前記軸部23aの上端には軸受
31を介してブラケツト32が取付けられ、この
ブラケツト32に、前記外筒体15に取付けたシ
リンダ装置33が連動されている。両処理部4,
5において、少なくとも研磨体14,30は処理
空間3内に突出している。
In the fixed side processing section 4, a rotating shaft 7 is inserted through a cylindrical body 6 that is integrated with the base frame 2A, and this rotating shaft 7 is rotatable around a vertical axis 9 via a bearing 8. This is made possible by interposing the endless transmission device 12 between the output shaft 11 of the motor 10 provided in the base frame 2A and the lower end of the rotating shaft 7. The upper part of the rotating shaft 7 is formed into a flange part 7a,
This flange portion 7a is provided with a mounting plate 13,
A lower polishing body (such as a grindstone) 14 which is an example of a processing body
is installed. In the other movable side processing section 5, an inner cylinder 1 is attached to an outer cylinder 15 in the vertical direction integrally with the frame 2B.
6 is inserted, and this inner cylinder body 16 is supported via a bearing 17 so that it can only rotate freely around a vertical axis 18. This rotation of the inner cylindrical body 16 is made possible by interposing an endless transmission device 21 between the output shaft 20 of the motor 19 provided on the frame 2B and the upper end of the inner cylindrical body 16. 18 is co-linear with the lower longitudinal axis 9. A spline cylinder 22 is fixed within the inner cylinder 16, and a spline shaft 23 is provided to be inserted into the spline cylinder 22 with a spline fit. A boss member 25 is fixed to the middle of a shaft portion 23a formed at the lower part of the spline shaft 23 via a key 24, and a flange member 27 is freely movably attached to the lower end via a ball bearing 26.
The pin 28 from this flange material 27 is connected to the boss member 2.
It is inserted on the 5th side. An upper polishing body 30 is attached to the lower surface of the flange material 27 via a mounting plate 29.
is installed. A bracket 32 is attached to the upper end of the shaft portion 23a via a bearing 31, and a cylinder device 33 attached to the outer cylindrical body 15 is interlocked with this bracket 32. Both processing parts 4,
5, at least the polishing bodies 14, 30 protrude into the processing space 3.

両処理部4,5の間に保持装置34を介在させ
ている。すなわちベース枠2A側からのボルト・
ナツト35を介して板体36が上下位置調整自在
に取付けられ、この板体36の三箇所(単数、複
数など数は限定されない)には丸形の貫通孔37
が形成されている。これら貫通孔37に嵌入され
るキヤリツジ38が設けられ、このキヤリツジ3
8の外周全面には、貫通孔37の内周面上で摺接
自在な歯車部39が形成されている。この摺接
は、ほぼ密な嵌入で回転により行なわれる。そし
て各貫通孔37の外側には、対応する貫通孔37
に一部を連通させて通し孔40が形成され、この
通し孔40内に、前記キヤリツジ38の歯車部3
9に常時噛合する駆動歯車41が配設される。こ
の駆動歯車41を上端に取付けた縦軸42は、板
体36の下面から連設した取付け部材43側に軸
受44を介して回転自在に支持されている。そし
て縦軸42の下端には伝動輪45が固定され、板
体36に適宜設けた案内輪46を介して全ての伝
動輪45間に、共通の無端回動体47が張設され
ている。縦軸42のうちの1本は上方へ突出し、
この突出部はモータ48に無端伝動装置49を介
して連動連結している。前記キヤリツジ38はリ
ング板状であつて、被処理板体の一例である磁気
デイスク50の保持孔51を形成している。な
お、一枚のキヤリツジ38に対する保持孔51の
数は単数、複数など任意であり、また形状も矩形
など任意である。
A holding device 34 is interposed between both processing sections 4 and 5. In other words, the bolts from the base frame 2A side
A plate body 36 is attached via nuts 35 so as to be vertically adjustable, and round through holes 37 are provided at three locations (the number is not limited, such as singular or plural) of this plate body 36.
is formed. A carriage 38 that is fitted into these through holes 37 is provided, and this carriage 3
A gear portion 39 that can slide freely on the inner peripheral surface of the through hole 37 is formed on the entire outer peripheral surface of the through hole 37 . This sliding contact is effected by rotation with a substantially tight fit. A corresponding through hole 37 is provided on the outside of each through hole 37.
A through hole 40 is formed by partially communicating with the gear portion 3 of the carriage 38.
A drive gear 41 that is always in mesh with the gear 9 is disposed. A vertical shaft 42 having the driving gear 41 attached to its upper end is rotatably supported via a bearing 44 on the side of a mounting member 43 connected from the lower surface of the plate 36 . A transmission wheel 45 is fixed to the lower end of the vertical shaft 42, and a common endless rotating body 47 is stretched between all the transmission wheels 45 via guide wheels 46 appropriately provided on the plate body 36. One of the vertical shafts 42 projects upward;
This protrusion is operatively connected to a motor 48 via an endless transmission 49. The carriage 38 has a ring plate shape and forms a holding hole 51 for a magnetic disk 50, which is an example of a plate to be processed. Note that the number of holding holes 51 for one carriage 38 may be arbitrary, such as singular or plural, and the shape may also be arbitrary, such as rectangular.

55は磁気デイスク50を供給し、そして取出
すための移載装置で、架枠2Bの側面に取付けた
左右方向のレール56と、このレール56に摺動
部57を介して支持案内される移動台58と、こ
の移動台58にガイド装置59を介して案内され
る昇降体60と、移動台58と昇降体60との間
に設けた昇降用のシリンダ装置61と、前記昇降
体60の複数箇所に設けた下向きの吸着具(バキ
ユームカツプなど)62とから構成され、前記移
動台58の往復移動は、シリンダ装置、駆動チエ
ン、螺軸機構(いずれも図示せず)などにより行
なわれる。
Reference numeral 55 denotes a transfer device for supplying and taking out the magnetic disk 50, which includes a left-right rail 56 attached to the side surface of the frame 2B, and a moving platform supported and guided by the rail 56 via a sliding portion 57. 58, an elevating body 60 guided by the movable table 58 via a guide device 59, a cylinder device 61 for elevating and lowering provided between the movable table 58 and the elevating body 60, and a plurality of locations on the elevating body 60. The reciprocating movement of the movable table 58 is performed by a cylinder device, a drive chain, a screw shaft mechanism (none of which are shown), etc.

次に上記実施例の両面研磨措置1を使用して磁
気デイスク50を研磨する作用を説明する。
Next, the operation of polishing the magnetic disk 50 using the double-sided polishing device 1 of the above embodiment will be explained.

磁気デイスク50を供給する前に両処理部4,
5、ならびに保持装置34は回転を停止してい
る。そして可動側処理部5では、シリンダ装置3
3の収縮によつて上位研磨体30は上昇し、離間
している。この状態で、側方において各吸着具6
2により磁気デイスク50を吸着してなる移動台
58を横移動させ、両研磨体14,30に昇降体
60を位置させる。このとき各磁気デイスク50
が保持孔51に合致して対向している。次いでシ
リンダ装置61の伸展で昇降体60を下降させ、
磁気デイスク50を保持孔51に嵌装させる。そ
して吸着具62による吸着を解除したのち、シリ
ンダ装置61の収縮で昇降体60を上昇させ、さ
らに移動台58を横移動させて昇降体60を両研
磨体14,30の間から側方へ退去させる。この
とき、嵌装された磁気デイスク50の下面は下位
研磨体14で受止められる。次いでシリンダ装置
33の伸展により、ブラケツト32、スプライン
軸23などを介して上位研磨体30を下降させる
とともに各モータ10,19,48を始動させ
る。これにより上位研磨体30が磁気デイスク5
0の上面に接触し、かつ両研磨体14,30が相
反する方向に回転して各磁気デイスク50の両面
研磨が行なわれる。すなわち固定側処理部4で
は、モータ10の回転力が無端伝動装置12、回
転軸7、取付け板13などを介して下位研磨体1
4に伝えられ、この下位研磨体14を縦軸心9の
周りに回転させる。また可動側処理部5では、モ
ータ19の回転力が無端伝動装置21、内筒体1
6、スプライン筒22、スプライン軸23、ピン
28、取付け板29などを介して上位研磨体30
に伝えられ、この上位研磨体30を縦軸心18の
周りに回転させる。その際に両研磨体14,30
や磁気デイスク50の多少の変位は、球軸受26
を介してのフランジ材27の変位で吸収し得る。
上述した両面の研磨中に、モータ48の回転力は
無端伝動装置49、無端回動体47、縦軸42な
どを介して各駆動歯車41に伝えられる。これに
より各駆動歯車41に歯車部39を介して噛合し
ているキヤリツジ38が貫通孔37内で回転し、
そして磁気デイスク50がキヤリツジ38と同方
向に回転することになつて、磁気デイスク50の
両面研磨は全域に亘つて均一に行なわれることに
なる。駆動歯車41の回転力を受けて貫通孔37
内で回転するキヤリツジ38は、駆動歯車41と
歯車部39との噛合で平面方向の荷重が発生する
が、この荷重は、歯車部39の全周に存在する多
数の歯頂部群を介して貫通孔37の内周面のほぼ
全周で均一に受止められることになり、したがつ
てキヤリツジ38の強制回転は撓むことなく行な
われる。
Before supplying the magnetic disk 50, both processing units 4,
5 and the holding device 34 have stopped rotating. In the movable side processing section 5, the cylinder device 3
3, the upper polishing body 30 is raised and separated. In this state, each suction tool 6
2, the movable table 58 that attracts the magnetic disk 50 is moved laterally, and the elevating body 60 is positioned on both the polishing bodies 14 and 30. At this time, each magnetic disk 50
are aligned with and opposed to the holding hole 51. Next, the elevating body 60 is lowered by extension of the cylinder device 61,
The magnetic disk 50 is fitted into the holding hole 51. After releasing the suction by the suction tool 62, the cylinder device 61 contracts to raise the elevating body 60, and further moves the movable table 58 laterally to move the elevating body 60 out from between the polishing bodies 14 and 30 to the side. let At this time, the lower surface of the fitted magnetic disk 50 is received by the lower polishing body 14. Next, by extension of the cylinder device 33, the upper polishing body 30 is lowered via the bracket 32, the spline shaft 23, etc., and each motor 10, 19, 48 is started. As a result, the upper polishing body 30 is attached to the magnetic disk 5.
Both polishing bodies 14 and 30 are brought into contact with the top surface of the magnetic disk 50 and rotated in opposite directions, thereby polishing both sides of each magnetic disk 50. That is, in the fixed side processing section 4, the rotational force of the motor 10 is transmitted to the lower polishing body 1 via the endless transmission 12, the rotating shaft 7, the mounting plate 13, etc.
4 to rotate this lower polishing body 14 around the longitudinal axis 9. In addition, in the movable side processing section 5, the rotational force of the motor 19 is transferred to the endless transmission device 21, the inner cylinder body 1
6. Upper polishing body 30 via spline cylinder 22, spline shaft 23, pin 28, mounting plate 29, etc.
is transmitted to rotate this upper polishing body 30 around the vertical axis 18. At that time, both polishing bodies 14, 30
or some displacement of the magnetic disk 50, the ball bearing 26
This can be absorbed by the displacement of the flange material 27 via.
During the above-described polishing of both sides, the rotational force of the motor 48 is transmitted to each driving gear 41 via the endless transmission 49, the endless rotating body 47, the vertical shaft 42, etc. As a result, the carriage 38 meshing with each drive gear 41 via the gear portion 39 rotates within the through hole 37.
Since the magnetic disk 50 rotates in the same direction as the carriage 38, both sides of the magnetic disk 50 are polished uniformly over the entire area. The through hole 37 receives the rotational force of the drive gear 41.
The carriage 38 rotating inside generates a load in the planar direction due to the engagement between the drive gear 41 and the gear part 39, but this load is transmitted through a large number of tooth crest groups existing around the entire circumference of the gear part 39. It is uniformly received over almost the entire circumference of the inner peripheral surface of the hole 37, so that the forced rotation of the carriage 38 is performed without bending.

上記実施例では両縦軸心9,18を回転軸心と
した形式を述べたが、これは回転軸心を傾斜軸心
や横軸心とした形式であつてもよい。さらに実施
例では両面研磨形式を示したが、これは、たとえ
ば固定側処理部4を受け板構造とした片面研磨形
式であつてもよい。
In the above embodiment, a type in which both vertical axes 9 and 18 are the rotational axes has been described, but this may be a type in which the rotational axes are inclined or horizontal axes. Furthermore, although a double-sided polishing type is shown in the embodiment, this may be a single-sided polishing type in which the fixed side processing section 4 has a receiving plate structure, for example.

上記実施例では磁気デイスク50の研磨作業を
示したが、被処理板体としては磁気デイスク50
以外の物品であつてもよく、また処理装置による
処理作業は研磨以外であつてもよい。
In the above embodiment, the polishing work of the magnetic disk 50 was shown, but the magnetic disk 50 was used as the plate to be processed.
The article may be other than the above, and the processing operation performed by the processing device may be other than polishing.

考案の効果 上記構成の本考案によると、キヤリツジの保持
孔に被処理板体を嵌装したのち処理装置を作動さ
せることで、この被処理板体の面に対する処理作
業を行なうことができる。この処理作業中に駆動
歯車の回転力が歯車部を介してキヤリツジに伝え
られ、このキヤリツジを強制回転させることで被
処理板体の面全域に亘る均一な処理作業を行なう
ことができる。その際にキヤリツジにかかる荷重
は、歯車部の全周多数の歯頂部群を介して貫通孔
の内周面ほぼ全周で均一に受止めることができ、
したがつてキヤリツジの強制回転は撓むことなく
行なうことができて、全面均一で良好な研磨を行
なうことができる。
Effects of the Invention According to the present invention having the above-mentioned configuration, by fitting the plate to be processed into the holding hole of the carriage and then operating the processing device, the surface of the plate to be processed can be processed. During this processing operation, the rotational force of the drive gear is transmitted to the carriage via the gear section, and by forcing the carriage to rotate, uniform processing can be performed over the entire surface of the plate to be processed. At this time, the load applied to the carriage can be uniformly received almost all around the inner circumference of the through hole via the numerous tooth crest groups all around the gear part.
Therefore, the forced rotation of the carriage can be performed without bending, and uniform and good polishing can be performed on the entire surface.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図〜第3図は本考案の一実施例を示し、第
1図は縦断側面図、第2図は要部の平面図、第3
図は同縦断側面図、第4図は従来例を示す一部切
欠き正面図、第5図は同概略平面図である。 1……両面研磨装置(処理装置)、2……本体
(固定部)、4……固定側処理部、5……可動側処
理部、9……縦軸心、14……下位研磨体、18
……縦軸心、30……上位研磨体、34……保持
装置、36……板体、37……貫通孔、38……
キヤリツジ、39……歯車部、41……駆動歯
車、50……磁気デイスク(被処理板体)、51
……保持孔、55……移載装置、62……吸着
具。
Figures 1 to 3 show an embodiment of the present invention, with Figure 1 being a vertical sectional side view, Figure 2 being a plan view of the main parts, and Figure 3 being a plan view of the main parts.
4 is a partially cutaway front view showing a conventional example, and FIG. 5 is a schematic plan view of the same. DESCRIPTION OF SYMBOLS 1... Double side polishing device (processing device), 2... Main body (fixed part), 4... Fixed side processing part, 5... Movable side processing part, 9... Vertical axis center, 14... Lower polishing body, 18
... Vertical axis center, 30 ... Upper polishing body, 34 ... Holding device, 36 ... Plate body, 37 ... Through hole, 38 ...
Carriage, 39...Gear portion, 41...Drive gear, 50...Magnetic disk (plate to be processed), 51
... Holding hole, 55 ... Transfer device, 62 ... Suction tool.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 処理装置に対向する板体を固定部側に設け、こ
の板体に貫通孔を形成し、この貫通孔に嵌入し、
かつ貫通孔の内周面に摺接自在な歯車部を外周に
形成したキヤリツジを設けるとともに、このキヤ
リツジに被処理板体の保持孔を形成し、前記キヤ
リツジの歯車部に噛合する駆動歯車を固定部側に
設けたことを特徴とする被処理板体の保持装置。
A plate facing the processing device is provided on the fixed part side, a through hole is formed in this plate, and the plate is fitted into the through hole,
A carriage is provided with a gear portion formed on the outer periphery that can freely come into sliding contact with the inner circumferential surface of the through hole, a holding hole for the plate to be processed is formed in this carriage, and a drive gear that meshes with the gear portion of the carriage is fixed. A holding device for a plate to be processed, characterized in that it is provided on the side of the body.
JP1986175831U 1986-11-15 1986-11-15 Expired JPH0445808Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986175831U JPH0445808Y2 (en) 1986-11-15 1986-11-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986175831U JPH0445808Y2 (en) 1986-11-15 1986-11-15

Publications (2)

Publication Number Publication Date
JPS6383252U JPS6383252U (en) 1988-06-01
JPH0445808Y2 true JPH0445808Y2 (en) 1992-10-28

Family

ID=31115517

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986175831U Expired JPH0445808Y2 (en) 1986-11-15 1986-11-15

Country Status (1)

Country Link
JP (1) JPH0445808Y2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4242034B2 (en) * 2000-03-08 2009-03-18 スピードファム株式会社 Polishing method and polishing apparatus

Also Published As

Publication number Publication date
JPS6383252U (en) 1988-06-01

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