JPS6292648U - - Google Patents
Info
- Publication number
- JPS6292648U JPS6292648U JP18473785U JP18473785U JPS6292648U JP S6292648 U JPS6292648 U JP S6292648U JP 18473785 U JP18473785 U JP 18473785U JP 18473785 U JP18473785 U JP 18473785U JP S6292648 U JPS6292648 U JP S6292648U
- Authority
- JP
- Japan
- Prior art keywords
- cap
- semiconductor
- mounting substrate
- coating layer
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 5
- 239000011247 coating layer Substances 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims 2
- 239000011368 organic material Substances 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本発明に係る半導体装置の完成後の斜
視図、第２図はキヤツプを金属接合する前の状態
を示す斜視図、第３図は第１図の―線に沿つ
て見た拡大縦断面図、第４図及び第５図は本考案
の他の実施例を示す第３図に対応した断面図、第
６図は従来の技術を示す断面図である。
符号の説明、１００……半導体装置、１０……
基板、１３……導体回路、１４……金属被膜層、
１７……半導体素子、２０……導体ピン、３０…
…キヤツプ、３１……接合部、３２……嵌合部、
４０……半田。
FIG. 1 is a perspective view of the completed semiconductor device according to the present invention, FIG. 2 is a perspective view of the cap before metal bonding, and FIG. 3 is an enlarged view taken along the line - in FIG. 4 and 5 are sectional views corresponding to FIG. 3 showing another embodiment of the present invention, and FIG. 6 is a sectional view showing a conventional technique. Explanation of symbols, 100...Semiconductor device, 10...
Substrate, 13... conductor circuit, 14... metal coating layer,
17...Semiconductor element, 20...Conductor pin, 30...
... Cap, 31 ... Joint part, 32 ... Fitting part,
40...Solder.
Claims (1)
搭載した半導体素子をキヤツプにより封止するよ
うにした半導体装置において、 前記半導体搭載用基板の外周縁部に前記半導体
素子用の導体回路と絶縁された金属被膜層をその
内部に閉空間を形成すべく設けるとともに、前記
キヤツプを金属によつて形成して、 このキヤツプの外周縁部を前記金属被膜層に金
属接合したことを特徴とする封止構造。 (2) 前記金属被膜層と前記キヤツプの金属接合
は、半田付け接合であることを特徴とする実用新
案登録請求の範囲第１項に記載の半導体装置にお
ける封止構造。 (3) 前記半導体搭載用基板は、ピングリツドア
レイであることを特徴とする実用新案登録請求の
範囲第１項または第２項のいずれかに記載の半導
体装置における封止構造。[Scope of Claim for Utility Model Registration] (1) In a semiconductor device in which a semiconductor element mounted on a semiconductor mounting substrate made of an organic material is sealed with a cap, the semiconductor mounting substrate has the above-mentioned structure on the outer periphery of the semiconductor mounting substrate. A metal coating layer insulated from the conductor circuit for the semiconductor element is provided to form a closed space therein, and the cap is made of metal, and the outer peripheral edge of the cap is attached to the metal coating layer. A sealed structure characterized by bonding. (2) The sealing structure in a semiconductor device according to claim 1, wherein the metal bonding between the metal coating layer and the cap is a soldering bond. (3) The sealing structure in a semiconductor device according to claim 1 or 2, wherein the semiconductor mounting substrate is a pin grid array.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18473785U JPH0341473Y2 (en) | 1985-11-30 | 1985-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18473785U JPH0341473Y2 (en) | 1985-11-30 | 1985-11-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6292648U true JPS6292648U (en) | 1987-06-13 |
| JPH0341473Y2 JPH0341473Y2 (en) | 1991-08-30 |
Family
ID=31132695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18473785U Expired JPH0341473Y2 (en) | 1985-11-30 | 1985-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0341473Y2 (en) |
-
1985
- 1985-11-30 JP JP18473785U patent/JPH0341473Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0341473Y2 (en) | 1991-08-30 |
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