JPS6478758A - Polishing device for printing circuit board - Google Patents

Polishing device for printing circuit board

Info

Publication number
JPS6478758A
JPS6478758A JP62231901A JP23190187A JPS6478758A JP S6478758 A JPS6478758 A JP S6478758A JP 62231901 A JP62231901 A JP 62231901A JP 23190187 A JP23190187 A JP 23190187A JP S6478758 A JPS6478758 A JP S6478758A
Authority
JP
Japan
Prior art keywords
board
circuit board
polishing pad
printing circuit
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62231901A
Other languages
Japanese (ja)
Inventor
Kenji Enokida
Takashi Mazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP62231901A priority Critical patent/JPS6478758A/en
Publication of JPS6478758A publication Critical patent/JPS6478758A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To improve the mirror surface flatness of a printing circuit board after a polishing process by applying a ring shape to a polishing pad in such a way that the printing circuit board when positioned at the innermost and outermost sides with the rotation of a rotary holder does not come in contact with the internal and external surfaces of the pad. CONSTITUTION:A printing circuit board 6 such as a silicon wafer is mounted to the/PCB mounting plate 5 of a rotary holder 3 and the board 6 is processed to a mirror surface with the polishing pad 10 of a rotary disc. In this case, when the rotary holder 3 rotates and the board 6 is positioned at the outermost side 6a and innermost side 6b, the board 6 does not contact the internal and external surfaces of the circular polishing pad 10. As a result, the board 6 moves always crossing the surface of the polishing pad 10 in a slant direction and the abrasion of the polishing pad 10 becomes uniform. Consequently, the flatness of the mirror surface of the board 6 after polishing is substantially improved.
JP62231901A 1987-09-16 1987-09-16 Polishing device for printing circuit board Pending JPS6478758A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62231901A JPS6478758A (en) 1987-09-16 1987-09-16 Polishing device for printing circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62231901A JPS6478758A (en) 1987-09-16 1987-09-16 Polishing device for printing circuit board

Publications (1)

Publication Number Publication Date
JPS6478758A true JPS6478758A (en) 1989-03-24

Family

ID=16930819

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62231901A Pending JPS6478758A (en) 1987-09-16 1987-09-16 Polishing device for printing circuit board

Country Status (1)

Country Link
JP (1) JPS6478758A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04255218A (en) * 1990-08-06 1992-09-10 Micron Technol Inc Method and apparatus for polishing of flat wafer
JP2006324417A (en) * 2005-05-18 2006-11-30 Sumco Corp Wafer-polishing apparatus and wafer-polishing method
JP2012216253A (en) * 2011-03-31 2012-11-08 Konica Minolta Advanced Layers Inc Method of manufacturing glass substrate for magnetic recording medium

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04255218A (en) * 1990-08-06 1992-09-10 Micron Technol Inc Method and apparatus for polishing of flat wafer
JP2006324417A (en) * 2005-05-18 2006-11-30 Sumco Corp Wafer-polishing apparatus and wafer-polishing method
US7717768B2 (en) 2005-05-18 2010-05-18 Sumco Corporation Wafer polishing apparatus and method for polishing wafers
JP2012216253A (en) * 2011-03-31 2012-11-08 Konica Minolta Advanced Layers Inc Method of manufacturing glass substrate for magnetic recording medium

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