JPS6258079U - - Google Patents
Info
- Publication number
- JPS6258079U JPS6258079U JP14877685U JP14877685U JPS6258079U JP S6258079 U JPS6258079 U JP S6258079U JP 14877685 U JP14877685 U JP 14877685U JP 14877685 U JP14877685 U JP 14877685U JP S6258079 U JPS6258079 U JP S6258079U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- flexible circuit
- land
- double
- sided flexible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
Description
第１図は、本考案の一実施例に従つた両面可撓
性回路基板の接続構造の要部を拡大して示す平面
構成図、第２図は、第１図のＸ―Ｘ線拡大断面構
成図、第３図は、他の回路基板との半田相互導通
接続を図つた状態の概念的な断面構成図、そして
、第４図は、従来構造に従つた相互導通接続構造
の問題点を示す概略断面構成図である。
１：表面被覆材、１Ａ：非対称用起部、２：絶
縁ベース材、３：裏面被覆材、４：スルーホール
ランド、４Ａ：ランド露出部、５：スルーホール
、６：接着接合層、７：他の回路基板、８：接続
部、１０，１１：溶融付着半田、１２：ブローホ
ール。
FIG. 1 is an enlarged plan configuration diagram showing the main parts of the connection structure of a double-sided flexible circuit board according to an embodiment of the present invention, and FIG. 2 is an enlarged cross-sectional view taken along the line X--X of FIG. FIG. 3 is a conceptual cross-sectional diagram of a state in which solder mutual conduction connection with another circuit board is attempted, and FIG. 4 shows the problems of the mutual conduction connection structure according to the conventional structure. FIG. 2 is a schematic cross-sectional configuration diagram. 1: Surface covering material, 1A: Asymmetrical origin, 2: Insulating base material, 3: Back covering material, 4: Through hole land, 4A: Land exposed portion, 5: Through hole, 6: Adhesive bonding layer, 7: Other circuit board, 8: Connection portion, 10, 11: Melted adhesion solder, 12: Blow hole.
Claims (1)
板と半田接続するような両面可撓性回路基板に於
て、この可撓性回路基板の表面被覆材に設ける上
記ランドに対する露出形状を露出ランド部が非対
称となるように構成したことを特徴とする両面可
撓性回路基板の接続構造。 In a double-sided flexible circuit board that is solder-connected to another circuit board via a through-hole conduction land, the exposed land portion has an exposed shape for the land provided on the surface covering material of the flexible circuit board. A connection structure for a double-sided flexible circuit board, characterized in that it is configured to be asymmetrical.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14877685U JPS6258079U (en) | 1985-09-28 | 1985-09-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14877685U JPS6258079U (en) | 1985-09-28 | 1985-09-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6258079U true JPS6258079U (en) | 1987-04-10 |
Family
ID=31063362
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14877685U Pending JPS6258079U (en) | 1985-09-28 | 1985-09-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6258079U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004084593A1 (en) * | 1999-07-02 | 2004-09-30 | Katsunori Kokubun | Method for forming fine through hole conductor in circuit board |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5049663A (en) * | 1973-09-05 | 1975-05-02 | ||
| JPS5437294A (en) * | 1977-08-31 | 1979-03-19 | Toshiba Corp | Conductor support |
| JPS5516477A (en) * | 1978-07-21 | 1980-02-05 | Fujitsu Ltd | Diode mount |
| JPS5938063U (en) * | 1982-09-02 | 1984-03-10 | オムロン株式会社 | Automatic paper winding device |
| JPS6049698A (en) * | 1983-08-27 | 1985-03-18 | ソニー株式会社 | Connecting structure of printed board |
-
1985
- 1985-09-28 JP JP14877685U patent/JPS6258079U/ja active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5049663A (en) * | 1973-09-05 | 1975-05-02 | ||
| JPS5437294A (en) * | 1977-08-31 | 1979-03-19 | Toshiba Corp | Conductor support |
| JPS5516477A (en) * | 1978-07-21 | 1980-02-05 | Fujitsu Ltd | Diode mount |
| JPS5938063U (en) * | 1982-09-02 | 1984-03-10 | オムロン株式会社 | Automatic paper winding device |
| JPS6049698A (en) * | 1983-08-27 | 1985-03-18 | ソニー株式会社 | Connecting structure of printed board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004084593A1 (en) * | 1999-07-02 | 2004-09-30 | Katsunori Kokubun | Method for forming fine through hole conductor in circuit board |