JPS6478758A - Polishing device for printing circuit board - Google Patents
Polishing device for printing circuit boardInfo
- Publication number
- JPS6478758A JPS6478758A JP62231901A JP23190187A JPS6478758A JP S6478758 A JPS6478758 A JP S6478758A JP 62231901 A JP62231901 A JP 62231901A JP 23190187 A JP23190187 A JP 23190187A JP S6478758 A JPS6478758 A JP S6478758A
- Authority
- JP
- Japan
- Prior art keywords
- board
- circuit board
- polishing pad
- printing circuit
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE:To improve the mirror surface flatness of a printing circuit board after a polishing process by applying a ring shape to a polishing pad in such a way that the printing circuit board when positioned at the innermost and outermost sides with the rotation of a rotary holder does not come in contact with the internal and external surfaces of the pad. CONSTITUTION:A printing circuit board 6 such as a silicon wafer is mounted to the/PCB mounting plate 5 of a rotary holder 3 and the board 6 is processed to a mirror surface with the polishing pad 10 of a rotary disc. In this case, when the rotary holder 3 rotates and the board 6 is positioned at the outermost side 6a and innermost side 6b, the board 6 does not contact the internal and external surfaces of the circular polishing pad 10. As a result, the board 6 moves always crossing the surface of the polishing pad 10 in a slant direction and the abrasion of the polishing pad 10 becomes uniform. Consequently, the flatness of the mirror surface of the board 6 after polishing is substantially improved.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62231901A JPS6478758A (en) | 1987-09-16 | 1987-09-16 | Polishing device for printing circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62231901A JPS6478758A (en) | 1987-09-16 | 1987-09-16 | Polishing device for printing circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6478758A true JPS6478758A (en) | 1989-03-24 |
Family
ID=16930819
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62231901A Pending JPS6478758A (en) | 1987-09-16 | 1987-09-16 | Polishing device for printing circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6478758A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04255218A (en) * | 1990-08-06 | 1992-09-10 | Micron Technol Inc | Method and apparatus for polishing of flat wafer |
JP2006324417A (en) * | 2005-05-18 | 2006-11-30 | Sumco Corp | Wafer-polishing apparatus and wafer-polishing method |
JP2012216253A (en) * | 2011-03-31 | 2012-11-08 | Konica Minolta Advanced Layers Inc | Method of manufacturing glass substrate for magnetic recording medium |
-
1987
- 1987-09-16 JP JP62231901A patent/JPS6478758A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04255218A (en) * | 1990-08-06 | 1992-09-10 | Micron Technol Inc | Method and apparatus for polishing of flat wafer |
JP2006324417A (en) * | 2005-05-18 | 2006-11-30 | Sumco Corp | Wafer-polishing apparatus and wafer-polishing method |
US7717768B2 (en) | 2005-05-18 | 2010-05-18 | Sumco Corporation | Wafer polishing apparatus and method for polishing wafers |
JP2012216253A (en) * | 2011-03-31 | 2012-11-08 | Konica Minolta Advanced Layers Inc | Method of manufacturing glass substrate for magnetic recording medium |
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