JPS5844742A - 半導体集積回路装置 - Google Patents

半導体集積回路装置

Info

Publication number
JPS5844742A
JPS5844742A JP56142941A JP14294181A JPS5844742A JP S5844742 A JPS5844742 A JP S5844742A JP 56142941 A JP56142941 A JP 56142941A JP 14294181 A JP14294181 A JP 14294181A JP S5844742 A JPS5844742 A JP S5844742A
Authority
JP
Japan
Prior art keywords
wiring
cell
basic
cells
resistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56142941A
Other languages
English (en)
Japanese (ja)
Other versions
JPS643056B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Satoru Tanizawa
谷澤　哲
Hitoshi Omichi
大道　等
Katsuharu Mitono
水戸野　克治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP56142941A priority Critical patent/JPS5844742A/ja
Priority to EP82304745A priority patent/EP0074804B1/en
Priority to DE8282304745T priority patent/DE3277158D1/de
Publication of JPS5844742A publication Critical patent/JPS5844742A/ja
Publication of JPS643056B2 publication Critical patent/JPS643056B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/90—Masterslice integrated circuits
    • H10D84/901—Masterslice integrated circuits comprising bipolar technology
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528—Layout of the interconnection structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP56142941A 1981-09-10 1981-09-10 半導体集積回路装置 Granted JPS5844742A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP56142941A JPS5844742A (ja) 1981-09-10 1981-09-10 半導体集積回路装置
EP82304745A EP0074804B1 (en) 1981-09-10 1982-09-09 Semiconductor integrated circuit comprising a semiconductor substrate and interconnecting layers
DE8282304745T DE3277158D1 (en) 1981-09-10 1982-09-09 Semiconductor integrated circuit comprising a semiconductor substrate and interconnecting layers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56142941A JPS5844742A (ja) 1981-09-10 1981-09-10 半導体集積回路装置

Publications (2)

Publication Number Publication Date
JPS5844742A true JPS5844742A (ja) 1983-03-15
JPS643056B2 JPS643056B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1989-01-19

Family

ID=15327203

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56142941A Granted JPS5844742A (ja) 1981-09-10 1981-09-10 半導体集積回路装置

Country Status (3)

Country Link
EP (1) EP0074804B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPS5844742A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE3277158D1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59139646A (ja) * 1983-01-31 1984-08-10 Hitachi Micro Comput Eng Ltd 半導体集積回路装置
JPH02194173A (ja) * 1989-01-20 1990-07-31 Chugai Ro Co Ltd スパッタリング装置

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0669142B2 (ja) * 1983-04-15 1994-08-31 株式会社日立製作所 半導体集積回路装置
JPH0817227B2 (ja) * 1987-04-30 1996-02-21 インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン 個性化可能な半導体チップ
KR920005863B1 (ko) * 1988-08-12 1992-07-23 산요덴끼 가부시끼가이샤 반도체 집적회로

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3983619A (en) * 1968-01-26 1976-10-05 Hitachi, Ltd. Large scale integrated circuit array of unit cells and method of manufacturing same
JPS55163859A (en) * 1979-06-07 1980-12-20 Fujitsu Ltd Manufacture of semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59139646A (ja) * 1983-01-31 1984-08-10 Hitachi Micro Comput Eng Ltd 半導体集積回路装置
JPH02194173A (ja) * 1989-01-20 1990-07-31 Chugai Ro Co Ltd スパッタリング装置

Also Published As

Publication number Publication date
EP0074804A2 (en) 1983-03-23
JPS643056B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1989-01-19
EP0074804A3 (en) 1984-11-28
EP0074804B1 (en) 1987-09-02
DE3277158D1 (en) 1987-10-08

Similar Documents

Publication Publication Date Title
JP3989038B2 (ja) 半導体集積回路装置
JPH02234469A (ja) Ｃａｄによってレイアウトされた２金属層集積回路ゲート・アレイ
US4924290A (en) Semiconductor device having improved multilayered wirings
EP0125504B1 (en) Bipolar transistor mos transistor hybrid semiconductor integrated circuit device
TW201807779A (zh) 製造積體電路的方法
JPS5844742A (ja) 半導体集積回路装置
EP0021661B1 (en) Semiconductor master-slice device
JP4353662B2 (ja) フリップチップ型半導体集積回路とその設計方法
CN100401511C (zh) 集成电路及集成电路的电连接再选路方法
JPS6329826B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
CN115828833A (zh) 运用于集成电路的电源网结构
USH512H (en) Automated universal array
WO2000005764A1 (en) Master-slice system semiconductor integrated circuit and design method thereof
JP4494537B2 (ja) スタンダードセル方式の半導体集積回路の配線設計方法
JP2001035922A (ja) 半導体集積回路
JPH073863B2 (ja) 半導体集積回路
JPS59158536A (ja) 多層配線を有する半導体装置
JPS6298641A (ja) 半導体集積回路
JPS641052B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
WO2024047820A1 (ja) 半導体集積回路装置
JPH0153512B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP2712806B2 (ja) 半導体集積回路
JPH04280471A (ja) マスタースライス方式の半導体集積回路装置
JPS59132144A (ja) 半導体集積回路装置の製造方法
JPS59215743A (ja) 大規模集積回路装置