JPS6437017A - Removal of residual film - Google Patents

Removal of residual film

Info

Publication number
JPS6437017A
JPS6437017A JP62193508A JP19350887A JPS6437017A JP S6437017 A JPS6437017 A JP S6437017A JP 62193508 A JP62193508 A JP 62193508A JP 19350887 A JP19350887 A JP 19350887A JP S6437017 A JPS6437017 A JP S6437017A
Authority
JP
Japan
Prior art keywords
needless
resist
residual film
exposed
residual
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62193508A
Other languages
Japanese (ja)
Inventor
Takeshi Chiwata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hoya Corp
Original Assignee
Hoya Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoya Corp filed Critical Hoya Corp
Priority to JP62193508A priority Critical patent/JPS6437017A/en
Publication of JPS6437017A publication Critical patent/JPS6437017A/en
Pending legal-status Critical Current

Links

Landscapes

  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)

Abstract

PURPOSE:To enable any needless residual films to be removed by a method wherein respective processes are performed to remove the first needless residual film on a substrate and then the other respective processes are performed to remove the second needless film. CONSTITUTION:The main surface side of a substrate 2 with the first needless residual film 8 and the second needless residual film g is coated with the first negative type resist 15; the region of resist 15 positioned around the part of resist 15 corresponding to the first needless residual film 8 is exposed for development ; the first resist patterns 17 are formed; the first needless residual film 8 exposed is etched away; and the first resist patterns 17 are peeled off. Next, the main surface side of the substrate 2 is coated with the second negative type resist 18; the region of resist 18 positioned around the part of resist 18 corresponding to the second needless residual film 9 is exposed for development; the second resist patterns 20 are formed; the second needless residual film 9 exposed is etched away; and the second resist patterns 20 are peeled off. Through these procedures, both needless residual films 8, 9 can be removed without fail.
JP62193508A 1987-07-31 1987-07-31 Removal of residual film Pending JPS6437017A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62193508A JPS6437017A (en) 1987-07-31 1987-07-31 Removal of residual film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62193508A JPS6437017A (en) 1987-07-31 1987-07-31 Removal of residual film

Publications (1)

Publication Number Publication Date
JPS6437017A true JPS6437017A (en) 1989-02-07

Family

ID=16309222

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62193508A Pending JPS6437017A (en) 1987-07-31 1987-07-31 Removal of residual film

Country Status (1)

Country Link
JP (1) JPS6437017A (en)

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