JPS6491137A - Formation of positive type thick film resist pattern - Google Patents

Formation of positive type thick film resist pattern

Info

Publication number
JPS6491137A
JPS6491137A JP62248058A JP24805887A JPS6491137A JP S6491137 A JPS6491137 A JP S6491137A JP 62248058 A JP62248058 A JP 62248058A JP 24805887 A JP24805887 A JP 24805887A JP S6491137 A JPS6491137 A JP S6491137A
Authority
JP
Japan
Prior art keywords
resist
photomask
positive type
wafer
formation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62248058A
Other languages
Japanese (ja)
Inventor
Tsutomu Miyashita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP62248058A priority Critical patent/JPS6491137A/en
Publication of JPS6491137A publication Critical patent/JPS6491137A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PURPOSE:To improve the adhesiveness of a thick resist film formed by using a positive type resist to a 2nd photomask and to improve the yield of pattern formation by removing the thick part in the end part of said resist film or forming said part to the same thickness as the thickness of the central part by using a lot photomask. CONSTITUTION:The resist film 11 is formed on a wafer 10 by coating the positive type resist thereon and drying the coating. The resist in the end part of the wafer is thereafter exposed by the 1st photomask and is developed to remove the resist in the end part of the wafer or to form the resist film having the same film thickness as the film thickness in the central part of the wafer. The required pattern is then exposed by the 2nd photomask 13 and is developed. Since the adhesiveness of the resist film to the 2nd photomask is thereby improved, the yield of the pattern formation is improved.
JP62248058A 1987-10-02 1987-10-02 Formation of positive type thick film resist pattern Pending JPS6491137A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62248058A JPS6491137A (en) 1987-10-02 1987-10-02 Formation of positive type thick film resist pattern

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62248058A JPS6491137A (en) 1987-10-02 1987-10-02 Formation of positive type thick film resist pattern

Publications (1)

Publication Number Publication Date
JPS6491137A true JPS6491137A (en) 1989-04-10

Family

ID=17172573

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62248058A Pending JPS6491137A (en) 1987-10-02 1987-10-02 Formation of positive type thick film resist pattern

Country Status (1)

Country Link
JP (1) JPS6491137A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5615897A (en) * 1994-09-19 1997-04-01 U-Sun Gasket Corporation Gasket material layer including cork, fibers, rubber, and a rubber chemical

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5615897A (en) * 1994-09-19 1997-04-01 U-Sun Gasket Corporation Gasket material layer including cork, fibers, rubber, and a rubber chemical

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