JPS6425458A - Manufacture of dynamic ram - Google Patents
Manufacture of dynamic ramInfo
- Publication number
- JPS6425458A JPS6425458A JP62181475A JP18147587A JPS6425458A JP S6425458 A JPS6425458 A JP S6425458A JP 62181475 A JP62181475 A JP 62181475A JP 18147587 A JP18147587 A JP 18147587A JP S6425458 A JPS6425458 A JP S6425458A
- Authority
- JP
- Japan
- Prior art keywords
- film
- insulating film
- substrate
- polycrystalline
- covered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 abstract 5
- 229910021420 polycrystalline silicon Inorganic materials 0.000 abstract 3
- 229910021332 silicide Inorganic materials 0.000 abstract 2
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 abstract 2
- 239000004065 semiconductor Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
- H10B12/37—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells the capacitor being at least partially in a trench in the substrate
- H10B12/373—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells the capacitor being at least partially in a trench in the substrate the capacitor extending under or around the transistor
Landscapes
- Semiconductor Memories (AREA)
Abstract
PURPOSE:To obtain a structure which is strong against software errors by storing a signal charge in a polycrystalline semiconductor film isolated from a substrate by a capacity insulating film. CONSTITUTION:A capacity insulating film 32 is formed on the surface of a groove 31 formed on a P<+> type Si substrate 30, and a polycrystalline Si film 33 is buried. It is covered with an insulating film 34 except part of the groove 31 and part of the substrate 30. A polycrystalline Si film is formed on the whole surface, and a thin semicrystal Si film 35 is grown. Parts of the films 35, 33 and the substrate 30 are covered with insulating films 36. A channel region 22, a drain 3, a source 34 are formed in the film 35, and a gate insulating film 37 and a gate electrode 38 becoming a word line are formed. The electrode 38 is covered with an insulating film 39. The silicide connection 41 of the drain adjacent to a switching MOSFET and a source silicide wirings 42 are formed. Since this memory cell has a structure that the signal charge is stored in the polycrystalline Si film isolated form the Si substrate by the capacity insulating film, it is strong against software errors.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62181475A JPS6425458A (en) | 1987-07-21 | 1987-07-21 | Manufacture of dynamic ram |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62181475A JPS6425458A (en) | 1987-07-21 | 1987-07-21 | Manufacture of dynamic ram |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6425458A true JPS6425458A (en) | 1989-01-27 |
Family
ID=16101405
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62181475A Pending JPS6425458A (en) | 1987-07-21 | 1987-07-21 | Manufacture of dynamic ram |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6425458A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03104163A (en) * | 1989-09-18 | 1991-05-01 | Mitsubishi Electric Corp | Semiconductor storage device and manufacture thereof |
EP0599506A1 (en) * | 1992-11-27 | 1994-06-01 | International Business Machines Corporation | Semiconductor memory cell with SOI MOSFET |
KR100273678B1 (en) * | 1997-06-30 | 2000-12-15 | 김영환 | Memory device and method for fabricating the same |
-
1987
- 1987-07-21 JP JP62181475A patent/JPS6425458A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03104163A (en) * | 1989-09-18 | 1991-05-01 | Mitsubishi Electric Corp | Semiconductor storage device and manufacture thereof |
EP0599506A1 (en) * | 1992-11-27 | 1994-06-01 | International Business Machines Corporation | Semiconductor memory cell with SOI MOSFET |
KR100273678B1 (en) * | 1997-06-30 | 2000-12-15 | 김영환 | Memory device and method for fabricating the same |
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