JPS5580323A - Pattern forming method for photoresist-film - Google Patents
Pattern forming method for photoresist-filmInfo
- Publication number
- JPS5580323A JPS5580323A JP15453878A JP15453878A JPS5580323A JP S5580323 A JPS5580323 A JP S5580323A JP 15453878 A JP15453878 A JP 15453878A JP 15453878 A JP15453878 A JP 15453878A JP S5580323 A JPS5580323 A JP S5580323A
- Authority
- JP
- Japan
- Prior art keywords
- film
- concave
- photoresist
- remained
- ultra
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
PURPOSE: To obtain a precise pattern by employing a positive photoresist twice in forming a photoresist-film pattern on a film deposited on a semiconductor substrate with the surface having concave and convex portions or substrate.
CONSTITUTION: A positive-type photoresist film 2 is applied on a semiconductor substrate 1, on the surface of which concave and convex portions are yielded, and the thickness of the concave portion is thinner than that of convex portion. Then, ultra-violet ray 3 is illuminated all over the surface under the condition that only the film 2 in the concave portion is remained, and development is made. The film 2 on the convex portions are removed with the films 2' in the concave portions being remained, thereby the surface is falttened. Thereafter, the film 2 is again photosensed sufficiently by illumination of ultra-violet ray 4, and a positive-type resist film 5 is likewise formed. Then, ultra-violet ray 7 is selectively illuminated by using a photomask 6, the development is made, and the photo-sensitive portion of the film 5 is removed. At this time, the films 2' which are remained in the concave portions are also removed, and a resist-film pattern having holes 8aW8c can be obtained.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15453878A JPS5580323A (en) | 1978-12-12 | 1978-12-12 | Pattern forming method for photoresist-film |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15453878A JPS5580323A (en) | 1978-12-12 | 1978-12-12 | Pattern forming method for photoresist-film |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5580323A true JPS5580323A (en) | 1980-06-17 |
Family
ID=15586439
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15453878A Pending JPS5580323A (en) | 1978-12-12 | 1978-12-12 | Pattern forming method for photoresist-film |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5580323A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58132926A (en) * | 1982-02-03 | 1983-08-08 | Matsushita Electric Ind Co Ltd | Formation of pattern |
JPS58171818A (en) * | 1982-03-31 | 1983-10-08 | Matsushita Electric Ind Co Ltd | Method and apparatus for manufacturing semiconductor device |
JPS62204926A (en) * | 1986-03-06 | 1987-09-09 | Toray Ind Inc | Manufacture of polyester drawn film |
EP1032035A1 (en) * | 1999-02-26 | 2000-08-30 | STMicroelectronics S.r.l. | Process for manufacturing electronic memory devices with cells matrix having virtual ground |
JP2016213444A (en) * | 2015-04-10 | 2016-12-15 | 東京エレクトロン株式会社 | Use of sub-resolution apertures to aid image reversal, guided self-organization, and selective deposition |
-
1978
- 1978-12-12 JP JP15453878A patent/JPS5580323A/en active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58132926A (en) * | 1982-02-03 | 1983-08-08 | Matsushita Electric Ind Co Ltd | Formation of pattern |
JPS6258654B2 (en) * | 1982-02-03 | 1987-12-07 | Matsushita Electric Ind Co Ltd | |
JPS58171818A (en) * | 1982-03-31 | 1983-10-08 | Matsushita Electric Ind Co Ltd | Method and apparatus for manufacturing semiconductor device |
JPH0419697B2 (en) * | 1982-03-31 | 1992-03-31 | Matsushita Electric Ind Co Ltd | |
JPS62204926A (en) * | 1986-03-06 | 1987-09-09 | Toray Ind Inc | Manufacture of polyester drawn film |
EP1032035A1 (en) * | 1999-02-26 | 2000-08-30 | STMicroelectronics S.r.l. | Process for manufacturing electronic memory devices with cells matrix having virtual ground |
JP2016213444A (en) * | 2015-04-10 | 2016-12-15 | 東京エレクトロン株式会社 | Use of sub-resolution apertures to aid image reversal, guided self-organization, and selective deposition |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS542720A (en) | Forming method of photopolymerized image | |
JPS5569265A (en) | Pattern-forming method | |
JPS5580323A (en) | Pattern forming method for photoresist-film | |
JPS5595324A (en) | Manufacturing method of semiconductor device | |
JPS5321576A (en) | Mask for x-ray exposure | |
JPS5461931A (en) | Forming method of photo resist patterns | |
JPS5699623A (en) | Preparation of embossed sheet | |
JPS649618A (en) | Pattern formation | |
JPS5389673A (en) | Fine pattern forming method of semiconductor device | |
JPS568821A (en) | Formation of photoresist layer | |
JPS5655950A (en) | Photographic etching method | |
JPS5527637A (en) | Photo-resist-pattern forming method | |
JPS5616126A (en) | Exposing method | |
JPS5558534A (en) | Manufacture of semiconductor device | |
JPS57118641A (en) | Lifting-off method | |
JPS5732635A (en) | Production of semiconductor device | |
JPS5456368A (en) | Sticking preventing method of photo masks | |
JPS5427367A (en) | Manufacture of microwave circuit pattern | |
JPS53120374A (en) | Production of photo mask | |
JPS55138835A (en) | Method of forming photoresist pattern | |
JPS5636134A (en) | Forming method for pattern of semiconductor substrate | |
JPS53135844A (en) | Photochemical etching procee | |
JPS53117385A (en) | Exposure mask for patterning | |
JPS5369582A (en) | Coating method for photo-resist | |
JPS52126184A (en) | Preparation of semiconductor device |