JPS637029B2 - - Google Patents

Info

Publication number
JPS637029B2
JPS637029B2 JP57153687A JP15368782A JPS637029B2 JP S637029 B2 JPS637029 B2 JP S637029B2 JP 57153687 A JP57153687 A JP 57153687A JP 15368782 A JP15368782 A JP 15368782A JP S637029 B2 JPS637029 B2 JP S637029B2
Authority
JP
Japan
Prior art keywords
electrode
glass
diode
diameter part
large diameter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57153687A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5943558A (ja
Inventor
Kazunao Kudo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP15368782A priority Critical patent/JPS5943558A/ja
Publication of JPS5943558A publication Critical patent/JPS5943558A/ja
Publication of JPS637029B2 publication Critical patent/JPS637029B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP15368782A 1982-09-02 1982-09-02 ダイオ−ド電極部品 Granted JPS5943558A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15368782A JPS5943558A (ja) 1982-09-02 1982-09-02 ダイオ−ド電極部品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15368782A JPS5943558A (ja) 1982-09-02 1982-09-02 ダイオ−ド電極部品

Publications (2)

Publication Number Publication Date
JPS5943558A JPS5943558A (ja) 1984-03-10
JPS637029B2 true JPS637029B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1988-02-15

Family

ID=15567947

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15368782A Granted JPS5943558A (ja) 1982-09-02 1982-09-02 ダイオ−ド電極部品

Country Status (1)

Country Link
JP (1) JPS5943558A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6071148U (ja) * 1983-10-24 1985-05-20 ローム株式会社 ダイオ−ド
JPS61129849A (ja) * 1984-11-28 1986-06-17 Toshiba Corp リ−ドレス半導体装置
JPS61182040U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1985-04-30 1986-11-13
JPS6355549U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1986-09-29 1988-04-14
US5248902A (en) * 1991-08-30 1993-09-28 General Instrument Corporation Surface mounting diode
SG107595A1 (en) 2002-06-18 2004-12-29 Micron Technology Inc Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assembles and packages including such semiconductor devices or packages and associated methods

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5828859A (ja) * 1981-08-13 1983-02-19 Matsushita Electronics Corp リ−ドレスガラス封止ダイオ−ド
JPS5869953A (ja) * 1981-10-21 1983-04-26 株式会社　平井技研 屋根側部装置
JPS58168269A (ja) * 1982-03-29 1983-10-04 Nec Home Electronics Ltd リ−ドレスダイオ−ド

Also Published As

Publication number Publication date
JPS5943558A (ja) 1984-03-10

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