JPS6442113U - - Google Patents

Info

Publication number
JPS6442113U
JPS6442113U JP13844087U JP13844087U JPS6442113U JP S6442113 U JPS6442113 U JP S6442113U JP 13844087 U JP13844087 U JP 13844087U JP 13844087 U JP13844087 U JP 13844087U JP S6442113 U JPS6442113 U JP S6442113U
Authority
JP
Japan
Prior art keywords
cavity
mold
resin
sealed
molds
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13844087U
Other languages
English (en)
Other versions
JPH0512018Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987138440U priority Critical patent/JPH0512018Y2/ja
Publication of JPS6442113U publication Critical patent/JPS6442113U/ja
Application granted granted Critical
Publication of JPH0512018Y2 publication Critical patent/JPH0512018Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図は本考案のゲート部構造を示す縦断面図
、第２図は第１図のゲート部構造により樹脂封止
した状態を示す概略図、第３図は従来のゲート部
構造により樹脂封止した状態を示す概略図、第４
図は第３図により樹脂封止された樹脂部の一部を
分離した際に発生した樹脂カケを示す概略図であ
る。 １…キヤビテイ、２…ゲート、３…突起、４…
リードフレーム。

Claims (1)

    【実用新案登録請求の範囲】
  1. 一対の金型からなり、一方の金型の型面にキヤ
    ビテイを形成した片面キヤビテイタイプの樹脂封
    止金型において、キヤビテイの上面より深さ方向
    にずらせた位置で樹脂の注入部を該キヤビテイ内
    に開口したことを特徴とする樹脂封止金型。
JP1987138440U 1987-09-10 1987-09-10 Expired - Lifetime JPH0512018Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987138440U JPH0512018Y2 (ja) 1987-09-10 1987-09-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987138440U JPH0512018Y2 (ja) 1987-09-10 1987-09-10

Publications (2)

Publication Number Publication Date
JPS6442113U true JPS6442113U (ja) 1989-03-14
JPH0512018Y2 JPH0512018Y2 (ja) 1993-03-26

Family

ID=31400779

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987138440U Expired - Lifetime JPH0512018Y2 (ja) 1987-09-10 1987-09-10

Country Status (1)

Country Link
JP (1) JPH0512018Y2 (ja)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56154045U (ja) * 1980-04-11 1981-11-18
JPS5778641U (ja) * 1980-10-30 1982-05-15
JPS5788530U (ja) * 1980-11-20 1982-06-01

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56154045U (ja) * 1980-04-11 1981-11-18
JPS5778641U (ja) * 1980-10-30 1982-05-15
JPS5788530U (ja) * 1980-11-20 1982-06-01

Also Published As

Publication number Publication date
JPH0512018Y2 (ja) 1993-03-26

Similar Documents

Publication Publication Date Title
JPS6442113U (ja)
JPH032638U (ja)
JPS5961923U (ja) 射出成形用金型
JPH0390922U (ja)
JPH0415854U (ja)
JPH028034U (ja)
JPH01156016U (ja)
JPS6357742U (ja)
JPS6321017U (ja)
JPH02104636U (ja)
JPH0195736U (ja)
JPS6420728U (ja)
JPS6167113U (ja)
JPS6113952U (ja) 半導体装置用リ−ドフレ−ム
JPH01115240U (ja)
JPS6260313U (ja)
JPS6280331U (ja)
JPS6360312U (ja)
JPH0167741U (ja)
JPH0185013U (ja)
JPS61179746U (ja)
JPH02121215U (ja)
JPS6183036U (ja)
JPS63128014U (ja)
JPH0289834U (ja)