JP2644058B2 - Wafer processing equipment - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a processing apparatus for performing processing such as grinding, lapping, and polishing on a wafer such as silicon.

[Prior art] Conventionally, grinding, lapping,
In order to perform processing such as polishing, a processing apparatus that uses a frictional force by bringing a rotating processing surface into contact with one surface of a wafer is generally used. An example will be described with reference to FIG. 4. When the wafer 1 is fixed to the rotary table 2,
While rotating the grinding wheel 3 with the grinding wheel rotating motor 4,
By the balance weight 5 and the motor 6 for feeding the grinding wheel,
When the wafer is slowly lowered using the feed unit 7 and brought into contact with the wafer 1, the upper surface of the wafer is ground. The table driving motor 8 drives the rotary table 2 when exchanging wafers ("Research on Machinery" Vol. 4, No. 10).
No. 1989).

[Problems to be Solved by the Invention] However, in such a conventional processing apparatus, the processing time is reduced because only one side of the wafer can be processed, and at the same time, after the processing of one side of the wafer is completed, the processing apparatus is used for processing the other side. Due to the man-hours and time required to change the settings,
In addition to being economically problematic, there is the disadvantage that the risk of damaging the wafer increases when changing the settings.

Means for Solving the Problems The present invention reduces the processing time by simultaneously processing both sides of the wafer, eliminates the man-hour and time required for changing the processing surface, improves the yield, and improves grinding, lapping,
An object of the present invention is to provide a processing apparatus that can be used for any of polishing, and the present invention is to provide a wafer processing apparatus in which a rotating surface plate is brought into contact with a wafer and the surface is processed by friction. The three pairs of rotating surface plates which are sandwiched and opposed to each other, and the three rotating surface plates which are located on each side arranged opposite to each other, are connected to the same driving device via a rotation transmission mechanism. And three rotatable guide gears disposed between each of the three pairs of rotary platens and in contact with the periphery of the carrier, and a feed mechanism capable of pressing the wafer with an appropriate pressure. Wherein the carrier has an outer gear engraved on its peripheral edge so as to mesh with the guide gear and a holding hole for holding the wafer eccentrically.

 Hereinafter, the present invention will be described in detail with reference to the drawings.

FIG. 1 shows a vertical wafer processing apparatus of the present invention, and FIG.
The figure shows the relative positional relationship between the wafer, the grinding wheel, and the guide gear of this apparatus.

The wafer 1 held by the carrier 16 is divided into three upper grinding wheels 3a, 3b, and 3c, and a lower grinding wheel 3 facing each of the upper grinding wheels 3a, 3b, and 3c.
a ', 3b', 3c '. Each upper grinding wheel 3a, 3b, 3c
Is given a predetermined rotation by a grinding wheel rotating motor 9 as a driving device via a gear box 10 as a rotation transmitting mechanism, and the lower grinding wheels 3a ', 3b' and 3c 'are also driving devices. A predetermined rotation is given by a grinding wheel rotation motor 11 via a gear box 12 which is a rotation transmission mechanism.

The grinding wheel feed motor 6 is driven by a screw 13 to rotate the grinding wheel rotation motor 9, gear box 10, upper grinding wheel 3a,
3b and 3c are moved in the direction of the rotation axis, that is, in the vertical direction, and the wafer is ground by applying an appropriate pressure. In other words, the wafer 1 can be ground at an appropriate pressure by a feed mechanism of a rotary platen provided with the grinding wheel feed motor 6 and the screw 13.

The guide gears 18, 19 and 20 are each a pair of upper and lower grinding wheels.
Between 3a-3a 'and 3b-3b', between 3b-3b 'and 3c-3c', 3c
The carrier 16 is located between −3c ′ and 3a−3a ′ and is in contact with the periphery of the carrier 16.

The wafer 1 is held in a holding hole 17 of a carrier 16 having an outer gear engraved on the periphery, and the carrier 16 is forcibly driven by three guide gears 18, 19, 20 provided on the periphery,
The wafer 1 is rotated. When the carrier 1 is eccentrically held by the carrier 16, the wafer revolves while rotating.
The three surfaces of the upper and lower grinding wheels 3a-3a ', 3b-3b' and 3c-3c 'are used to uniformly grind both surfaces of the wafer over the entire surface. The number of wafers held by the carrier 16 is not limited to one, but a plurality of wafers can further improve the work efficiency.

Further, in the horizontal wafer processing apparatus shown in FIG. 3, the wafer 1 is erected, and is sandwiched between the grinding wheels 23a, 23b, and 23c and the grinding wheels 23a ', 23b', and 23c 'facing each other.
The grinding wheel may be rotated by the grinding wheel rotating motors 29 and 31 to perform grinding.

To wrap or polish wafers,
Instead of a grinding wheel, a lapping platen or a polishing platen is used, respectively. Further, the wafer processing apparatus of the present invention has a simple structure in which three upper to lower grinding wheels are driven by a single grinding wheel rotating motor, and a plurality of grinding wheels are respectively driven via a gear box. It can be used for any of grinding, lapping and polishing.

[Effect of the Invention] According to the present invention, the wafer is simultaneously ground and polished on both front and back surfaces over the entire surface at the same time. There is no loss of time and man-hours, and there is little risk of wafer damage due to the change of the setting of the processing equipment. The motor for rotating the grinding wheel, which is the driving device, is a single unit for the three upper or lower grinding wheels. The present invention has a simple structure driven by a motor for rotating a grinding wheel, and the present invention is extremely useful in industry.

[Brief description of the drawings]

FIG. 1 is a side view of a vertical wafer polishing apparatus according to the present invention, and FIG.
FIG. 1 is an explanatory view of the mutual position of a wafer, a grinding wheel, and a guide gear held on a carrier shown in FIG. 1, FIG. 3 is a side view of a horizontal wafer grinding device of the present invention, and FIG. 4 is a description of a conventional wafer grinding device. FIG. [Description of Signs] 1... Wafer 2... Rotating table 3... Grinding wheel 4. Grinding wheel rotation motor 5. Balance weight 6. Grinding wheel feeding motor 7. Unit, 8 ... Table drive motor, 9, 11, 29, 31 ... Grinding wheel rotation motor, 10, 12 ... Gear box, 16 ... Carrier, 17 ... Holding hole, 18 ... Gear, 3a , 3b, 3c ... upper grinding wheel, 3a ', 3b', 3c '... lower grinding wheel, 23a, 23b, 23c, 23a', 23b ', 23c' ... grinding wheel.

Claims (1)

(57) [Claims] In a wafer processing apparatus in which a rotating surface plate is brought into contact with a wafer and a surface is processed by friction, a rotating surface plate 3 for holding a wafer held by a carrier facing each other.
A set of pairs and three rotating bases located on each side arranged opposite to each other are connected to the same driving device via a rotation transmission mechanism, and the three sets of rotating bases are provided. , Three rotatable guide gears disposed so as to be in contact with the periphery of the carrier, and a feed mechanism capable of pressing the wafer with an appropriate pressure, wherein the carrier is provided at the periphery of the carrier. A wafer processing apparatus, comprising: an external gear carved so as to mesh with the guide gear; and a holding hole for eccentrically holding the wafer.