JPS60103576U - Welded structure of damping steel plate - Google Patents

Welded structure of damping steel plate

Info

Publication number
JPS60103576U
JPS60103576U JP19623183U JP19623183U JPS60103576U JP S60103576 U JPS60103576 U JP S60103576U JP 19623183 U JP19623183 U JP 19623183U JP 19623183 U JP19623183 U JP 19623183U JP S60103576 U JPS60103576 U JP S60103576U
Authority
JP
Japan
Prior art keywords
steel plate
damping steel
welded structure
welded
damping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19623183U
Other languages
Japanese (ja)
Inventor
安司 松夫
上條 尚孝
Original Assignee
日産ディーゼル工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日産ディーゼル工業株式会社 filed Critical 日産ディーゼル工業株式会社
Priority to JP19623183U priority Critical patent/JPS60103576U/en
Publication of JPS60103576U publication Critical patent/JPS60103576U/en
Pending legal-status Critical Current

Links

Landscapes

  • Vibration Prevention Devices (AREA)
  • Butt Welding And Welding Of Specific Article (AREA)
  • Laminated Bodies (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の1実施例を示す断面図、第2図は第1
図のA部拡大図、第3図は本考案の別の実施例の要部拡
大断面図を示す。 2.3・・・・・・制振鋼板、2A、3A・・・・・・
樹脂、2B、 3B、 2G、 3G・・・・・・金属
板、4,5・・・・・・シーム溶接部。
Fig. 1 is a sectional view showing one embodiment of the present invention, and Fig. 2 is a cross-sectional view showing one embodiment of the present invention.
FIG. 3 shows an enlarged view of part A in the figure, and FIG. 3 shows an enlarged sectional view of the main part of another embodiment of the present invention. 2.3... Vibration damping steel plate, 2A, 3A...
Resin, 2B, 3B, 2G, 3G... Metal plate, 4, 5... Seam weld.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 制振材層を一対の金属板で挟着した3層構造からなる制
振鋼板において、該制振鋼板の溶接接合用端部に、当該
端部の金属板同志を結合させたシーム溶接部を形成し、
該シーム溶接部を介して他部材と溶接結合する構成とし
たことを特徴とする制振鋼板の溶接部構造。
In a damping steel plate having a three-layer structure in which a damping material layer is sandwiched between a pair of metal plates, a seam welded portion where the metal plates at the end are joined to each other is attached to the welded joint end of the damping steel plate. form,
A welded part structure of a vibration damping steel plate, characterized in that it is configured to be welded to another member via the seam welded part.
JP19623183U 1983-12-22 1983-12-22 Welded structure of damping steel plate Pending JPS60103576U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19623183U JPS60103576U (en) 1983-12-22 1983-12-22 Welded structure of damping steel plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19623183U JPS60103576U (en) 1983-12-22 1983-12-22 Welded structure of damping steel plate

Publications (1)

Publication Number Publication Date
JPS60103576U true JPS60103576U (en) 1985-07-15

Family

ID=30421124

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19623183U Pending JPS60103576U (en) 1983-12-22 1983-12-22 Welded structure of damping steel plate

Country Status (1)

Country Link
JP (1) JPS60103576U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020104265A (en) * 2018-12-26 2020-07-09 日産自動車株式会社 Composite material

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS596068B2 (en) * 1975-06-04 1984-02-08 株式会社日立製作所 semiconductor memory device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS596068B2 (en) * 1975-06-04 1984-02-08 株式会社日立製作所 semiconductor memory device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020104265A (en) * 2018-12-26 2020-07-09 日産自動車株式会社 Composite material

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