JPS6397238U - - Google Patents
Info
- Publication number
- JPS6397238U JPS6397238U JP1986191480U JP19148086U JPS6397238U JP S6397238 U JPS6397238 U JP S6397238U JP 1986191480 U JP1986191480 U JP 1986191480U JP 19148086 U JP19148086 U JP 19148086U JP S6397238 U JPS6397238 U JP S6397238U
- Authority
- JP
- Japan
- Prior art keywords
- window frame
- sealing plate
- shaped
- view
- brazing material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 8
- 238000007789 sealing Methods 0.000 claims description 6
- 238000005219 brazing Methods 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000007650 screen-printing Methods 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 239000000919 ceramic Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図はＩＣセラミツク・パツケージを示す概
略縦断面図、第２図は従来窓枠状ろう材付封着板
を示す概略平面図、第３図および第４図はこの考
案の窓枠状ろう材付封着板を示す概略平面図およ
び概略縦断面図、第５図は封着板の印刷状態を示
す要部平面図である。
１…セラミツクケース、２…半導体素子、３…
ボンデイングワイヤ、４…封着板、５…リード材
、６…スポツト溶接された打抜きろう材、７…ス
ポツト溶接、８…スクリーン印刷された窓枠状ろ
う材、９…メツキにより形成された窓枠状金属Ｓ
ｎ層。
Fig. 1 is a schematic longitudinal sectional view showing an IC ceramic package, Fig. 2 is a schematic plan view showing a conventional window frame-shaped brazing material attached sealing plate, and Figs. 3 and 4 are window frame-shaped brazing materials of this invention. A schematic plan view and a schematic vertical cross-sectional view showing the sealing plate with material, and FIG. 5 is a plan view of the main part showing the printed state of the sealing plate. 1... Ceramic case, 2... Semiconductor element, 3...
Bonding wire, 4... Sealing plate, 5... Lead material, 6... Spot welded punched brazing material, 7... Spot welding, 8... Screen printed window frame shaped brazing material, 9... Window frame formed by plating shaped metal S
n layer.
Claims (1)
ろう材を同じ形状の窓枠状にスクリーン印刷して
なる半導体パツケージ用窓枠状ろう材付封着板。 On one side of the sealing plate, via a window frame-shaped metal Sn layer,
A window frame-shaped soldering material attached sealing plate for semiconductor package, which is made by screen printing brazing material into a window frame shape of the same shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986191480U JPS6397238U (en) | 1986-12-12 | 1986-12-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986191480U JPS6397238U (en) | 1986-12-12 | 1986-12-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6397238U true JPS6397238U (en) | 1988-06-23 |
Family
ID=31145665
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986191480U Pending JPS6397238U (en) | 1986-12-12 | 1986-12-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6397238U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5851543A (en) * | 1981-09-24 | 1983-03-26 | Hitachi Ltd | Semiconductor device |
-
1986
- 1986-12-12 JP JP1986191480U patent/JPS6397238U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5851543A (en) * | 1981-09-24 | 1983-03-26 | Hitachi Ltd | Semiconductor device |
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