JPS6465825A - Multilayer electric device with monolithic ceramic body and manufacture of the same - Google Patents

Multilayer electric device with monolithic ceramic body and manufacture of the same

Info

Publication number
JPS6465825A
JPS6465825A JP63191973A JP19197388A JPS6465825A JP S6465825 A JPS6465825 A JP S6465825A JP 63191973 A JP63191973 A JP 63191973A JP 19197388 A JP19197388 A JP 19197388A JP S6465825 A JPS6465825 A JP S6465825A
Authority
JP
Japan
Prior art keywords
cavities
layers
ceramic
fillers
end faces
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63191973A
Other languages
English (en)
Inventor
Furoorian Haintsu
Untaarasu Yoozefu
Tsuetoru Furantsu
Ramuraa Yohan
Kerutsu Geruharuto
Mosuhanmaa Anna
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of JPS6465825A publication Critical patent/JPS6465825A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/008—Thermistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/18—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material comprising a plurality of layers stacked between terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H01G4/0085—Fried electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H01G4/302—Stacked capacitors obtained by injection of metal in cavities formed in a ceramic body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/148—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals embracing or surrounding the resistive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/1006—Thick film varistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/224—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H01G4/308—Stacked capacitors made by transfer techniques

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Electromagnetism (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Thermistors And Varistors (AREA)
  • Laminated Bodies (AREA)
JP63191973A 1987-07-31 1988-07-28 Multilayer electric device with monolithic ceramic body and manufacture of the same Pending JPS6465825A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19873725454 DE3725454A1 (de) 1987-07-31 1987-07-31 Elektrisches vielschichtbauelement mit einem gesinterten, monolithischen keramikkoerper und verfahren zur herstellung des elektrischen vielschichtbauelementes

Publications (1)

Publication Number Publication Date
JPS6465825A true JPS6465825A (en) 1989-03-13

Family

ID=6332821

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63191973A Pending JPS6465825A (en) 1987-07-31 1988-07-28 Multilayer electric device with monolithic ceramic body and manufacture of the same

Country Status (6)

Country Link
US (1) US4819128A (ja)
EP (1) EP0302274B1 (ja)
JP (1) JPS6465825A (ja)
AT (1) ATE81420T1 (ja)
DE (2) DE3725454A1 (ja)
ES (1) ES2035175T3 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01287902A (ja) * 1988-05-13 1989-11-20 Murata Mfg Co Ltd 正特性サーミスタ
WO1990006586A1 (en) * 1988-12-07 1990-06-14 Honshu Paper Co., Ltd. Metallized film for laminated chip capacitors and method of producing the same
JP2016513870A (ja) * 2013-03-07 2016-05-16 エプコス アクチエンゲゼルシャフトＥｐｃｏｓ Ａｇ コンデンサ構造体
JP2021518993A (ja) * 2018-06-22 2021-08-05 ティーディーケイ・エレクトロニクス・アクチェンゲゼルシャフトＴｄｋ Ｅｌｅｃｔｒｏｎｉｃｓ Ａｇ セラミック多層部品及びセラミック多層部品の製造方法

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US4935843A (en) * 1988-07-01 1990-06-19 Avx Corporation Lead filled ceramic capacitor
US4862318A (en) * 1989-04-04 1989-08-29 Avx Corporation Method of forming thin film terminations of low inductance ceramic capacitors and resultant article
DE4091418T1 (de) * 1989-08-24 1997-07-31 Murata Manufacturing Co Mehrschichtkondensator und Verfahren zu seiner Herstellung
JP2556151B2 (ja) * 1989-11-21 1996-11-20 株式会社村田製作所 積層型バリスタ
US5408574A (en) * 1989-12-01 1995-04-18 Philip Morris Incorporated Flat ceramic heater having discrete heating zones
JPH03187203A (ja) * 1989-12-07 1991-08-15 Siemens Ag 高容量バリスタ
JPH04352309A (ja) * 1991-05-29 1992-12-07 Rohm Co Ltd 積層セラミックコンデンサにおける端子電極の構造及び端子電極の形成方法
US5239744A (en) * 1992-01-09 1993-08-31 At&T Bell Laboratories Method for making multilayer magnetic components
EP0572151A3 (en) * 1992-05-28 1995-01-18 Avx Corp Varistors with cathodically vaporized connections and method for depositing cathodically vaporized connections on varistors.
US5565838A (en) * 1992-05-28 1996-10-15 Avx Corporation Varistors with sputtered terminations
JP3121119B2 (ja) * 1992-06-16 2000-12-25 ローム株式会社 積層セラミックコンデンサの外部電極の形成方法
US5468936A (en) * 1993-03-23 1995-11-21 Philip Morris Incorporated Heater having a multiple-layer ceramic substrate and method of fabrication
DE4410753C2 (de) * 1993-03-29 2003-02-20 Murata Manufacturing Co Kondensator-Array
US5473698A (en) * 1993-11-23 1995-12-05 Garnjost; Kenneth D. Method of controlling the application of counter-vibration to a structure
US6160472A (en) * 1995-03-24 2000-12-12 Tdk Corporation Multilayer varistor
JPH097877A (ja) * 1995-04-18 1997-01-10 Rohm Co Ltd 多層セラミックチップ型コンデンサ及びその製造方法
US5981084A (en) * 1996-03-20 1999-11-09 Metal Technology, Inc. Electrolytic process for cleaning electrically conducting surfaces and product thereof
JP3340625B2 (ja) * 1996-07-04 2002-11-05 株式会社村田製作所 表面実装型セラミック電子部品
EP0951724A2 (en) * 1997-04-25 1999-10-27 Koninklijke Philips Electronics N.V. Method of manufacturing an enveloped multilayer capacitor and an envelope multilayer capacitor
US6542352B1 (en) 1997-12-09 2003-04-01 Daniel Devoe Ceramic chip capacitor of conventional volume and external form having increased capacitance from use of closely spaced interior conductive planes reliably connecting to positionally tolerant exterior pads through multiple redundant vias
US6366443B1 (en) * 1997-12-09 2002-04-02 Daniel Devoe Ceramic chip capacitor of conventional volume and external form having increased capacitance from use of closely-spaced interior conductive planes reliably connecting to positionally-tolerant exterior pads through multiple redundant vias
EP1928034A3 (en) 1997-12-15 2008-06-18 Philips Lumileds Lighting Company LLC Light emitting device
JP3424742B2 (ja) * 1998-11-11 2003-07-07 株式会社村田製作所 正の抵抗温度特性を有する積層型半導体セラミック電子部品
US6222207B1 (en) 1999-05-24 2001-04-24 Lumileds Lighting, U.S. Llc Diffusion barrier for increased mirror reflectivity in reflective solderable contacts on high power LED chip
US6946685B1 (en) 2000-08-31 2005-09-20 Lumileds Lighting U.S., Llc Light emitting semiconductor method and device
US6960366B2 (en) * 2002-04-15 2005-11-01 Avx Corporation Plated terminations
US7463474B2 (en) * 2002-04-15 2008-12-09 Avx Corporation System and method of plating ball grid array and isolation features for electronic components
US7576968B2 (en) * 2002-04-15 2009-08-18 Avx Corporation Plated terminations and method of forming using electrolytic plating
US7152291B2 (en) 2002-04-15 2006-12-26 Avx Corporation Method for forming plated terminations
US6982863B2 (en) * 2002-04-15 2006-01-03 Avx Corporation Component formation via plating technology
US7177137B2 (en) * 2002-04-15 2007-02-13 Avx Corporation Plated terminations
US6661639B1 (en) 2002-07-02 2003-12-09 Presidio Components, Inc. Single layer capacitor
US6917509B1 (en) 2002-11-21 2005-07-12 Daniel F. Devoe Single layer capacitor with dissimilar metallizations
DE10317584B4 (de) * 2003-04-16 2007-07-12 Siemens Ag Vorrichtung und Verfahren zum Herstellen einer Vorrichtung mit einem ersten Körper aus Stahl und einem Isolator
US6885539B1 (en) 2003-12-02 2005-04-26 Presidio Components, Inc. Single layer capacitor
DE102004020329A1 (de) * 2004-04-26 2005-11-10 Epcos Ag Elektrische Funktionseinheit und Verfahren zu deren Herstellung
KR100742966B1 (ko) * 2004-12-22 2007-07-25 동부일렉트로닉스 주식회사 멀티층 커패시터 및 그 제조 방법
DE102005017108A1 (de) * 2005-01-26 2006-07-27 Epcos Ag Piezoelektrisches Bauelement
US7292429B2 (en) * 2006-01-18 2007-11-06 Kemet Electronics Corporation Low inductance capacitor
DE102008029426A1 (de) * 2008-06-23 2010-01-07 Epcos Ag Verfahren zur Herstellung eines Vielschichtbauelements, Vielschichtbauelement und Schablone
JP5532027B2 (ja) * 2010-09-28 2014-06-25 株式会社村田製作所 積層セラミック電子部品およびその製造方法
GB2502971B (en) 2012-06-11 2017-10-04 Knowles (Uk) Ltd A capacitive structure
DE102014110553A1 (de) * 2014-07-25 2016-01-28 Epcos Ag Sensorelement, Sensoranordnung und Verfahren zur Herstellung eines Sensorelements
US11443898B2 (en) 2017-04-10 2022-09-13 Presidio Components. Inc. Multilayer broadband ceramic capacitor with internal air gap capacitance
WO2019108885A1 (en) * 2017-12-01 2019-06-06 Avx Corporation Low aspect ratio varistor
DE102018104459A1 (de) * 2018-02-27 2019-08-29 Tdk Electronics Ag Vielschichtbauelement mit externer Kontaktierung

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GB932558A (en) * 1959-09-14 1963-07-31 Electricity Council Improvements in or relating to electric heaters
US3394386A (en) * 1966-09-12 1968-07-23 Vitramon Inc Method of calibrating electrical components
US3683849A (en) * 1970-04-27 1972-08-15 Dixon Corp K Coating apparatus
US3679950A (en) * 1971-04-16 1972-07-25 Nl Industries Inc Ceramic capacitors
US3740624A (en) * 1972-06-21 1973-06-19 Sprague Electric Co Monolithic capacitor having corner internal electrode terminations
US3879645A (en) * 1973-09-24 1975-04-22 Nl Industries Inc Ceramic capacitors
US4071880A (en) * 1974-06-10 1978-01-31 N L Industries, Inc. Ceramic bodies with end termination electrodes
US4395184A (en) * 1980-02-21 1983-07-26 Palomar Systems & Machines, Inc. Means and method for processing miniature electronic components such as capacitors or resistors
CA1180779A (en) * 1981-09-25 1985-01-08 Elliott Philofsky Ceramic capacitor and method of making same
US4584629A (en) * 1984-07-23 1986-04-22 Avx Corporation Method of making ceramic capacitor and resulting article
US4604676A (en) * 1984-10-02 1986-08-05 Murata Manufacturing Co., Ltd. Ceramic capacitor
ATE35344T1 (de) * 1985-01-17 1988-07-15 Siemens Bauelemente Ohg Spannungsabhaengiger elektrischer widerstand (varistor).
US4561954A (en) * 1985-01-22 1985-12-31 Avx Corporation Method of applying terminations to ceramic bodies
JPH0316251Y2 (ja) * 1985-03-04 1991-04-08
JPS61236110A (ja) * 1985-04-11 1986-10-21 株式会社村田製作所 積層セラミツクコンデンサ
DE3638286A1 (de) * 1986-11-10 1988-05-11 Siemens Ag Elektrisches bauelement aus keramik mit mehrlagenmetallisierung und verfahren zu seiner herstellung

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01287902A (ja) * 1988-05-13 1989-11-20 Murata Mfg Co Ltd 正特性サーミスタ
WO1990006586A1 (en) * 1988-12-07 1990-06-14 Honshu Paper Co., Ltd. Metallized film for laminated chip capacitors and method of producing the same
EP0447550A1 (en) * 1988-12-07 1991-09-25 Honshu Paper Co., Ltd. Method for producing a metallized film for laminated chip capacitors
EP0447550B1 (en) * 1988-12-07 1997-04-09 Honshu Paper Co., Ltd. Method for producing a metallized film for laminated chip capacitors
JP2016513870A (ja) * 2013-03-07 2016-05-16 エプコス アクチエンゲゼルシャフトＥｐｃｏｓ Ａｇ コンデンサ構造体
US9905363B2 (en) 2013-03-07 2018-02-27 Epcos Ag Capacitor arrangement
JP2018207119A (ja) * 2013-03-07 2018-12-27 エプコス アクチエンゲゼルシャフトＥｐｃｏｓ Ａｇ コンデンサ構造体
JP2021036593A (ja) * 2013-03-07 2021-03-04 ティーディーケイ・エレクトロニクス・アクチェンゲゼルシャフトＴｄｋ Ｅｌｅｃｔｒｏｎｉｃｓ Ａｇ コンデンサ構造体
JP2021518993A (ja) * 2018-06-22 2021-08-05 ティーディーケイ・エレクトロニクス・アクチェンゲゼルシャフトＴｄｋ Ｅｌｅｃｔｒｏｎｉｃｓ Ａｇ セラミック多層部品及びセラミック多層部品の製造方法

Also Published As

Publication number Publication date
US4819128A (en) 1989-04-04
EP0302274B1 (de) 1992-10-07
DE3725454A1 (de) 1989-02-09
EP0302274A1 (de) 1989-02-08
DE3875180D1 (de) 1992-11-12
ES2035175T3 (es) 1993-04-16
ATE81420T1 (de) 1992-10-15

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