JPS645888Y2 - - Google Patents

Info

Publication number
JPS645888Y2
JPS645888Y2 JP1982167028U JP16702882U JPS645888Y2 JP S645888 Y2 JPS645888 Y2 JP S645888Y2 JP 1982167028 U JP1982167028 U JP 1982167028U JP 16702882 U JP16702882 U JP 16702882U JP S645888 Y2 JPS645888 Y2 JP S645888Y2
Authority
JP
Japan
Prior art keywords
ball
wire
wire bonding
inert gas
blowing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1982167028U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5972730U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1982167028U priority Critical patent/JPS5972730U/ja
Publication of JPS5972730U publication Critical patent/JPS5972730U/ja
Application granted granted Critical
Publication of JPS645888Y2 publication Critical patent/JPS645888Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/0711Apparatus therefor
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/0711Apparatus therefor
    • H10W72/07141Means for applying energy, e.g. ovens or lasers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/0711Apparatus therefor
    • H10W72/07168Means for storing or moving the material for the connector
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/075Connecting or disconnecting of bond wires
    • H10W72/07502Connecting or disconnecting of bond wires using an auxiliary member

Landscapes

  • Wire Bonding (AREA)
JP1982167028U 1982-11-05 1982-11-05 ワイヤボンデイング装置 Granted JPS5972730U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982167028U JPS5972730U (ja) 1982-11-05 1982-11-05 ワイヤボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982167028U JPS5972730U (ja) 1982-11-05 1982-11-05 ワイヤボンデイング装置

Publications (2)

Publication Number Publication Date
JPS5972730U JPS5972730U (ja) 1984-05-17
JPS645888Y2 true JPS645888Y2 (enExample) 1989-02-14

Family

ID=30365525

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982167028U Granted JPS5972730U (ja) 1982-11-05 1982-11-05 ワイヤボンデイング装置

Country Status (1)

Country Link
JP (1) JPS5972730U (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9586842B2 (en) 2006-06-22 2017-03-07 Evoqua Water Technologies Llc Low scale potential water treatment

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5592029B2 (ja) * 2012-01-26 2014-09-17 株式会社新川 酸化防止ガス吹き出しユニット

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9586842B2 (en) 2006-06-22 2017-03-07 Evoqua Water Technologies Llc Low scale potential water treatment

Also Published As

Publication number Publication date
JPS5972730U (ja) 1984-05-17

Similar Documents

Publication Publication Date Title
JP5877460B2 (ja) 樹脂部品の溶着装置及び樹脂部品の溶着方法
HK28596A (en) Wire bonding
US5285949A (en) Wire-bonding method, wire-bonding apparatus, and semiconductor device produced by the wire-bonding method
KR20010015104A (ko) 와이어본딩장치 및 방법
JPS645888Y2 (enExample)
JPS60227432A (ja) ボンデイング用ワイヤのボ−ル形成装置
JP2889399B2 (ja) テープ自動化ボンディング法
JPS6158246A (ja) ワイヤボンデイング方法
JPH01251628A (ja) ボンディング装置
JPS61172343A (ja) ワイヤボンデイング方法及び装置
JPH0587976B2 (enExample)
CN105122434B (zh) 氧化防止气体吹出单元
JP2004208347A (ja) 被覆線ワイヤーの被覆除去装置
JPH0238451Y2 (enExample)
JPS63147338A (ja) ワイヤボンデイング装置用ト−チ
JPH08153723A (ja) 半田ボール形成方法および装置
JPH11320089A (ja) ワイヤと端子のアーク溶接方法
JPH0691123B2 (ja) ワイヤボンダにおけるボ−ル形成方法
JPS61198741A (ja) ボ−ルボンデイング方法及びその装置
JPS61253825A (ja) 半導体素子の組立方法
JPH0325020B2 (enExample)
JP3582398B2 (ja) 半導体圧力センサーの製造方法及びその装置
JPH0527977B2 (enExample)
JP2829471B2 (ja) ワイヤボンダ
JPS6197937A (ja) 半導体素子の組立方法及びその装置