JPS6412092B2 - - Google Patents

Info

Publication number
JPS6412092B2
JPS6412092B2 JP55018136A JP1813680A JPS6412092B2 JP S6412092 B2 JPS6412092 B2 JP S6412092B2 JP 55018136 A JP55018136 A JP 55018136A JP 1813680 A JP1813680 A JP 1813680A JP S6412092 B2 JPS6412092 B2 JP S6412092B2
Authority
JP
Japan
Prior art keywords
solder
electrode
electrode plate
cathode
cutout
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55018136A
Other languages
English (en)
Japanese (ja)
Other versions
JPS56115542A (en
Inventor
Toshuki Fujii
Takashi Ono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP1813680A priority Critical patent/JPS56115542A/ja
Publication of JPS56115542A publication Critical patent/JPS56115542A/ja
Publication of JPS6412092B2 publication Critical patent/JPS6412092B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0198—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/40247—Connecting the strap to a bond pad of the item
    • H10W72/073—
    • H10W72/07336—
    • H10W72/352—
    • H10W72/60—
    • H10W72/926—
    • H10W90/736—

Landscapes

  • Wire Bonding (AREA)
JP1813680A 1980-02-16 1980-02-16 Semiconductor device Granted JPS56115542A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1813680A JPS56115542A (en) 1980-02-16 1980-02-16 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1813680A JPS56115542A (en) 1980-02-16 1980-02-16 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS56115542A JPS56115542A (en) 1981-09-10
JPS6412092B2 true JPS6412092B2 (enExample) 1989-02-28

Family

ID=11963179

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1813680A Granted JPS56115542A (en) 1980-02-16 1980-02-16 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS56115542A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006324320A (ja) * 2005-05-17 2006-11-30 Renesas Technology Corp 半導体装置
JP5857361B2 (ja) * 2011-02-15 2016-02-10 新電元工業株式会社 半導体装置
JP5921072B2 (ja) * 2011-03-05 2016-05-24 新電元工業株式会社 樹脂封止型半導体装置

Also Published As

Publication number Publication date
JPS56115542A (en) 1981-09-10

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