JPS638605B2 - - Google Patents
Info
- Publication number
- JPS638605B2 JPS638605B2 JP19336382A JP19336382A JPS638605B2 JP S638605 B2 JPS638605 B2 JP S638605B2 JP 19336382 A JP19336382 A JP 19336382A JP 19336382 A JP19336382 A JP 19336382A JP S638605 B2 JPS638605 B2 JP S638605B2
- Authority
- JP
- Japan
- Prior art keywords
- metal
- ceramic body
- inner layer
- electrode
- molten metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 claims description 79
- 229910052751 metal Inorganic materials 0.000 claims description 79
- 239000000919 ceramic Substances 0.000 claims description 47
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 230000008018 melting Effects 0.000 claims description 8
- 238000002844 melting Methods 0.000 claims description 8
- 229910044991 metal oxide Inorganic materials 0.000 claims description 5
- 150000004706 metal oxides Chemical class 0.000 claims description 5
- 230000000052 comparative effect Effects 0.000 description 7
- 229910052763 palladium Inorganic materials 0.000 description 7
- 238000002347 injection Methods 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- 150000002739 metals Chemical class 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 229910052745 lead Inorganic materials 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 229910052718 tin Inorganic materials 0.000 description 4
- 229910020220 Pb—Sn Inorganic materials 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000011800 void material Substances 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- 229910002710 Au-Pd Inorganic materials 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000010970 precious metal Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229910020830 Sn-Bi Inorganic materials 0.000 description 1
- 229910018728 Sn—Bi Inorganic materials 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000011176 pooling Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Ceramic Capacitors (AREA)
- Thermistors And Varistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19336382A JPS5984413A (ja) | 1982-11-05 | 1982-11-05 | セラミツク電子部品 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19336382A JPS5984413A (ja) | 1982-11-05 | 1982-11-05 | セラミツク電子部品 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5984413A JPS5984413A (ja) | 1984-05-16 |
| JPS638605B2 true JPS638605B2 (enrdf_load_stackoverflow) | 1988-02-23 |
Family
ID=16306660
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19336382A Granted JPS5984413A (ja) | 1982-11-05 | 1982-11-05 | セラミツク電子部品 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5984413A (enrdf_load_stackoverflow) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0727803B2 (ja) * | 1985-11-20 | 1995-03-29 | 松下電器産業株式会社 | 積層型チツプバリスタの電極処理方法 |
| JPS62137805A (ja) * | 1985-12-12 | 1987-06-20 | 株式会社村田製作所 | 負特性積層チップ型サーミスタ |
| JPS62137804A (ja) * | 1985-12-12 | 1987-06-20 | 株式会社村田製作所 | 負特性積層チップ型サーミスタ |
| JPS63119227U (enrdf_load_stackoverflow) * | 1987-01-29 | 1988-08-02 |
-
1982
- 1982-11-05 JP JP19336382A patent/JPS5984413A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5984413A (ja) | 1984-05-16 |