JP2659235B2 - Planar polishing apparatus and method for producing polished product with uniform polishing marks - Google Patents

Planar polishing apparatus and method for producing polished product with uniform polishing marks

Info

Publication number
JP2659235B2
JP2659235B2 JP63321699A JP32169988A JP2659235B2 JP 2659235 B2 JP2659235 B2 JP 2659235B2 JP 63321699 A JP63321699 A JP 63321699A JP 32169988 A JP32169988 A JP 32169988A JP 2659235 B2 JP2659235 B2 JP 2659235B2
Authority
JP
Japan
Prior art keywords
polished
rotation
polishing
holder
rotating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP63321699A
Other languages
Japanese (ja)
Other versions
JPH02167659A (en
Inventor
晃己 山本
義信 木村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHOWA ARUMINIUMU KK
Original Assignee
SHOWA ARUMINIUMU KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHOWA ARUMINIUMU KK filed Critical SHOWA ARUMINIUMU KK
Priority to JP63321699A priority Critical patent/JP2659235B2/en
Publication of JPH02167659A publication Critical patent/JPH02167659A/en
Application granted granted Critical
Publication of JP2659235B2 publication Critical patent/JP2659235B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Description

【発明の詳細な説明】 産業上の利用分野 この発明は、磁気ディスク用アルミニウム基板その他
の被研磨物の研磨加工に用いる平面研磨装置及び研磨跡
の方向の揃った研磨加工品の製造方法に関する。
Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a planar polishing apparatus used for polishing an aluminum substrate for a magnetic disk and other objects to be polished, and a method for manufacturing a polished product having a uniform direction of polishing marks.

従来の技術 この種の平面研磨装置の1つとして、回転可能に設け
られた1対の砥石と、これら砥石の間で自転しながら公
転可能に設けられた被研磨物保持器とを備え、該保持器
を自転、公転させつつ被研磨物に圧接した前記砥石を回
転させて被研磨物の研磨加工を行うものとなされている
平面研磨装置が知られている。このような研磨装置によ
れば、被研磨物保持器自体が自転、公転しているため被
研磨物を砥石の研磨面全体でまんべんなく研磨でき、砥
石の片減りを防止できるとともに加工精度の良好な研磨
面を得ることができる。
2. Description of the Related Art As one type of a planar polishing apparatus of this kind, a pair of grindstones rotatably provided, and an object holder to be polished provided revolvably while rotating between these grindstones, are provided. 2. Description of the Related Art There is known a planar polishing apparatus which performs a polishing process on an object to be polished by rotating the grindstone pressed against the object to be polished while rotating and revolving a retainer. According to such a polishing apparatus, the object-to-be-polished retainer itself rotates and revolves, so that the object to be polished can be evenly polished on the entire polished surface of the grindstone, and it is possible to prevent the loss of the grindstone and to improve the processing accuracy. A polished surface can be obtained.

発明が解決しようとする課題 ところが上記の平面研磨装置において、従来では、砥
石の回転停止と被研磨物保持器の回転停止が常に同時に
行われるものであったため、次のような欠点があった。
Problems to be Solved by the Invention However, in the above-mentioned planar polishing apparatus, conventionally, the rotation stop of the grindstone and the rotation stop of the holder for the object to be polished are always performed at the same time.

即ち、被研磨物保持器自体の自転・公転により、被研
磨物の研磨方向は加工中常時変化しているが、保持器の
回転停止と同時に砥石も停止するため、研磨終了に至る
までの被研磨物の研磨跡の方向が一定に揃わないことが
多い。このため、例えば磁気ディスク用Al基板のように
研磨跡を一定方向に揃えることが製品品質として要求さ
れるものを、この研磨装置で保留り良く製作することは
困難であるという欠点があった。
In other words, the polishing direction of the object to be polished is constantly changing during processing due to the rotation and revolution of the holder for the object to be polished, but the grindstone also stops at the same time as the rotation of the holder is stopped. In many cases, the directions of the polishing marks on the polished material are not uniform. For this reason, there is a drawback that it is difficult to manufacture a material such as an Al substrate for a magnetic disk, which requires polishing marks to be aligned in a certain direction as a product quality, with good retention using this polishing apparatus.

この発明はかかる技術的背景に鑑みてなされたもので
あって、研磨跡の方向を一定に揃えることのできる平面
研磨装置の提供を目的とし、さらには研磨跡の方向の揃
った研磨加工品の製造方法の提供を目的とするものであ
る。
The present invention has been made in view of such a technical background, and an object of the present invention is to provide a planar polishing apparatus capable of uniformly aligning the direction of a polishing mark. It is intended to provide a manufacturing method.

課題を解決するたための手段 上記目的において、この発明は、図面の符号を参照し
て示すと、回転可能に設けられた1対の砥石(3)
(4)と、これら砥石の間で自転しながら公転可能に設
けられた被研磨物保持器(7)とを備え、該保持器を自
転、公転させつつ被研磨物(B)に圧接した前記砥石
(3)(4)を回転させて被研磨物の研磨を行うものと
なされている平面研磨装置において、前記被研磨物保持
器(7)の回転停止自転より後に所定のタイムラグを置
いて前記砥石(3)(4)の回転を停止する機構が設け
られていることを特徴とするものである。さらにはま
た、回転可能に設けられた1対の砥石(3)(4)の間
で、被研磨物保持器(7)を自転させつつ公転させると
ともに、被研磨物(B)に圧接した前記砥石(3)
(4)を回転させて被研磨物(B)の研磨を行う研磨加
工品の製造方法において、前記被研磨物保持器(7)の
回転をまず停止したのち、所定のタイムラグを置いて前
記砥石(3)(4)の回転を停止することを特徴とする
ものである。
Means for Solving the Problems For the above purpose, the present invention, referring to the reference numerals in the drawings, shows a pair of rotatably provided grinding wheels (3).
And (4) a holder for the object to be polished (7) provided so as to be able to revolve while rotating between these whetstones. The holder is pressed against the object to be polished (B) while rotating and revolving the holder. In a planar polishing apparatus configured to perform polishing of an object to be polished by rotating the grindstones (3) and (4), a predetermined time lag is provided after a rotation stop rotation of the object to be polished holder (7). A mechanism for stopping the rotation of the grindstones (3) and (4) is provided. Furthermore, between the pair of rotatably provided grinding wheels (3) and (4), the workpiece holder (7) is revolved while rotating, and is pressed against the workpiece (B). Whetstone (3)
In the method for manufacturing a polished product in which the object (B) is polished by rotating (4), the rotation of the holder (7) is first stopped, and then the grinding wheel is placed at a predetermined time lag. (3) The rotation of (4) is stopped.

ここに、砥石(3)(4)は一般的には第1図及び第
2図に示すように、1対の回転対向定盤(1)(2)の
内面に取着されることにより、回転可能に支持されるも
のとなされる。また、被研磨物保持器(7)を自転・公
転可能となすための最も一般的な構成としては、該保持
器(7)を、砥石(3)(4)の回転中心に配した太陽
歯車(5)とこの太陽歯車(5)の同心外方に配した内
歯歯車(6)のいずれにもその外周面を噛合された状態
に配置し、これら太陽歯車(5)と内歯歯車(6)を回
転するようにしたものを挙げうる。また、砥石即ち定盤
(1)(2)や遊星歯車(5)、内歯歯車(6)の回転
駆動はモーター(11)〜(13)により行われ、これらモ
ーターの駆動はタイマー(21)(22)により行われるの
が一般的である。従って、被研磨物保持器(7)の自転
・公転の停止時点よりも後に所定のタイムラグを置いて
砥石(3)(4)の回転を停止する機構はタイマー(2
1)(22)に組込むのが良い。
Here, the grindstones (3) and (4) are generally attached to the inner surfaces of a pair of rotation facing plates (1) and (2) as shown in FIGS. It is rotatably supported. The most common configuration for enabling the holder (7) to be polished to rotate and revolve is a sun gear in which the holder (7) is arranged at the center of rotation of the grindstones (3) and (4). Both (5) and the internal gear (6) arranged concentrically outside the sun gear (5) have their outer peripheral surfaces meshed with each other, and these sun gear (5) and the internal gear ( And 6) may be rotated. Further, the rotation of the grindstones, that is, the platens (1) and (2), the planetary gears (5) and the internal gear (6) is performed by motors (11) to (13), and the motors are driven by a timer (21). It is generally performed by (22). Accordingly, the mechanism for stopping the rotation of the grindstones (3) and (4) with a predetermined time lag after the stop of the rotation / revolution of the workpiece holder (7) is a timer (2).
1) It is good to incorporate into (22).

作 用 被研磨物(B)を保持器(7)にセットしたのち定盤
(1)(2)を接近させて所定の加圧力で砥石(3)
(4)を被研磨物(B)に圧接させる。次いで、太陽歯
車(5)、内歯歯車(6)、定盤(1)(2)を回転駆
動する第1〜第3モーター(11)〜(13)の作動を制御
する第1、第2タイマー(21)(22)が同時にONとな
る。これにより、第3図に示すように、太陽歯車
(5)、内歯歯車(6)、定盤(1)(2)は回転を開
始したのち速度が徐々に上昇する。太陽歯車(5)と内
歯歯車(6)の回転により、被研磨物保持器(7)は砥
石の回転中心に対して時点しつつ公転をはじめる。速度
上昇後、太陽歯車(5)、内歯歯車(6)、定盤(1)
(2)は各定速度回転(N1)(N2)(N3)()とな
り、砥石(3)(4)の作用で被研磨物(B)の研磨加
工が遂行される。一定時間(T2)経過後まず第2タイマ
ー(22)がOFFとなる。これにより第2、第3モーター
(12)(13)がOFFになるが太陽歯車(5)と内歯歯車
(6)は慣性力で回転しつつ徐々に減速しやがて停止す
る。第2タイマー(22)のOFF後(T1−T2)のタイムラ
グを置いて第1タイマー(21)がOFFになる。これによ
り第1モーター(11)がOFFになるが定盤(1)(2)
は徐々に減速しつつも慣性力で回転しており、この間
に、既に停止した保持器(7)の被研磨物(B)が研磨
されることになる。このように研磨加工の終了間際に、
保持器(7)が停止した状態で砥石(3)(4)のみ回
転して加工が遂行される期間が生じるから、被研磨物
(B)の研磨方向が一定方向となり、得られる研磨加工
品の研磨跡も一定方向に揃うこととなる。
After setting the work to be polished (B) in the holder (7), the platens (1) and (2) are brought close to each other, and the grindstone (3) is pressed at a predetermined pressure.
(4) is pressed against the object to be polished (B). Next, the first and second motors for controlling the operations of the first to third motors (11) to (13) for rotating and driving the sun gear (5), the internal gear (6), and the platens (1) and (2). Timers (21) and (22) are turned on at the same time. As a result, as shown in FIG. 3, the speed of the sun gear (5), the internal gear (6), and the surface plates (1) and (2) gradually increases after starting rotation. Due to the rotation of the sun gear (5) and the internal gear (6), the workpiece holder (7) starts revolving with respect to the rotation center of the grinding wheel. After speed increase, sun gear (5), internal gear (6), surface plate (1)
(2) is a constant-speed rotation (N 1 ) (N 2 ) (N 3 ) ( 4 ), and the grinding of the workpiece (B) is performed by the action of the grindstones (3) and (4). After a lapse of a predetermined time (T 2 ), first, the second timer (22) is turned off. As a result, the second and third motors (12) and (13) are turned off, but the sun gear (5) and the internal gear (6) gradually decelerate while rotating by inertial force and then stop. First timer (21) is turned OFF at a time lag after OFF of the second timer (22) (T 1 -T 2). This turns off the first motor (11), but the platens (1) and (2)
Is rotating by inertial force while gradually decelerating. During this time, the object (B) to be polished of the holder (7) that has already stopped is polished. Thus, just before the end of the polishing process,
Since there is a period in which only the grindstones (3) and (4) are rotated and the processing is performed in a state where the retainer (7) is stopped, the polishing direction of the object to be polished (B) becomes a fixed direction, and the resulting polished product Will also be aligned in a certain direction.

実 施 例 次にこの発明の構成を第1図〜第3図に示す実施例に
基いて説明する。
Embodiment Next, the configuration of the present invention will be described based on the embodiment shown in FIGS.

第1図及び第2図において、(A)は平面研磨装置で
あり、該装置は上下一対の対向定盤(1)(2)と、各
定盤の内面に取着された上下砥石(3)(4)と、各砥
石(3)(4)の間において砥石の軸心に配置された太
陽歯車(5)と、該太陽歯車(5)の同心外方に配置さ
れた内歯歯車(6)と、前記太陽歯車(5)と内歯歯車
(6)のいずれにも外周面を噛合された状態に配置され
た1または2以上の薄板平歯車状の被研磨物保持器
(7)とを備えている。また、各保持器(7)には複数
の孔が形成されており、この孔に保持器よりも厚肉の円
板状被研磨物(B)が嵌め込み状態に保持されるものと
なされている。さらに、上下定盤(1)(2)は駆動軸
(1a)(2a)及びスプロケット(1b)(2b)を介して第
1モーター(11)に接続され、該モーター(11)の駆動
により回転するものとなされている。なお、上記定盤
(1)はシリンダー(図示せず)により昇降自在に支持
され、第1図に示す下降位置において駆動軸(1a)の上
端の係合部(1a′)に係合して、下側定盤(2)と逆方
向の回転力を付与されるものとなされている。一方、太
陽歯車(5)は駆動軸(5a)及びスプロケット(5b)を
介して第2モーター(12)に、また内歯歯車(6)は駆
動軸(6a)及びスプロケット(6b)を介して第3モータ
ー(13)にそれぞれ接続されており、これらモーター
(12)(13)の駆動によりそれぞれ異なる回転数で回転
し、これにより保持器(7)を遊星歯車状に自転させつ
つ公転させうるものとなされている。また、前記第1モ
ーター(11)の作動は第1タイマー(21)によって制御
され、この第1タイマーはON後T1時間経過したときにOF
Fするように設定されている。一方、第2、第3各モー
ター(12)(13)の作動は第2タイマー(22)によって
制御され、この第2タイマー(22)はON後T2時間経過し
たときにOFFするものとなされている。而して、第1タ
イマー(21)の作動時間T1は第2タイマー(22)の作動
時間T2よりも長く設定されている。これにより、太陽歯
車(5)及び内歯歯車(6)の回転が停止したのち、ほ
ぼ(T1−T2)時間のタイムラグを置いて上下定盤(1)
(2)の回転が停止するものとなされている。ここに、
(T1−T2)の好ましい値としては、1〜10秒程度に設定
するのが良い。なお、上記定盤(1)(2)、太陽歯車
(5)、内歯歯車(6)の回転数は、被研磨物(B)の
両面を等しく加工できるように予め所期する比率に設定
されている。
In FIGS. 1 and 2, (A) is a flat surface polishing apparatus, which comprises a pair of upper and lower opposing platens (1) and (2), and upper and lower grinding wheels (3) attached to the inner surface of each platen. ), (4), a sun gear (5) arranged at the axis of the grindstone between the grinding wheels (3) and (4), and an internal gear (5) arranged concentrically outside the sun gear (5). 6) and one or two or more thin plate spur-shaped workpiece holders (7) arranged so that the outer peripheral surface is meshed with any of the sun gear (5) and the internal gear (6). And Also, a plurality of holes are formed in each of the retainers (7), and a disk-shaped object to be polished (B) thicker than the retainers is held in these holes. . Further, the upper and lower stools (1) and (2) are connected to a first motor (11) via drive shafts (1a) (2a) and sprockets (1b) (2b), and are rotated by the drive of the motor (11). Is to be done. The platen (1) is supported by a cylinder (not shown) so as to be able to move up and down, and engages with an engaging portion (1a ') at the upper end of the drive shaft (1a) at a lowered position shown in FIG. , A rotational force in a direction opposite to that of the lower platen (2) is applied. On the other hand, the sun gear (5) is connected to the second motor (12) via the drive shaft (5a) and the sprocket (5b), and the internal gear (6) is connected via the drive shaft (6a) and the sprocket (6b). The third motor (13) is connected to the third motor (13), and the motors (12) and (13) are driven to rotate at different rotational speeds, whereby the retainer (7) can revolve while rotating in a planetary gear shape. It has been done. Also, the operation of the first motor (11) is controlled by a first timer (21), OF When the first timer has elapsed time T 1 after ON
F is set to. On the other hand, the operation of each of the second and third motors (12) and (13) is controlled by a second timer (22), and the second timer (22) is turned off when T 2 hours elapse after being turned on. ing. And Thus, the operation time T 1 of the first timer (21) is set to be longer than the operating time T 2 of the second timer (22). As a result, after the rotation of the sun gear (5) and the internal gear (6) is stopped, a time lag of approximately (T 1 -T 2 ) is left, and the upper and lower platens (1)
The rotation of (2) is stopped. here,
A preferable value of (T 1 −T 2 ) is preferably set to about 1 to 10 seconds. The rotation speeds of the platens (1) and (2), the sun gear (5), and the internal gear (6) are set to predetermined ratios so that both surfaces of the workpiece (B) can be processed equally. Have been.

次に図示した平面研磨装置の動作を、第3図の動作特
性図を参照しつつ説明する。
Next, the operation of the illustrated planar polishing apparatus will be described with reference to the operation characteristic diagram of FIG.

まず、被研磨物(B)を被研磨物保持器(7)にセッ
トしたのち、上下定盤(1)(2)を接続接近させて砥
石(3)(4)を所定の加圧力で被研磨物(B)に圧接
させる。続いて第1タイマー(21)、第2タイマー(2
2)が同時にONになる。すると第1〜第3各モーター(1
1)(12)(13)が駆動され、これにより上下定盤
(1)(2)、太陽歯車(5)、内歯歯車(6)は回転
を開始したのち第3図に示すように速度が徐々に上昇す
る。一方、太陽歯車(5)と内歯歯車(6)の回転によ
り被研磨物保持器(7)は上下砥石(3)(4)の回転
中心のまわりを自転しつつ公転をはじめる。速度上昇
後、太陽歯車(5)、内歯歯車(6)、定盤(1)
(2)は各定速度回転(N1)(N2)(N3)(N4)とな
る。第1、第2タイマーのON後時間T2が経過したときに
まず第2タイマー(22)がOFFとなる。これにより第
2、第3モーター(12)(13)はOFFになるが、太陽歯
車(5)と内歯歯車(6)は慣性力で回転しつつ徐々に
減速しやがて停止する。第2タイマー(22)のOFF後タ
イムラグ(T1−T2)を置いて今度は第1タイマー(21)
がOFFになる。これにより第1モーター(11)がOFFにな
るが上下定盤(1)(2)は徐々に減速しつつも慣性力
で回転しており、この間に、停止した保持器の被研磨物
(B)は引続き研磨加工を受ける。この被研磨物保持器
(7)の停止後の加工により被研磨物(B)の研磨方向
が一定となり、得られた研磨加工品の研磨跡が一定方向
に揃うこととなる。なお、比較のために第4図に従来の
太陽歯車(5)、内歯歯車(6)、上下定盤(1)
(2)の動作特性を示す。
First, after the object to be polished (B) is set in the object to be polished holder (7), the upper and lower platens (1) and (2) are connected and approached to apply the grindstones (3) and (4) at a predetermined pressure. It is brought into pressure contact with the polishing object (B). Then, the first timer (21) and the second timer (2
2) turns ON at the same time. Then the first to third motors (1
1) (12) and (13) are driven, whereby the upper and lower stools (1) and (2), the sun gear (5), and the internal gear (6) start rotating and then rotate as shown in FIG. Gradually rises. On the other hand, by the rotation of the sun gear (5) and the internal gear (6), the workpiece holder (7) starts revolving around the rotation center of the upper and lower grinding wheels (3) and (4). After speed increase, sun gear (5), internal gear (6), surface plate (1)
(2) becomes constant speed rotation (N 1 ) (N 2 ) (N 3 ) (N 4 ). First, second first second timer when after ON of the timer time T 2 has elapsed (22) is turned OFF. As a result, the second and third motors (12) and (13) are turned off, but the sun gear (5) and the internal gear (6) gradually decelerate while rotating by inertia and eventually stop. After a time lag (T 1 −T 2 ) after turning off the second timer (22), this time the first timer (21)
Turns off. As a result, the first motor (11) is turned off, but the upper and lower platens (1) and (2) are rotating with inertial force while gradually decelerating. ) Continues to be polished. The polishing direction of the object to be polished (B) is made constant by the processing after the holder of the object to be polished (7) is stopped, and the polishing traces of the obtained polished product are aligned in a certain direction. For comparison, FIG. 4 shows a conventional sun gear (5), internal gear (6), upper and lower stool (1).
The operation characteristic of (2) is shown.

発明の効果 この発明は、上述の次第で、被研磨物保持器の回転停
止自転より後に所定のタイムラグを置いて砥石の回転を
停止するものであるから、研磨加工の終了間際に保持器
が停止した状態で砥石のみ回転して加工が遂行される期
間が生じることになる。従って、加工終了後の研磨加工
品の研磨跡を一定方向に揃えることができ、磁気ディス
ク用Al基板等のように研磨跡を揃えることが製品品質と
して要求される部材を確実に歩留り良く製作提供でき
る。
According to the present invention, as described above, the rotation of the grindstone is stopped after a predetermined time lag after the rotation stop rotation of the holder to be polished, so that the holder is stopped just before the end of the polishing process. In this state, there occurs a period in which only the grindstone is rotated and processing is performed. Therefore, the polishing marks on the polished product after the processing can be aligned in a certain direction, and the members whose uniformity of the polishing marks such as the Al substrate for magnetic disk etc. is required as the product quality can be reliably manufactured and provided with high yield. it can.

【図面の簡単な説明】[Brief description of the drawings]

第1図は平面研磨装置の一部断面図、第2図は要部斜視
図、第3図は動作特性図、第4図は従来の動作特性図で
ある。 (A)……平面研磨装置、(B)……被研磨物、(1)
……上側定盤、(2)……下側定盤、(3)……上側砥
石、(4)……下側砥石、(5)……太陽歯車、(6)
……内歯歯車、(7)……被研磨物保持器。
FIG. 1 is a partial cross-sectional view of a planar polishing apparatus, FIG. 2 is a perspective view of a main part, FIG. 3 is an operation characteristic diagram, and FIG. (A) Planar polishing apparatus, (B) Polished object, (1)
... Upper platen, (2) ... Lower platen, (3) ... Upper grindstone, (4) ... Lower grindstone, (5) ... Sun gear, (6)
... internal gear, (7) ... holder to be polished.

Claims (2)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】回転可能に設けられた1対の砥石と、これ
ら砥石の間で自転しながら公転可能に設けられた被研磨
物保持器とを備え、該保持器を自転、公転させつつ被研
磨物に圧接した前記砥石を回転させて被研磨物の研磨を
行うものとなされている平面研磨装置において、前記被
研磨物保持器の回転停止時点より後に所定のタイムラグ
を置いて前記砥石の回転を停止する機構が設けられてい
ることを特徴とする平面研磨装置。
An object to be polished is provided with a pair of grindstones rotatably provided, and a holder for an object to be polished, which is rotatable between the grindstones and revolved. In a planar polishing apparatus configured to perform polishing of an object to be polished by rotating the grindstone pressed against the object to be polished, a predetermined time lag is provided after the rotation of the holder to be polished is stopped, and the rotation of the stone is performed. A polishing mechanism provided with a mechanism for stopping the polishing.
【請求項2】回転可能に設けられた1対の砥石の間で被
研磨物保持器を自転させつつ公転させるとともに、被研
磨物に圧接した前記砥石を回転させて被研磨物の研磨を
行う研磨加工品の製造方法において、前記被研磨物保持
器の回転をまず停止したのち、所定のタイムラグを置い
て前記砥石の回転を停止することを特徴とする研磨跡の
方向の揃った研磨加工品の製造方法。
2. A workpiece holder is rotated while rotating between a pair of rotatably provided grinding wheels, and the workpiece is polished by rotating the grinding stone pressed against the workpiece. In the method of manufacturing a polished product, after the rotation of the holder for the object to be polished is first stopped, the rotation of the grindstone is stopped after a predetermined time lag, and the polished product in which the direction of the polishing marks is uniform. Manufacturing method.
JP63321699A 1988-12-19 1988-12-19 Planar polishing apparatus and method for producing polished product with uniform polishing marks Expired - Lifetime JP2659235B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63321699A JP2659235B2 (en) 1988-12-19 1988-12-19 Planar polishing apparatus and method for producing polished product with uniform polishing marks

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63321699A JP2659235B2 (en) 1988-12-19 1988-12-19 Planar polishing apparatus and method for producing polished product with uniform polishing marks

Publications (2)

Publication Number Publication Date
JPH02167659A JPH02167659A (en) 1990-06-28
JP2659235B2 true JP2659235B2 (en) 1997-09-30

Family

ID=18135436

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63321699A Expired - Lifetime JP2659235B2 (en) 1988-12-19 1988-12-19 Planar polishing apparatus and method for producing polished product with uniform polishing marks

Country Status (1)

Country Link
JP (1) JP2659235B2 (en)

Also Published As

Publication number Publication date
JPH02167659A (en) 1990-06-28

Similar Documents

Publication Publication Date Title
KR970008384A (en) Silicon Wafer Manufacturing Method And Its Apparatus
KR20040019918A (en) Polishing machine
JPH1133886A (en) Method and device for polishing inside surface of glass disc
JPS61214964A (en) Chamfering device
JP2659235B2 (en) Planar polishing apparatus and method for producing polished product with uniform polishing marks
JP2000218482A (en) Paper sheet type end face polsher
JP4342012B2 (en) Plane polishing method and apparatus
CN115256233A (en) Disc surface finishing process of double-sided grinding machine table
JP4242034B2 (en) Polishing method and polishing apparatus
JP2001179600A (en) Dresser
JPS5915787B2 (en) Mirror polishing device
JP3334817B2 (en) Polishing method of glass plate
JP2644058B2 (en) Wafer processing equipment
JPH0349856A (en) Surface polishing method
JP3230551U (en) Wafer polishing equipment
JPS5828759Y2 (en) kenmabanno ji kouten undo usouchi
JPH0222213Y2 (en)
JPH0525806Y2 (en)
JP3051437B2 (en) Polishing control method by planetary gear type polishing machine
JP2714160B2 (en) Wet whetstone with pedestal and method of manufacturing the same
JP2866175B2 (en) Polishing method for both sides of work
JPS6316959A (en) Device for bevelling and polishing wafer
JPH06170708A (en) Spring polishing machine
JP4359370B2 (en) Polishing method
JPH0663861A (en) Lapping device