KR20010015104A - 와이어본딩장치 및 방법 - Google Patents

와이어본딩장치 및 방법 Download PDF

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KR20010015104A
KR20010015104A KR1020000036879A KR20000036879A KR20010015104A KR 20010015104 A KR20010015104 A KR 20010015104A KR 1020000036879 A KR1020000036879 A KR 1020000036879A KR 20000036879 A KR20000036879 A KR 20000036879A KR 20010015104 A KR20010015104 A KR 20010015104A
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temperature
heater block
resin substrate
bonding
heater
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KR1020000036879A
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KR100370986B1 (ko
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교마스류이치
미야노후미오
도야마도시히코
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후지야마 겐지
가부시키가이샤 신가와
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Abstract

디바이스의 상면을 필요한 온도로 유지하고, 또한 수지제 기판의 연화 및 변형을 일으키지 않는 온도로 유지하여 와이어본딩을 행할 수 있다.
히터(11)를 갖는 히터블록(4)의 상방에 배열설치되고, 디바이스(1)의 칩(3)부분을 가열하는 칩 가열수단(20)과 히터블록(4)을 냉각시키도록 이 히터블록(4)에 설치된 냉각파이브(10)를 구비하고, 디바이스(1)의 본딩표면온도를 본딩가능한 온도로 유지하고, 히터블록(4)의 온도를 냉각파이브(10)에 흐르는 냉수 또는 냉풍으로 냉각하여 수지제 기판(2)을 연화시키지 않는 저온으로 유지한다.

Description

와이어본딩장치 및 방법{WIRE BONDING APPARATUS AND METHOD}
본 발명은 와이어본딩장치 및 방법에 관한 것으로, 특히 반도체장치 등의 디바이스의 가열에 관한 것이다.
일반적으로 디바이스의 기판은 금속으로 이루어져 있다. 최근 원가절감의 면에서 수지제 기판에 다수의 칩을 밀집시켜서 탑재하고, 그것에 와이어본딩한 후, 일괄해서 몰딩하고, 그 후 개개의 디바이스로 하는 방법이 채택되도록 되어 있다.
와이어본딩에 있어서는, 본딩의 신뢰성을 향상시키기 위해 디바이스의 표면온도를 높게 유지하는 목적으로, 기판의 하면을 히터블록으로 가열하고 있다. 그렇지만 수지는 연화온도가 150℃ 정도로 낮고, 또한 단열성이 높으므로, 기판의 하면을 히터블록으로 가열하는 방법은, 본딩하는 칩의 표면을 고온으로 하는 것이 어렵다. 더구나 히터블록을 구비한 와이어본딩장치로서, 예를 들면 일본 특개평 4－262545호 공보를 들을 수 있다.
그래서, 칩의 상방으로부터 열풍을 본딩부분에 불어서 가열하는 것이 고려된다. 이 방법에서도 안정된 본딩을 행하기 위하여 200℃의 온도의 열을 장시간 가하면, 기판이 연화되는 가능성이 있다. 기판이 연화되면, 본딩시에 캐필러리의 초음파에너지 및 하중이 기판에 흡수되어 없어지고, 안정된 본딩이 행해지지 않는다는 문제가 있으므로, 연화를 방지하는 것이 과제로 되어 있다. 더욱이, 칩의 상방에 열풍을 불어서 가열하는 것으로서, 예를 들면 일본 특개소 59－184537호 공보를 들을 수 있다.
본 발명의 과제는, 디바이스의 상면을 필요한 온도로 유지하고, 또한 수지제 기판의 연화 및 변형을 일으키지 않는 온도로 유지하여 와이어본딩을 행하는 것이 가능한 와이어본딩장치 및 방법을 제공하는 데 있다.
도 1은 본 발명의 와이어본딩장치의 일실시예의 형태를 도시하는 단면도.
(부호의 설명)
1 : 디바이스 2 : 수지제 기판
3 : 칩 4 : 히터블록
7 : 캐필러리 8 : 와이어
10 : 냉각파이프 11 : 히터
20 : 칩 가열수단 22 : 전열선
26 : 열풍
상기 과제를 해결하기 위한 본 발명의 와이어본딩장치의 제 1 수단은, 수지제 기판을 갖는 디바이스를, 히터를 갖는 히터블록상에 얹어놓고, 프레임 가압부로 고정해서 와이어본딩하는 와이어본딩장치에 있어서, 디바이스의 본딩표면온도를 본딩가능한 온도로 유지하고, 상기 히터블록의 온도를 냉각수단으로 냉각해서 상기 수지제 기판을 연화하지 않는 저온으로 유지하는 것을 특징으로 한다.
상기 과제를 해결하기 위한 본 발명의 와이어본딩장치의 제 2 수단은, 수지제 기판을 갖는 디바이스를, 히터를 갖는 히터블록상에 얹어놓고, 프레임 가압부로 고정해서 와이어본딩하는 와이어본딩장치에 있어서, 상기 히터블록의 상방에 배열설치되고, 상기 디바이스의 칩부분을 가열하는 칩 가열수단과, 상기 히터블록을 냉각시키도록 이 히터블록에 설치된 히터블록 냉각수단을 구비하고, 상기 디바이스의 본딩표면온도를 본딩가능한 온도로 유지하고, 상기 히터블록의 온도를 냉각수단으로 냉각하여 상기 수지제 기판을 연화하지 않는 저온으로 유지하는 것을 특징으로 한다.
상기 과제를 해결하기 위한 본 발명의 와이어본딩방법은, 수지제 기판을 갖는 디바이스를, 히터를 갖는 히터블록상에 얹어놓고, 프레임 가압부로 고정해서 와이어본딩하는 와이어본딩방법에 있어서, 디바이스의 본딩표면온도를 본딩가능한 온도로 유지하고, 상기 히터블록의 온도를 냉각수단으로 냉각하여 상기 수지제 기판을 연화하지 않는 저온으로 유지하는 것을 특징으로 한다.
(발명의 실시형태)
본 발명의 일 실시형태를 도 1에 의해 설명한다. 디바이스(1)는 수지제 기판(2) 상에 칩(3)이 부착되어 있다. 수지제 기판(2)은 히터블록(4) 상에 위치결정 얹어놓이고, 프레임 가압부(5)에 의해 고정된다. 칩(3)의 패드와 수지제 기판(2)의 리드에는 초음파혼(6)의 선단에 고정된 캐필러리(7)에 의해, 캐필러리(7)에 끼워통하게 된 와이어(8)가 접속된다. 이상은 주지의 구조이므로, 이 이상의 설명은 생략한다.
히터블록(4)의 중심에는, 냉수 또는 냉풍이 흐르는 냉각파이프(10)가 배열설치되어 있다. 히터블록(4)의 냉각파이프(10)의 양측에는, 히터(11)가 배열설치되어 있다.
히터블록(4)의 상방에는, 칩(3)을 가열하는 칩 가열수단(20)이 배열설치되어 있다. 칩 가열수단(20)은, 가열본체(21)의 내부에 전열선(22)이 배열설치되고, 가열본체(21)의 상단부에는 압축공기(23)를 공급하는 파이프(24)가 접속되어 있다. 가열본체(21)의 하단부에는, 열풍을 층류로 하여 흐르게 하는 벌집구조형상의 정류판(25)이 고정되어 있다.
다음에 작용에 관해서 설명한다. 압축공기(23)는 전열선(22)에 의해 가열되어서 열풍(26)으로 되고, 이 열풍(26)은 정류판(25)에 의해 층류로 되어 칩(3) 및 그 주변을 가열하고, 디바이스(1)의 본딩면을 필요한 온도로 한다. 수지제 기판(2)의 하면은, 히터(11)와 파이프(24)에 흐르는 냉수 또는 냉풍에 의해 온도를 제어하고, 수지제 기판(2)의 온도를 연화점이하, 예를 들면 130℃로 유지한다.
이것에 의해 디바이스(1) 상면은 본딩에 충분한 온도가 얻어짐과 동시에, 수지제 기판(2)의 온도를 수지제 기판(2)의 연화점이하로 유지할 수가 있다. 더욱이, 수지제 기판(2)에 필요한 온도는, 수지제 기판(2)의 재질에 의해 상이하다. 또 수지제 기판(2)의 하면의 온도는, 히터블록(4)에 온도계를 설치함으로써 용이하게 측정될 수 있다. 또 디바이스(1)의 상면의 온도제어는, 디바이스표면으로부터 방사되는 적외선을 측정하여 행할 수 있다. 간이한 방법으로서는, 디바이스(1)가 가열되어 발생되는 가스를 측정하여 행할 수 있다.
이와 같이, 파이프(24)에 흐르는 냉수 또는 냉풍을 제어함으로써 디바이스(1)의 본딩표면온도를 본딩가능한 온도로 유지하고, 또 수지제 기판(2)을 연화하지 않는 충분한 저온으로 유지하여 본딩을 행할 수 있다.
본 발명은 디바이스의 본딩표면온도를 본딩가능한 온도로 유지하고, 히터를 갖는 히터블록의 온도를 냉각수단으로 냉각시켜서 상기 수지제 기판을 연화되지 않는 저온으로 유지하므로, 디바이스의 상면을 필요한 온도로 유지하고, 또한 수지제 기판의 연화 및 변형을 일으키지 않는 온도로 유지하여 와이어본딩을 행할 수 있다.

Claims (3)

  1. 수지제 기판을 갖는 디바이스를, 히터를 갖는 히터블록상에 얹어놓고, 프레임 가압부로 고정하여 와이어본딩하는 와이어본딩장치에 있어서,
    디바이스의 본딩표면온도를 본딩가능한 온도로 유지하고, 상기 히터블록의 온도를 냉각수단으로 냉각하여 상기 수지제 기판을 연화하지 않는 저온으로 유지하는 것을 특징으로 하는 와이어본딩장치.
  2. 수지제 기판을 갖는 디바이스를, 히터를 갖는 히터블록상에 얹어놓고, 프레임 가압부로 고정하여 와이어본딩하는 와이어본딩장치에 있어서,
    상기 히터블록의 상방에 배열설치되고, 상기 디바이스의 칩부분을 가열하는 칩 가열수단과, 상기 히터블록을 냉각시키도록 이 히터블록에 설치된 히터블록 냉각수단을 구비하고, 상기 디바이스의 본딩표면온도를 본딩 가능한 온도로 유지하고, 상기 히터블록의 온도를 냉각수단으로 냉각하여 상기 수지제 기판을 연화하지 않는 저온으로 유지하는 것을 특징으로 하는 와이어본딩장치.
  3. 수지제 기판을 갖는 디바이스를, 히터를 갖는 히터블록상에 얹어놓고, 프레임 가압부로 고정하여 와이어본딩하는 와이어본딩방법에 있어서,
    디바이스의 본딩표면온도를 본딩가능한 온도로 유지하고, 상기 히터블록의 온도를 냉각수단으로 냉각하여 상기 수지제 기판을 연화하지 않는 저온으로 유지하는 것을 특징으로 하는 와이어본딩방법.
KR10-2000-0036879A 1999-07-02 2000-06-30 와이어본딩장치 및 방법 KR100370986B1 (ko)

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