JPS6399769U - - Google Patents
Info
- Publication number
- JPS6399769U JPS6399769U JP1986195728U JP19572886U JPS6399769U JP S6399769 U JPS6399769 U JP S6399769U JP 1986195728 U JP1986195728 U JP 1986195728U JP 19572886 U JP19572886 U JP 19572886U JP S6399769 U JPS6399769 U JP S6399769U
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- glass substrate
- metal
- view
- terminal piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 230000003014 reinforcing effect Effects 0.000 claims description 4
- 229920001169 thermoplastic Polymers 0.000 claims description 4
- 239000004416 thermosoftening plastic Substances 0.000 claims description 4
- 239000011810 insulating material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Description
第1図は本考案に係るガラス基板端子と金属端
子片との接続構造を示す図で、同図aは正面図、
同図bは側面図、同図cは同図aのA―A線上断
面図、同図dは同図cの一点鎖線Bで囲まれた部
分の拡大図、第2図は上記ガラス基板の平面図、
第2図はガラス基板の平面図、第3図は端子片を
示す平面図、第4図は端子片の先端部にクリーム
半田層を形成した状態を示す平面図、第5図は補
強板に熱可塑性接着剤の層を形成した状態を示す
平面図、第6図はガラス基板の端子部Tに端子片
を半田付けするための概略構成を示す図、第7図
はガラス基板の端子部に補強板を接着するための
概略構成を示す図、第8図a,bは従来のガラス
基板端子と金属端子片との接続構造を示す図であ
る。
図中、11……ガラス基板、12―1〜12―
4……端子、13―1〜13―4……端子片、1
4……補強板、15……熱可塑性接着剤、16…
…絶縁被覆。
Fig. 1 is a diagram showing a connection structure between a glass substrate terminal and a metal terminal piece according to the present invention, and Fig. 1a is a front view;
Figure b is a side view, Figure c is a sectional view taken along the line A--A in Figure A, Figure d is an enlarged view of the area surrounded by the dashed line B in Figure c, and Figure 2 is an enlarged view of the glass substrate. Plan view,
Fig. 2 is a plan view of the glass substrate, Fig. 3 is a plan view showing the terminal piece, Fig. 4 is a plan view showing the cream solder layer formed on the tip of the terminal piece, and Fig. 5 is a plan view showing the reinforcing plate. A plan view showing a state in which a layer of thermoplastic adhesive is formed, FIG. 6 is a diagram showing a schematic configuration for soldering a terminal piece to a terminal portion T of a glass substrate, and FIG. 7 is a plan view showing a state in which a layer of thermoplastic adhesive is formed. FIGS. 8a and 8b are diagrams showing a schematic configuration for bonding a reinforcing plate, and are diagrams showing a conventional connection structure between a glass substrate terminal and a metal terminal piece. In the figure, 11...Glass substrate, 12-1 to 12-
4...Terminal, 13-1 to 13-4...Terminal piece, 1
4... Reinforcement plate, 15... Thermoplastic adhesive, 16...
...Insulating coating.
Claims (1)
おいて形成されたガラス基板の該金属膜端子に金
属端子片を半田付けすると共に、該金属端子片上
に絶縁材からなる補強板を配設し、該補強板と前
記ガラス基板端子部とを熱可塑性接着剤で接着し
たことを特徴とするガラス基板端子と金属端子片
との接続構造。 A metal terminal piece is soldered to the metal film terminal of a glass substrate on which a plurality of metal film terminals are formed at predetermined intervals on the surface terminal portion, and a reinforcing plate made of an insulating material is provided on the metal terminal piece. A connection structure between a glass substrate terminal and a metal terminal piece, characterized in that the reinforcing plate and the glass substrate terminal portion are bonded with a thermoplastic adhesive.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986195728U JPS6399769U (en) | 1986-12-19 | 1986-12-19 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986195728U JPS6399769U (en) | 1986-12-19 | 1986-12-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6399769U true JPS6399769U (en) | 1988-06-28 |
Family
ID=31153883
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986195728U Pending JPS6399769U (en) | 1986-12-19 | 1986-12-19 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6399769U (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4921513A (en) * | 1972-06-29 | 1974-02-26 | ||
JPS54144970A (en) * | 1978-05-01 | 1979-11-12 | Nitto Electric Ind Co | Adhesive tape for electric circuit components |
-
1986
- 1986-12-19 JP JP1986195728U patent/JPS6399769U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4921513A (en) * | 1972-06-29 | 1974-02-26 | ||
JPS54144970A (en) * | 1978-05-01 | 1979-11-12 | Nitto Electric Ind Co | Adhesive tape for electric circuit components |
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