JPS63136344U - - Google Patents
Info
- Publication number
- JPS63136344U JPS63136344U JP1987027816U JP2781687U JPS63136344U JP S63136344 U JPS63136344 U JP S63136344U JP 1987027816 U JP1987027816 U JP 1987027816U JP 2781687 U JP2781687 U JP 2781687U JP S63136344 U JPS63136344 U JP S63136344U
- Authority
- JP
- Japan
- Prior art keywords
- spacer
- base
- chip
- melting point
- low melting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 125000006850 spacer group Chemical group 0.000 claims description 7
- 239000000919 ceramic Substances 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 230000008018 melting Effects 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 4
- 239000005394 sealing glass Substances 0.000 claims 3
- 229910000510 noble metal Inorganic materials 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Description
第１図は本考案の一実施例に係る集積回路容器
にＩＣチツプ組付後の状態を示す縦断面図、第２
図は従来のアルミナ積層型パツケージの縦断面図
、第３図はアルミナ積層型パツケージに金属放熱
板を接合した従来のパツケージの縦断面図である
。
１……アルミナグリーンシート、２，５，Ｗ…
…メタライズ、３……仕上メツキ、４……リード
フレーム、６……銅合金板、７……金属基体、８
……セラミツクスペーサ、９……貴金属膜、１０
……Ａｌ蒸着膜、１１，１２，１３……低融点シ
ールガラス、１４……セラミツクキヤツプ、２０
……ベース、３０……ＩＣチツプ。
FIG. 1 is a vertical sectional view showing the state after an IC chip is assembled into an integrated circuit container according to an embodiment of the present invention;
The figure is a longitudinal cross-sectional view of a conventional alumina laminated package, and FIG. 3 is a vertical cross-sectional view of a conventional package in which a metal heat sink is bonded to an alumina laminated package. 1...Alumina green sheet, 2, 5, W...
...metalization, 3...finish plating, 4...lead frame, 6...copper alloy plate, 7...metal base, 8
...Ceramic spacer, 9...Precious metal film, 10
... Al vapor deposited film, 11, 12, 13 ... Low melting point seal glass, 14 ... Ceramic cap, 20
...Base, 30...IC chip.
Claims (1)
ース２０としてＩＣチツプ３０を搭載する金属基
体７と該基体７上で前記ＩＣチツプ３０を取り囲
む周面部に対応する額縁状のセラミツクスペーサ
８と該スペーサ８上に載置するリードフレーム４
とからなり、前記金属基体７と前記ＩＣチツプ３
０の間に貴金属膜９を、前記金属基体７と前記ス
ペーサ８の間に順次Ａｌ蒸着膜１０、低融点シー
ルガラス１１を、前記スペーサ８と前記リードフ
レーム４の間に低融点シールガラス１２をそれぞ
れ封着し、他方前記ベース２０との接合面に低融
点シールガラス１３を封着したセラミツクキヤツ
プ１４からなることを特徴とする放熱型集積回路
容器。 A package for storing an IC chip includes a metal base 7 serving as a base 20 on which an IC chip 30 is mounted, a frame-shaped ceramic spacer 8 corresponding to the peripheral surface surrounding the IC chip 30 on the base 7, and a ceramic spacer 8 mounted on the spacer 8. Lead frame 4 to be placed
The metal base 7 and the IC chip 3
A noble metal film 9 is placed between the metal substrate 7 and the spacer 8, an Al vapor deposited film 10 and a low melting point sealing glass 11 are placed between the spacer 8 and the lead frame 4, and a low melting point sealing glass 12 is placed between the spacer 8 and the lead frame 4. A heat-dissipating integrated circuit container characterized by comprising a ceramic cap 14, each of which is sealed, and a low melting point sealing glass 13 sealed to the joint surface with the base 20.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987027816U JPH0412682Y2 (en) | 1987-02-26 | 1987-02-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987027816U JPH0412682Y2 (en) | 1987-02-26 | 1987-02-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63136344U true JPS63136344U (en) | 1988-09-07 |
| JPH0412682Y2 JPH0412682Y2 (en) | 1992-03-26 |
Family
ID=30830201
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987027816U Expired JPH0412682Y2 (en) | 1987-02-26 | 1987-02-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0412682Y2 (en) |
-
1987
- 1987-02-26 JP JP1987027816U patent/JPH0412682Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0412682Y2 (en) | 1992-03-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS63136344U (en) | ||
| JPH04129253A (en) | Semiconductor package | |
| JPH0476045U (en) | ||
| JPH0442924Y2 (en) | ||
| JPH0526756Y2 (en) | ||
| JPH0247054U (en) | ||
| JPS634350B2 (en) | ||
| JPS5834739U (en) | semiconductor equipment | |
| JPS6079745U (en) | Hermetic seal cover | |
| JPS587345U (en) | semiconductor equipment | |
| JPH0263544U (en) | ||
| JPH0279043U (en) | ||
| JPS63127129U (en) | ||
| JPH0272552U (en) | ||
| JPS6142844U (en) | flat package | |
| JPS59140443U (en) | Translucent cap for semiconductor devices | |
| JPS60121649U (en) | airtight terminal | |
| JPS6142846U (en) | semiconductor equipment | |
| JPS5978636U (en) | semiconductor equipment | |
| JPS6212951U (en) | ||
| JPS5822749U (en) | Package for semiconductor devices | |
| JPS5878636U (en) | glass sealed container | |
| JPS6112241U (en) | flat package | |
| JPS6142845U (en) | flat package | |
| JPH0176057U (en) |