JPS6461087A - Resin composition for printed wiring board - Google Patents

Resin composition for printed wiring board

Info

Publication number
JPS6461087A
JPS6461087A JP62218610A JP21861087A JPS6461087A JP S6461087 A JPS6461087 A JP S6461087A JP 62218610 A JP62218610 A JP 62218610A JP 21861087 A JP21861087 A JP 21861087A JP S6461087 A JPS6461087 A JP S6461087A
Authority
JP
Japan
Prior art keywords
wiring board
resin composition
printed wiring
resist ink
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62218610A
Other languages
English (en)
Other versions
JPH0529155B2 (ja
Inventor
Shinichi Inoue
Kuniaki Asai
Kazuo Hinobeta
Tadayasu Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Chemical Co Ltd
Original Assignee
Sumitomo Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Chemical Co Ltd filed Critical Sumitomo Chemical Co Ltd
Priority to JP62218610A priority Critical patent/JPS6461087A/ja
Priority to DE3853456T priority patent/DE3853456T2/de
Priority to EP88113614A priority patent/EP0305846B1/en
Priority to CA000575379A priority patent/CA1312160C/en
Priority to US07/236,721 priority patent/US4943606A/en
Publication of JPS6461087A publication Critical patent/JPS6461087A/ja
Publication of JPH0529155B2 publication Critical patent/JPH0529155B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C08K3/26—Carbonates; Bicarbonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0248—Needles or elongated particles; Elongated cluster of chemically bonded particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0251—Non-conductive microfibers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
JP62218610A 1987-09-01 1987-09-01 Resin composition for printed wiring board Granted JPS6461087A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP62218610A JPS6461087A (en) 1987-09-01 1987-09-01 Resin composition for printed wiring board
DE3853456T DE3853456T2 (de) 1987-09-01 1988-08-22 Harzzusammensetzung für gedruckte Schaltungen.
EP88113614A EP0305846B1 (en) 1987-09-01 1988-08-22 Resin composition for printed circuit board
CA000575379A CA1312160C (en) 1987-09-01 1988-08-22 Resin composition for printed circuit board
US07/236,721 US4943606A (en) 1987-09-01 1988-08-26 Resin composition for printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62218610A JPS6461087A (en) 1987-09-01 1987-09-01 Resin composition for printed wiring board

Publications (2)

Publication Number Publication Date
JPS6461087A true JPS6461087A (en) 1989-03-08
JPH0529155B2 JPH0529155B2 (ja) 1993-04-28

Family

ID=16722652

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62218610A Granted JPS6461087A (en) 1987-09-01 1987-09-01 Resin composition for printed wiring board

Country Status (5)

Country Link
US (1) US4943606A (ja)
EP (1) EP0305846B1 (ja)
JP (1) JPS6461087A (ja)
CA (1) CA1312160C (ja)
DE (1) DE3853456T2 (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0198637A (ja) * 1987-10-09 1989-04-17 Polyplastics Co 液晶性ポリエステル樹脂成形品の表面処理法
JPH03220257A (ja) * 1989-11-06 1991-09-27 Toray Ind Inc 液晶ポリエステル樹脂組成物
JPH0645719A (ja) * 1992-04-03 1994-02-18 Internatl Business Mach Corp <Ibm> 熱可塑性基体のためのバイア及びパッド構造体並びにこの構造体を形成するための方法及び装置
JP2002203735A (ja) * 2000-12-27 2002-07-19 Ibiden Co Ltd コンデンサ、多層プリント配線板および多層プリント配線板の製造方法
WO2018092838A1 (ja) * 2016-11-18 2018-05-24 住友化学株式会社 発泡成形体および発泡成形体の製造方法
US11345811B2 (en) 2016-11-18 2022-05-31 Sumitomo Chemical Company, Limited Liquid crystal polymer composition for foam molding, method for producing foam molded body, and foam molded body

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61231525A (ja) * 1985-04-08 1986-10-15 Hitachi Ltd 強誘電性液晶素子とその製造方法
DE3889025T2 (de) * 1987-01-28 1994-07-21 Nissha Printing Farbfilter und verfahren zur herstellung.
US5409979A (en) * 1989-02-08 1995-04-25 Polyplastics Co., Ltd. Liquid-crystal polyester resin composition containing specified mold release agents
US5085807A (en) * 1989-05-15 1992-02-04 Toray Industries, Inc. Flame-retardant liquid crystal polyester composition, process for preparation thereof and injection-molded article composed thereof
JP2714440B2 (ja) * 1989-06-06 1998-02-16 ポリプラスチックス株式会社 精密細線回路用基板の製造方法
JPH0724328B2 (ja) * 1989-07-03 1995-03-15 ポリプラスチックス株式会社 精密細線回路用成形品の製造方法
JP2816864B2 (ja) * 1989-07-07 1998-10-27 大塚化学株式会社 搬送用ウエーハバスケット及び収納ケース
DE3932882A1 (de) * 1989-10-02 1991-04-11 Siemens Ag Gut waermeleitender verbundwerkstoff
JP3074696B2 (ja) * 1990-03-30 2000-08-07 住友化学工業株式会社 液晶ポリエステル樹脂組成物
DE4028210A1 (de) * 1990-09-06 1992-03-12 Basf Ag Verfahren zur oberflaechenbehandlung von formkoerpern auf der basis von fluessigkristallinen polymeren
US5115080A (en) * 1990-10-24 1992-05-19 E. I. Du Pont De Nemours And Company Thermotropic liquid crystalline polyesters from 2-methylhydroquinone
US5397502A (en) * 1993-06-10 1995-03-14 E. I. Du Pont De Nemours And Company Heat resistant liquid crsytalline polymers
DE69433719T2 (de) * 1993-08-19 2005-03-24 General Electric Co. Mineralgefüllte thermoplastische Formmasse
GB9411101D0 (en) * 1994-06-03 1994-07-27 Rennie Stephen A Polyamide compositions
DE69623858T2 (de) * 1995-06-09 2003-08-07 Sumitomo Chemical Co., Ltd. Verwendung anorganischer Oxide oder Hydroxide in flüssigkristallinen Polyesterharzen
JP4035861B2 (ja) 1997-07-08 2008-01-23 住友化学株式会社 芳香族ポリエステル組成物
BE1011624A4 (fr) * 1997-12-17 1999-11-09 Laude Lucien Diego Supports de circuit electrique.
US6190759B1 (en) 1998-02-18 2001-02-20 International Business Machines Corporation High optical contrast resin composition and electronic package utilizing same
US6593255B1 (en) 1998-03-03 2003-07-15 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
US8105690B2 (en) 1998-03-03 2012-01-31 Ppg Industries Ohio, Inc Fiber product coated with particles to adjust the friction of the coating and the interfilament bonding
US6949289B1 (en) 1998-03-03 2005-09-27 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
US6419981B1 (en) 1998-03-03 2002-07-16 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
US6616794B2 (en) * 1998-05-04 2003-09-09 Tpl, Inc. Integral capacitance for printed circuit board using dielectric nanopowders
US6608760B2 (en) 1998-05-04 2003-08-19 Tpl, Inc. Dielectric material including particulate filler
US20040109298A1 (en) * 1998-05-04 2004-06-10 Hartman William F. Dielectric material including particulate filler
JP2000294922A (ja) * 1999-04-01 2000-10-20 Victor Co Of Japan Ltd 多層プリント配線板用の絶縁樹脂組成物
TW539614B (en) * 2000-06-06 2003-07-01 Matsushita Electric Works Ltd Laminate
JP2002080724A (ja) * 2000-09-04 2002-03-19 Sumitomo Chem Co Ltd 熱可塑性樹脂組成物およびその成形体
US6916527B2 (en) * 2001-01-18 2005-07-12 Matsushita Electric Works, Ltd. Resin moldings
US6989412B2 (en) * 2001-06-06 2006-01-24 Henkel Corporation Epoxy molding compounds containing phosphor and process for preparing such compositions
US8062746B2 (en) * 2003-03-10 2011-11-22 Ppg Industries, Inc. Resin compatible yarn binder and uses thereof
US20060074166A1 (en) * 2003-12-19 2006-04-06 Tpl, Inc. Title And Interest In An Application Moldable high dielectric constant nano-composites
US20060074164A1 (en) * 2003-12-19 2006-04-06 Tpl, Inc. Structured composite dielectrics
US20080128961A1 (en) * 2003-12-19 2008-06-05 Tpl, Inc. Moldable high dielectric constant nano-composites
US7354641B2 (en) 2004-10-12 2008-04-08 Ppg Industries Ohio, Inc. Resin compatible yarn binder and uses thereof
JP2008300238A (ja) * 2007-05-31 2008-12-11 Nitto Denko Corp 配線回路基板および燃料電池
KR101552716B1 (ko) * 2008-06-13 2015-09-11 삼성전기주식회사 서모셋 모노머 가교제, 이를 포함하는 인쇄회로기판 형성용조성물 및 이를 이용한 인쇄회로기판
JP2010050378A (ja) * 2008-08-25 2010-03-04 Nitto Denko Corp 配線回路基板および燃料電池
JP2011091030A (ja) * 2009-09-25 2011-05-06 Nitto Denko Corp 配線回路基板および燃料電池
WO2014081650A1 (en) * 2012-11-21 2014-05-30 Ticona Llc Liquid crystalline polymer composition for melt-extruded substrates
JP2023515976A (ja) 2020-02-26 2023-04-17 ティコナ・エルエルシー 回路構造体
CN115605560A (zh) * 2020-02-26 2023-01-13 提克纳有限责任公司（Us） 电子器件
JP2023514820A (ja) 2020-02-26 2023-04-11 ティコナ・エルエルシー 電子デバイス
EP4110610A4 (en) 2020-02-26 2024-03-27 Ticona LLC POLYMER COMPOSITION FOR ELECTRONIC DEVICE
US11728065B2 (en) 2020-07-28 2023-08-15 Ticona Llc Molded interconnect device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5778455A (en) * 1980-07-16 1982-05-17 Ici Ltd Formed article containing polymer showing anisotropy in molten state and formation thereof
JPS6130031A (ja) * 1984-07-21 1986-02-12 Rohm Co Ltd 半導体装置の製造方法
JPS6254073A (ja) * 1985-09-02 1987-03-09 Polyplastics Co 表面金属処理した樹脂成形品

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5298084A (en) * 1976-02-12 1977-08-17 Hitachi Ltd Unsaturated polyester resin compositions for pressure molding
US4425457A (en) * 1980-08-06 1984-01-10 Celanese Corporation High gloss polyethylene terephthalate reinforced resin compositions
US4487877A (en) * 1981-12-07 1984-12-11 Matsushita Electric Industrial Co., Ltd. Diaphragm for loudspeaker
US4375530A (en) * 1982-07-06 1983-03-01 Celanese Corporation Polyester of 2,6-naphthalene dicarboxylic acid, 2,6-dihydroxy naphthalene, terephthalic acid, and hydroquinone capable of forming an anisotropic melt
US4431770A (en) * 1982-07-29 1984-02-14 Celanese Corporation Wholly aromatic polyester comprising 4-oxy-4'-carboxybiphenyl moiety which is capable of forming an anisotropic melt phase
US4540737A (en) * 1983-02-07 1985-09-10 Celanese Corporation Method for the formation of composite articles comprised of thermotropic liquid crystalline polymers and articles produced thereby
JPS61316A (ja) * 1984-06-13 1986-01-06 住友化学工業株式会社 オ−ブンウエア
US4719250A (en) * 1984-06-18 1988-01-12 Hoechst Celanese Corporation Encapsulation of electronic components
JPS61255957A (ja) * 1985-05-10 1986-11-13 Mitsui Petrochem Ind Ltd 強化ポリエステル組成物
JPS6298792A (ja) * 1985-10-25 1987-05-08 旭化成株式会社 フレキシブルプリント配線用基板
JPH0739534B2 (ja) * 1986-12-10 1995-05-01 ポリプラスチックス株式会社 表面特性の良好な液晶性ポリエステル樹脂組成物
JP2506352B2 (ja) * 1986-12-29 1996-06-12 株式会社クラレ 全芳香族ポリエステル及びそれを用いた射出成形品の製造法
JPS63178166A (ja) * 1987-01-16 1988-07-22 Sumitomo Chem Co Ltd 芳香族ポリスルフォン樹脂組成物

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5778455A (en) * 1980-07-16 1982-05-17 Ici Ltd Formed article containing polymer showing anisotropy in molten state and formation thereof
JPS6130031A (ja) * 1984-07-21 1986-02-12 Rohm Co Ltd 半導体装置の製造方法
JPS6254073A (ja) * 1985-09-02 1987-03-09 Polyplastics Co 表面金属処理した樹脂成形品

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0198637A (ja) * 1987-10-09 1989-04-17 Polyplastics Co 液晶性ポリエステル樹脂成形品の表面処理法
JPH03220257A (ja) * 1989-11-06 1991-09-27 Toray Ind Inc 液晶ポリエステル樹脂組成物
JPH0645719A (ja) * 1992-04-03 1994-02-18 Internatl Business Mach Corp <Ibm> 熱可塑性基体のためのバイア及びパッド構造体並びにこの構造体を形成するための方法及び装置
JP2002203735A (ja) * 2000-12-27 2002-07-19 Ibiden Co Ltd コンデンサ、多層プリント配線板および多層プリント配線板の製造方法
WO2018092838A1 (ja) * 2016-11-18 2018-05-24 住友化学株式会社 発泡成形体および発泡成形体の製造方法
US11345811B2 (en) 2016-11-18 2022-05-31 Sumitomo Chemical Company, Limited Liquid crystal polymer composition for foam molding, method for producing foam molded body, and foam molded body

Also Published As

Publication number Publication date
EP0305846A3 (en) 1990-06-20
EP0305846B1 (en) 1995-03-29
EP0305846A2 (en) 1989-03-08
CA1312160C (en) 1992-12-29
DE3853456D1 (de) 1995-05-04
DE3853456T2 (de) 1995-09-28
US4943606A (en) 1990-07-24
JPH0529155B2 (ja) 1993-04-28

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