JPH028034U - - Google Patents

Info

Publication number
JPH028034U
JPH028034U JP8341688U JP8341688U JPH028034U JP H028034 U JPH028034 U JP H028034U JP 8341688 U JP8341688 U JP 8341688U JP 8341688 U JP8341688 U JP 8341688U JP H028034 U JPH028034 U JP H028034U
Authority
JP
Japan
Prior art keywords
frame
fixing pin
suction port
sucking
molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8341688U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8341688U priority Critical patent/JPH028034U/ja
Publication of JPH028034U publication Critical patent/JPH028034U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図は本考案の実施例１を示す断面図、第２
図は本考案の実施例２を示す断面図、第３図は従
来例を示す断面図である。 １……下金型、２……上金型、３……固定ピン
、４……ゲート、５……ランナー、６……リード
フレーム、７……ペレツト、８……固定ピンの吸
着口。

Claims (1)

    【実用新案登録請求の範囲】
  1. 樹脂モールドパツケージを成形する金型におい
    て、被封止フレームを支持する固定ピンに、該フ
    レームを吸着させる吸着口を有することを特徴と
    する半導体封止金型。
JP8341688U 1988-06-23 1988-06-23 Pending JPH028034U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8341688U JPH028034U (ja) 1988-06-23 1988-06-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8341688U JPH028034U (ja) 1988-06-23 1988-06-23

Publications (1)

Publication Number Publication Date
JPH028034U true JPH028034U (ja) 1990-01-18

Family

ID=31308135

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8341688U Pending JPH028034U (ja) 1988-06-23 1988-06-23

Country Status (1)

Country Link
JP (1) JPH028034U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05131492A (ja) * 1991-11-13 1993-05-28 Enplas Corp 射出成形による合成樹脂被覆装置
JP2009269486A (ja) * 2008-05-08 2009-11-19 Nishikawa Rubber Co Ltd ウェザーストリップ

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05131492A (ja) * 1991-11-13 1993-05-28 Enplas Corp 射出成形による合成樹脂被覆装置
JP2009269486A (ja) * 2008-05-08 2009-11-19 Nishikawa Rubber Co Ltd ウェザーストリップ

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