JPH0361345U - - Google Patents
Info
- Publication number
- JPH0361345U JPH0361345U JP12246189U JP12246189U JPH0361345U JP H0361345 U JPH0361345 U JP H0361345U JP 12246189 U JP12246189 U JP 12246189U JP 12246189 U JP12246189 U JP 12246189U JP H0361345 U JPH0361345 U JP H0361345U
- Authority
- JP
- Japan
- Prior art keywords
- ceramic plate
- ring
- buffer member
- outer dimensions
- leg
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
Landscapes
- Measuring Fluid Pressure (AREA)
Description
第１図は本考案の実施例を示す、封止キヤツプ
の断面図である。また、第２図は従来の封止キヤ
ツプの断面図である。
図中、１……封止キヤツプ、２……セラミツク
板、３……脚部、４……緩衝部材、７……フイレ
ツト。
FIG. 1 is a sectional view of a sealing cap showing an embodiment of the present invention. Further, FIG. 2 is a sectional view of a conventional sealing cap. In the figure, 1...Sealing cap, 2...Ceramic plate, 3...Legs, 4...Buffer member, 7...Fillet.
Claims (1)
のセラミツク板と、前記脚部と前記セラミツク板
との間に介在されるリング状の緩衝部材とを、ろ
う付け接合してなる集積回路用パツケージの封止
キヤツプにおいて、 前記セラミツク板の主面方向の外形寸法は、前
記緩衝部材の外形寸法よりも、大きく形成された
ことを特徴とする集積回路用パツケージの封止キ
ヤツプ。[Claims for Utility Model Registration] A ring-shaped metal leg, an insulating ceramic plate, and a ring-shaped buffer member interposed between the leg and the ceramic plate, A sealing cap for an integrated circuit package formed by soldering and bonding, wherein the outer dimensions of the ceramic plate in the main surface direction are larger than the outer dimensions of the buffer member. Sealed cap.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12246189U JPH0361345U (en) | 1989-10-19 | 1989-10-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12246189U JPH0361345U (en) | 1989-10-19 | 1989-10-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0361345U true JPH0361345U (en) | 1991-06-17 |
Family
ID=31670459
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12246189U Pending JPH0361345U (en) | 1989-10-19 | 1989-10-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0361345U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01253944A (en) * | 1988-04-04 | 1989-10-11 | Sumitomo Electric Ind Ltd | Component for semiconductor device |
-
1989
- 1989-10-19 JP JP12246189U patent/JPH0361345U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01253944A (en) * | 1988-04-04 | 1989-10-11 | Sumitomo Electric Ind Ltd | Component for semiconductor device |