JPH0286194U - - Google Patents
Info
- Publication number
- JPH0286194U JPH0286194U JP16714288U JP16714288U JPH0286194U JP H0286194 U JPH0286194 U JP H0286194U JP 16714288 U JP16714288 U JP 16714288U JP 16714288 U JP16714288 U JP 16714288U JP H0286194 U JPH0286194 U JP H0286194U
- Authority
- JP
- Japan
- Prior art keywords
- aluminum
- core plate
- clad sheet
- material layer
- brazing material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005219 brazing Methods 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 3
- 229910052782 aluminium Inorganic materials 0.000 claims 3
- 239000000956 alloy Substances 0.000 claims 2
- 229910045601 alloy Inorganic materials 0.000 claims 2
- 230000008018 melting Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 238000005096 rolling process Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図および第２図は本考案の第１実施例を示
し、第１図は断面図、第２図は半田層とセラミツ
クス板との結合部分を模式的に示す断面図である
。第３図は本考案の第２実施例を示す断面図であ
る。第４図は本考案の第３実施例を示す断面図で
ある。第５図は本考案の第４実施例を示す断面図
である。
図中、１はクラツドシート、１０は芯板、１１
はろう材層、２はセラミツクス板をそれぞれ示す
。
1 and 2 show a first embodiment of the present invention, with FIG. 1 being a sectional view and FIG. 2 being a sectional view schematically showing a joint portion between a solder layer and a ceramic plate. FIG. 3 is a sectional view showing a second embodiment of the present invention. FIG. 4 is a sectional view showing a third embodiment of the present invention. FIG. 5 is a sectional view showing a fourth embodiment of the present invention. In the figure, 1 is a clad sheet, 10 is a core plate, 11
2 indicates a brazing material layer, and 2 indicates a ceramic plate.
Claims (1)
る芯板と前記芯板の少なくとも片面に圧延により
圧着接合され前記芯板よりも低融点のアルミニウ
ム系合金からなるろう材層とで形成されたクラツ
ドシートと、 前記クラツドシートの前記ろう材層の融着によ
り前記クラツドシートにろう付けされたセラミツ
クス板とで構成されていることを特徴とする実装
基板。[Claims for Utility Model Registration] A core plate made of aluminum or an aluminum-based alloy, and a brazing material layer made of an aluminum-based alloy having a lower melting point than the core plate, which is crimped and bonded to at least one side of the core plate by rolling. 1. A mounting board comprising: a clad sheet; and a ceramic plate brazed to the clad sheet by fusing the brazing material layer of the clad sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16714288U JPH0537491Y2 (en) | 1988-12-23 | 1988-12-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16714288U JPH0537491Y2 (en) | 1988-12-23 | 1988-12-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0286194U true JPH0286194U (en) | 1990-07-09 |
| JPH0537491Y2 JPH0537491Y2 (en) | 1993-09-22 |
Family
ID=31455171
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16714288U Expired - Lifetime JPH0537491Y2 (en) | 1988-12-23 | 1988-12-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0537491Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003086747A (en) * | 2001-09-10 | 2003-03-20 | Hitachi Ltd | Insulation circuit board, its manufacturing method and semiconductor power element using the same |
| JP2012117110A (en) * | 2010-12-01 | 2012-06-21 | Showa Denko Kk | Method for producing aluminum brazing product |
-
1988
- 1988-12-23 JP JP16714288U patent/JPH0537491Y2/ja not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003086747A (en) * | 2001-09-10 | 2003-03-20 | Hitachi Ltd | Insulation circuit board, its manufacturing method and semiconductor power element using the same |
| JP2012117110A (en) * | 2010-12-01 | 2012-06-21 | Showa Denko Kk | Method for producing aluminum brazing product |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0537491Y2 (en) | 1993-09-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0286194U (en) | ||
| JPS5853372U (en) | Terminal joint structure | |
| JPS58107816U (en) | Weld structure | |
| JPS5845336U (en) | Assembly structure of ceramic parts and metal parts | |
| JPH0367444U (en) | ||
| JPH03107821U (en) | ||
| JPS61119373A (en) | Joining method of magnesium alloy | |
| JPH0448233U (en) | ||
| JPS61148464U (en) | ||
| JPS59160533U (en) | Ceramic and metal bonding structure | |
| JPS60105973U (en) | Heat exchanger | |
| JPH0448232U (en) | ||
| JPS6162805U (en) | ||
| JPS6136387U (en) | Laser bonding structure | |
| JPS6024466U (en) | Laminating material for soldering and brazing | |
| JPH01135737U (en) | ||
| JPS60189779U (en) | Boss mounting structure of stacked heat exchanger | |
| JPS6192486U (en) | ||
| JPS60151678U (en) | Structure of clad steel welded joints | |
| JPS60184631U (en) | conductive sheet | |
| JPH0395636U (en) | ||
| JPS6320089U (en) | ||
| JPS60103576U (en) | Welded structure of damping steel plate | |
| JPS62106940U (en) | ||
| JPS62157222U (en) |