JPS5972730U - ワイヤボンデイング装置 - Google Patents

ワイヤボンデイング装置

Info

Publication number
JPS5972730U
JPS5972730U JP1982167028U JP16702882U JPS5972730U JP S5972730 U JPS5972730 U JP S5972730U JP 1982167028 U JP1982167028 U JP 1982167028U JP 16702882 U JP16702882 U JP 16702882U JP S5972730 U JPS5972730 U JP S5972730U
Authority
JP
Japan
Prior art keywords
wire bonding
ball
blowing
bonding apparatus
temperature gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1982167028U
Other languages
English (en)
Other versions
JPS645888Y2 (ja
Inventor
幸一郎 渥美
Original Assignee
株式会社東芝
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社東芝 filed Critical 株式会社東芝
Priority to JP1982167028U priority Critical patent/JPS5972730U/ja
Publication of JPS5972730U publication Critical patent/JPS5972730U/ja
Application granted granted Critical
Publication of JPS645888Y2 publication Critical patent/JPS645888Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は本考案の一実施例のワイヤボンディング装置の
側面図、第２図は同じく吹出体の断面図、第３図は同じ
く超音波ホーン先端部分の斜視図、第４図は本考案の他
の実施例のワイヤボンディング装置の超音波ホーン先端
部分の斜視図、第５図は同じく吹出体の構造を示す断面
図、第６図は第１図はワイヤボンディング装置の変形例
を示す側面図、第７図は第５図に示す吹出体の変形例を
示す断面図である。 ２・・・キャピラリ、５・・・ワイヤ、８・・・ボール
、９・・・金属膜（被接合部材）、１０．１７・・・吹
出体、１２・・・噴出孔（第２の）。

Claims (6)

    【実用新案登録請求の範囲】
  1. （１）キャピラリに通されたワイヤの先端部にボールを
    形成し、このボールを被接合部材に圧着させるワイヤボ
    ンディング装置において、上記ボールに対して高温ガス
    を噴出させる吹出体を設けたことを特徴とするワイヤボ
    ンディング装置。
  2. （２）吹出体は環状に形成されてワイヤと同軸に配設さ
    れ、上記吹出体の被接合部材に対向する部位に高温ガス
    を噴出させる複数の噴出孔が穿設されていることを特徴
    とする実用新案登録請求の範囲第１項記載のワイヤボン
    ディング装置。
  3. （３）　　吹出体は先端がボールに向って高温ガスを噴
    出するノズルに形成された管体であることを特徴とする
    実用新案登録請求の範囲第１項記載のワイヤボンディン
    グ装置。
  4. （４）　　吹出体はボールを中心に複数個等配されてい
    ることを特徴とする実用新案登録請求の範囲第３項記載
    のワイヤボンディング装置。
  5. （５）高温ガスは不活性ガスであることを特徴とする実
    用新案登録請求の範囲第１項ないし第４項のいずれかに
    記載のワイヤボンディング装置。
  6. （６）高温ガスの温度はボールの融点以下であることを
    特徴とする実用新案登録請求の範囲第１項ないし第４項
    のいずれかに記載のワイヤボンディング装置。
JP1982167028U 1982-11-05 1982-11-05 ワイヤボンデイング装置 Granted JPS5972730U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982167028U JPS5972730U (ja) 1982-11-05 1982-11-05 ワイヤボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982167028U JPS5972730U (ja) 1982-11-05 1982-11-05 ワイヤボンデイング装置

Publications (2)

Publication Number Publication Date
JPS5972730U true JPS5972730U (ja) 1984-05-17
JPS645888Y2 JPS645888Y2 (ja) 1989-02-14

Family

ID=30365525

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982167028U Granted JPS5972730U (ja) 1982-11-05 1982-11-05 ワイヤボンデイング装置

Country Status (1)

Country Link
JP (1) JPS5972730U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013111452A1 (ja) * 2012-01-26 2013-08-01 株式会社新川 酸化防止ガス吹き出しユニット

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080067069A1 (en) 2006-06-22 2008-03-20 Siemens Water Technologies Corp. Low scale potential water treatment

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013111452A1 (ja) * 2012-01-26 2013-08-01 株式会社新川 酸化防止ガス吹き出しユニット
JPWO2013111452A1 (ja) * 2012-01-26 2015-05-11 株式会社新川 酸化防止ガス吹き出しユニット

Also Published As

Publication number Publication date
JPS645888Y2 (ja) 1989-02-14

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