JPS63155642U - - Google Patents

Info

Publication number
JPS63155642U
JPS63155642U JP1987047978U JP4797887U JPS63155642U JP S63155642 U JPS63155642 U JP S63155642U JP 1987047978 U JP1987047978 U JP 1987047978U JP 4797887 U JP4797887 U JP 4797887U JP S63155642 U JPS63155642 U JP S63155642U
Authority
JP
Japan
Prior art keywords
sealing plate
window frame
brazing material
metal
shape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987047978U
Other languages
Japanese (ja)
Other versions
JPH0744024Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987047978U priority Critical patent/JPH0744024Y2/en
Publication of JPS63155642U publication Critical patent/JPS63155642U/ja
Application granted granted Critical
Publication of JPH0744024Y2 publication Critical patent/JPH0744024Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は、ＩＣセラミツク・パツケージの概略
断面図、第２図は、ＩＣセラミツク・パツケージ
のセラミツクケース上面にろう付けする、従来の
封着板の概略平面図、第３図は、この考案の封着
板の概略平面図、第４図は、第３図のＸ―Ｘ断面
概略図である。 １……セラミツクケース、２……半導体素子、
３……ボンデイングワイヤ、４……封着板、５…
…リード材、６……窓枠状打ち抜きろう材、７…
…スポツト溶接、８……Ｓｎ層。 Fig. 1 is a schematic sectional view of an IC ceramic package, Fig. 2 is a schematic plan view of a conventional sealing plate that is brazed to the top surface of the ceramic case of an IC ceramic package, and Fig. 3 is a schematic cross-sectional view of an IC ceramic package. A schematic plan view of the sealing plate, FIG. 4, is a schematic cross-sectional view taken along line XX in FIG. 3. 1...Ceramic case, 2...Semiconductor element,
3... bonding wire, 4... sealing plate, 5...
...Lead material, 6...Window frame-shaped punching brazing material, 7...
...Spot welding, 8...Sn layer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体パツケージ用封着板の片面に、金属Ｓｎ
層を介して、該金属Ｓｎ層の融点よりも高い融点
を有する窓枠状に打ち抜いたろう材の箔を融着し
てなることを特徴とする半導体パツケージ用窓枠
状ろう材付き封着板。 Metal Sn is applied to one side of the sealing plate for semiconductor package.
1. A sealing plate with a brazing material in the shape of a window frame for a semiconductor package, characterized in that a foil of a brazing material punched into the shape of a window frame and having a melting point higher than that of the metal Sn layer is fused through the layers.
JP1987047978U 1987-03-31 1987-03-31 Sealing plate with window frame brazing material for semiconductor ceramic package Expired - Lifetime JPH0744024Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987047978U JPH0744024Y2 (en) 1987-03-31 1987-03-31 Sealing plate with window frame brazing material for semiconductor ceramic package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987047978U JPH0744024Y2 (en) 1987-03-31 1987-03-31 Sealing plate with window frame brazing material for semiconductor ceramic package

Publications (2)

Publication Number Publication Date
JPS63155642U true JPS63155642U (en) 1988-10-12
JPH0744024Y2 JPH0744024Y2 (en) 1995-10-09

Family

ID=30869085

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987047978U Expired - Lifetime JPH0744024Y2 (en) 1987-03-31 1987-03-31 Sealing plate with window frame brazing material for semiconductor ceramic package

Country Status (1)

Country Link
JP (1) JPH0744024Y2 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57203554U (en) * 1981-06-23 1982-12-24
JPS61191480A (en) * 1985-02-20 1986-08-26 本田技研工業株式会社 Power erecting stand
JPS61239648A (en) * 1985-04-16 1986-10-24 Mitsubishi Metal Corp Sealing board with window-framework-shaped solder for packaging semiconductor device
JPS61183471U (en) * 1985-05-07 1986-11-15

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57203554U (en) * 1981-06-23 1982-12-24
JPS61191480A (en) * 1985-02-20 1986-08-26 本田技研工業株式会社 Power erecting stand
JPS61239648A (en) * 1985-04-16 1986-10-24 Mitsubishi Metal Corp Sealing board with window-framework-shaped solder for packaging semiconductor device
JPS61183471U (en) * 1985-05-07 1986-11-15

Also Published As

Publication number Publication date
JPH0744024Y2 (en) 1995-10-09

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