JPS6397238U - - Google Patents

Info

Publication number
JPS6397238U
JPS6397238U JP1986191480U JP19148086U JPS6397238U JP S6397238 U JPS6397238 U JP S6397238U JP 1986191480 U JP1986191480 U JP 1986191480U JP 19148086 U JP19148086 U JP 19148086U JP S6397238 U JPS6397238 U JP S6397238U
Authority
JP
Japan
Prior art keywords
window frame
sealing plate
shaped
view
brazing material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986191480U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986191480U priority Critical patent/JPS6397238U/ja
Publication of JPS6397238U publication Critical patent/JPS6397238U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161Cap
    • H01L2924/1615Shape
    • H01L2924/16195Flat cap [not enclosing an internal cavity]

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図はICセラミツク・パツケージを示す概
略縦断面図、第2図は従来窓枠状ろう材付封着板
を示す概略平面図、第3図および第4図はこの考
案の窓枠状ろう材付封着板を示す概略平面図およ
び概略縦断面図、第5図は封着板の印刷状態を示
す要部平面図である。 1…セラミツクケース、2…半導体素子、3…
ボンデイングワイヤ、4…封着板、5…リード材
、6…スポツト溶接された打抜きろう材、7…ス
ポツト溶接、8…スクリーン印刷された窓枠状ろ
う材、9…メツキにより形成された窓枠状金属S
n層。
Fig. 1 is a schematic longitudinal sectional view showing an IC ceramic package, Fig. 2 is a schematic plan view showing a conventional window frame-shaped brazing material attached sealing plate, and Figs. 3 and 4 are window frame-shaped brazing materials of this invention. A schematic plan view and a schematic vertical cross-sectional view showing the sealing plate with material, and FIG. 5 is a plan view of the main part showing the printed state of the sealing plate. 1... Ceramic case, 2... Semiconductor element, 3...
Bonding wire, 4... Sealing plate, 5... Lead material, 6... Spot welded punched brazing material, 7... Spot welding, 8... Screen printed window frame shaped brazing material, 9... Window frame formed by plating shaped metal S
n layer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 封着板の片面に、窓枠状金属Sn層を介して、
ろう材を同じ形状の窓枠状にスクリーン印刷して
なる半導体パツケージ用窓枠状ろう材付封着板。
On one side of the sealing plate, via a window frame-shaped metal Sn layer,
A window frame-shaped soldering material attached sealing plate for semiconductor package, which is made by screen printing brazing material into a window frame shape of the same shape.
JP1986191480U 1986-12-12 1986-12-12 Pending JPS6397238U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986191480U JPS6397238U (en) 1986-12-12 1986-12-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986191480U JPS6397238U (en) 1986-12-12 1986-12-12

Publications (1)

Publication Number Publication Date
JPS6397238U true JPS6397238U (en) 1988-06-23

Family

ID=31145665

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986191480U Pending JPS6397238U (en) 1986-12-12 1986-12-12

Country Status (1)

Country Link
JP (1) JPS6397238U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5851543A (en) * 1981-09-24 1983-03-26 Hitachi Ltd Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5851543A (en) * 1981-09-24 1983-03-26 Hitachi Ltd Semiconductor device

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