JPS643056B2 - - Google Patents
Info
- Publication number
- JPS643056B2 JPS643056B2 JP56142941A JP14294181A JPS643056B2 JP S643056 B2 JPS643056 B2 JP S643056B2 JP 56142941 A JP56142941 A JP 56142941A JP 14294181 A JP14294181 A JP 14294181A JP S643056 B2 JPS643056 B2 JP S643056B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- cell
- basic
- resistor
- cells
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/90—Masterslice integrated circuits
- H10D84/901—Masterslice integrated circuits comprising bipolar technology
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/528—Layout of the interconnection structure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Semiconductor Integrated Circuits (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56142941A JPS5844742A (ja) | 1981-09-10 | 1981-09-10 | 半導体集積回路装置 |
EP82304745A EP0074804B1 (en) | 1981-09-10 | 1982-09-09 | Semiconductor integrated circuit comprising a semiconductor substrate and interconnecting layers |
DE8282304745T DE3277158D1 (en) | 1981-09-10 | 1982-09-09 | Semiconductor integrated circuit comprising a semiconductor substrate and interconnecting layers |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56142941A JPS5844742A (ja) | 1981-09-10 | 1981-09-10 | 半導体集積回路装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5844742A JPS5844742A (ja) | 1983-03-15 |
JPS643056B2 true JPS643056B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-01-19 |
Family
ID=15327203
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56142941A Granted JPS5844742A (ja) | 1981-09-10 | 1981-09-10 | 半導体集積回路装置 |
Country Status (3)
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59139646A (ja) * | 1983-01-31 | 1984-08-10 | Hitachi Micro Comput Eng Ltd | 半導体集積回路装置 |
JPH0669142B2 (ja) * | 1983-04-15 | 1994-08-31 | 株式会社日立製作所 | 半導体集積回路装置 |
JPH0817227B2 (ja) * | 1987-04-30 | 1996-02-21 | インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン | 個性化可能な半導体チップ |
KR920005863B1 (ko) * | 1988-08-12 | 1992-07-23 | 산요덴끼 가부시끼가이샤 | 반도체 집적회로 |
JPH02194173A (ja) * | 1989-01-20 | 1990-07-31 | Chugai Ro Co Ltd | スパッタリング装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3983619A (en) * | 1968-01-26 | 1976-10-05 | Hitachi, Ltd. | Large scale integrated circuit array of unit cells and method of manufacturing same |
JPS55163859A (en) * | 1979-06-07 | 1980-12-20 | Fujitsu Ltd | Manufacture of semiconductor device |
-
1981
- 1981-09-10 JP JP56142941A patent/JPS5844742A/ja active Granted
-
1982
- 1982-09-09 EP EP82304745A patent/EP0074804B1/en not_active Expired
- 1982-09-09 DE DE8282304745T patent/DE3277158D1/de not_active Expired
Also Published As
Publication number | Publication date |
---|---|
EP0074804A2 (en) | 1983-03-23 |
EP0074804A3 (en) | 1984-11-28 |
JPS5844742A (ja) | 1983-03-15 |
EP0074804B1 (en) | 1987-09-02 |
DE3277158D1 (en) | 1987-10-08 |