JPH0279043U - - Google Patents
Info
- Publication number
- JPH0279043U JPH0279043U JP15792188U JP15792188U JPH0279043U JP H0279043 U JPH0279043 U JP H0279043U JP 15792188 U JP15792188 U JP 15792188U JP 15792188 U JP15792188 U JP 15792188U JP H0279043 U JPH0279043 U JP H0279043U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- brazing
- package
- opening
- lead terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- 238000005219 brazing Methods 0.000 claims 2
- 238000003475 lamination Methods 0.000 claims 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Landscapes
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図はこの考案の一実施例による半導体装置
のリード取付部の断面図、第２図は従来の半導体
装置のリード取付部の断面図である。
図において、１はベースセラミツク、２はセラ
ミツクフレーム、２ａはセラミツクフレームに設
けられた開口部、３は金属リード端子、４はろう
付け部、５はメタライズ層、６はニツケルめつき
、７はガラス封着部を示す。尚、図中、同一符号
は同一、又は相当部分を示す。
FIG. 1 is a sectional view of a lead attachment portion of a semiconductor device according to an embodiment of the invention, and FIG. 2 is a sectional view of a lead attachment portion of a conventional semiconductor device. In the figure, 1 is the base ceramic, 2 is the ceramic frame, 2a is the opening provided in the ceramic frame, 3 is the metal lead terminal, 4 is the brazed part, 5 is the metallized layer, 6 is the nickel plating, and 7 is the glass The sealing part is shown. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.
Claims (1)
を取付けたパツケージの金属リード端子をパツケ
ージの内側パターンに接続するための開口部をあ
らかじめ設け、リードのろう付け固着後前記開口
部の隙間をガラス封着で埋めてハーメチツク封止
を可能としたことを特徴とする半導体装置。 An opening for connecting the metal lead terminal of the package to which the outer frame is attached by ceramic lamination or brazing to the inner pattern of the package is prepared in advance, and after the leads are fixed by brazing, the gap in the opening is filled with glass sealing. A semiconductor device characterized in that it is possible to hermetically seal the semiconductor device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15792188U JPH0279043U (en) | 1988-12-02 | 1988-12-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15792188U JPH0279043U (en) | 1988-12-02 | 1988-12-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0279043U true JPH0279043U (en) | 1990-06-18 |
Family
ID=31437784
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15792188U Pending JPH0279043U (en) | 1988-12-02 | 1988-12-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0279043U (en) |
-
1988
- 1988-12-02 JP JP15792188U patent/JPH0279043U/ja active Pending
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