JPS6375045U - - Google Patents
Info
- Publication number
- JPS6375045U JPS6375045U JP1986169957U JP16995786U JPS6375045U JP S6375045 U JPS6375045 U JP S6375045U JP 1986169957 U JP1986169957 U JP 1986169957U JP 16995786 U JP16995786 U JP 16995786U JP S6375045 U JPS6375045 U JP S6375045U
- Authority
- JP
- Japan
- Prior art keywords
- sealing plate
- brazing material
- window frame
- screen
- printing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 7
- 238000005219 brazing Methods 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000007650 screen-printing Methods 0.000 claims 1
- 239000000919 ceramic Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図はＩＣセラミツク・パツケージを示す概
略縦断面図、第２図は従来窓枠状ろう材付封着板
を示す概略平面図、第３図および第４図はこの考
案の窓枠状ろう材付封着板を示す概略平面図であ
る。
１……セラミツクケース、２……半導体素子、
３……ボンデイングワイヤ、４……封着板、５…
…リード材、６……スポツト溶接された打抜きろ
う材、７……スポツト溶接、８……スクリーン印
刷されたろう材。
Fig. 1 is a schematic vertical sectional view showing an IC ceramic package, Fig. 2 is a schematic plan view showing a conventional window frame-shaped brazing material attached sealing plate, and Figs. 3 and 4 are window frame-shaped brazing materials of this invention. It is a schematic plan view showing a sealing plate with material. 1...Ceramic case, 2...Semiconductor element,
3...Bonding wire, 4...Sealing plate, 5...
...Lead material, 6...Spot welded punched brazing material, 7...Spot welding, 8...Screen printed brazing material.
Claims (1)
印刷してなる半導体パツケージ用窓枠状ろう材付
封着板。 A window frame-shaped brazing material-attached sealing plate for semiconductor packages, which is made by screen-printing a brazing material in the shape of a window frame on one side of the sealing plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986169957U JPS6375045U (en) | 1986-11-05 | 1986-11-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986169957U JPS6375045U (en) | 1986-11-05 | 1986-11-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6375045U true JPS6375045U (en) | 1988-05-19 |
Family
ID=31104235
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986169957U Pending JPS6375045U (en) | 1986-11-05 | 1986-11-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6375045U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5851543A (en) * | 1981-09-24 | 1983-03-26 | Hitachi Ltd | Semiconductor device |
-
1986
- 1986-11-05 JP JP1986169957U patent/JPS6375045U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5851543A (en) * | 1981-09-24 | 1983-03-26 | Hitachi Ltd | Semiconductor device |