JPH03126059U - - Google Patents
Info
- Publication number
- JPH03126059U JPH03126059U JP3529590U JP3529590U JPH03126059U JP H03126059 U JPH03126059 U JP H03126059U JP 3529590 U JP3529590 U JP 3529590U JP 3529590 U JP3529590 U JP 3529590U JP H03126059 U JPH03126059 U JP H03126059U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- metal container
- sealed
- hybrid
- glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910000990 Ni alloy Inorganic materials 0.000 claims 1
- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 238000007789 sealing Methods 0.000 description 1
Description
第１図は本考案の一実施例の断面図、第２図は
従来装置の断面図である。
１０Ａ……金属容器、１６Ａ……リード、１６
ａ……内部リード、１６ｂ……外部リード、１８
……ガラス封止部、２０……半導体チツプ。
FIG. 1 is a sectional view of an embodiment of the present invention, and FIG. 2 is a sectional view of a conventional device. 10A...Metal container, 16A...Lead, 16
a...Internal lead, 16b...External lead, 18
...Glass sealing part, 20...Semiconductor chip.
Claims (1)
器を貫通してこの金属容器にガラス封止されるハ
イブリツドＩＣ用のリードにおいて、 鉄・コバルト・ニツケル合金で作られ前記金属
容器にガラス封止される内部リードと、この内部
リードの外端に接合された銅製の外部リードとを
備えることを特徴とするハイブリツドＩＣ用のリ
ード。[Scope of Claim for Utility Model Registration] A lead for a hybrid IC that penetrates a metal container that houses a semiconductor chip and is hermetically sealed and is sealed with glass in the metal container, which is made of an iron-cobalt-nickel alloy. A lead for a hybrid IC, comprising an inner lead sealed in glass in the metal container, and an outer lead made of copper bonded to the outer end of the inner lead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990035295U JPH085563Y2 (en) | 1990-03-31 | 1990-03-31 | Metal package for high power hybrid IC |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990035295U JPH085563Y2 (en) | 1990-03-31 | 1990-03-31 | Metal package for high power hybrid IC |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03126059U true JPH03126059U (en) | 1991-12-19 |
| JPH085563Y2 JPH085563Y2 (en) | 1996-02-14 |
Family
ID=31540522
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990035295U Expired - Fee Related JPH085563Y2 (en) | 1990-03-31 | 1990-03-31 | Metal package for high power hybrid IC |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH085563Y2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60242653A (en) * | 1984-05-16 | 1985-12-02 | Daido Steel Co Ltd | Composite material for lead frame |
| JPS62217643A (en) * | 1986-03-18 | 1987-09-25 | Kyocera Corp | Package for containing hybrid integrated circuit element |
-
1990
- 1990-03-31 JP JP1990035295U patent/JPH085563Y2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60242653A (en) * | 1984-05-16 | 1985-12-02 | Daido Steel Co Ltd | Composite material for lead frame |
| JPS62217643A (en) * | 1986-03-18 | 1987-09-25 | Kyocera Corp | Package for containing hybrid integrated circuit element |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH085563Y2 (en) | 1996-02-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |